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TGH960

DFI TGH960 Intel Tiger Lake iCore / Xeon Com Express Basic Module

DFI Intel Tiger Lake Com Express Module – i3 / i5 / i7 / Xeon – 1 PCIe x16, 8 PCIe x1, 1 LPC, 1 I2C, 1 SMBus, 1 Intel 2.5GbE, 4 USB 3.2 Gen2, 8 USB 2.0

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SKU: TGH960 Category: Tags: , , , , , , , , , , , ,

Description

  • 11th Generation Intel® Processor COM Express® Basic
  • DDR4 3200MHz SODIMM up to 128GB
  • VGA + LVDS*/eDP + 3 DDI
  • DP++ supports 4K resolution
  • Multiple expansion: 1 PCIe x16, 8 PCIe x1, 1 LPC, 1 I2C, 1 SMBus
  • Rich I/O: 1 Intel 2.5GbE, 4 USB 3.2 Gen2, 8 USB 2.0
  • 15-Year CPU Life Cycle Support Until Q2′ 36 (Based on Intel IOTG Roadmap)

Specification

System
Processor
11th Gen Intel® Core™ Processors, BGA 1787
Intel® Xeon® W-11865MRE, 8 Cores, 24M Cache, 2.6GHz (4.7GHz), 45W (RM590E)
Intel® Xeon® W-11865MLE, 8 Cores, 24M Cache, 1.5GHz (4.5GHz), 25W (RM590E)
Intel® Core™ i7-11850HE, 8 Cores, 24M Cache, 2.6GHz (4.7GHz), 45W (RM590E/QM580E)
Intel® Xeon® W-11555MRE, 6 Cores, 12M Cache, 2.6GHz (4.5GHz), 45W (RM590E)
Intel® Xeon® W-11555MLE, 6 Cores, 12M Cache, 1.9GHz (4.4Hz), 25W (RM590E)
Intel® Core™ i5-11500HE, 6 Cores, 12M Cache, 2.6GHz (4.5GHz), 45W (RM590E/QM580E)
Intel® Xeon® W-11155MRE, 4 Cores, 8M Cache, 2.4GHz (4.4GHz), 45W (RM590E)
Intel® Xeon® W-11155MLE, 4 Cores, 8M Cache, 1.8GHz (3.1GHz), 25W (RM590E)
Intel® Core™ i3-1100HE, 4 Cores, 8M Cache, 2.4GHz (4.4GHz), 45W (RM590E/QM580E/HM570E)
Intel® Celeron® 6600HE, 2 Cores, 8M Cache, 2.6GHz, 35W (RM590E/QM580E/HM570E)
Chipset
Intel® RM590E/QM580E/HM570E Chipset
Memory
Four 260-pin SODIMM up to 128GB
Dual Channel DDR4 3200MHz
BIOS
AMI SPI 256Mbit

Graphics
Controller
Intel® Iris® Xe Graphics
Feature
OpenGL 4.5, DirectX 12, OpenCL 2.1
HW Decode: MPEG2, WMV9, AVC/H264, JPEG/MJPEG, HEVC/H265, VP9, AV1
HW Encode: AVC/H264, JPEG, HEVC/H265, VP9
Display
1 x VGA
1 x LVDS/eDP (eDP available upon request)
3 x DDI (HDMI/DP++)
Multiple Display
VGA + LVDS + 2 DDI or
VGA + 3 DDI or
LVDS + 3 DDI

Storage
SSD
(Option)
NVMe SSD:
PCIe x4 Gen4, 64GB~1TB
SSD and 2nd DDR4 SO-DIMM(DIMM2) is alternative function.

Expansion
Interface
1 x PCIe x16 (Gen 4)
8 x PCIe x1 (Gen 3)
1 x LPC
1 x I2C
1 x SMBus
2 x UART (TX/RX)

Audio
Audio Codec
HD Audio

Ethernet
PHY
1 x Intel® I225 series (10/100/1000Mbps/2.5G)

I/O
USB
4 x USB 3.2 Gen2
8 x USB 2.0
SATA
4 x SATA 3.0 (up to 6Gb/s)
support RAID 0/1/5/10
DIO
1 x 8-bit DIO (Default 4 inputs and 4 outputs)

Watchdog Timer
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds

Security
TPM
TPM2.0 (Available Upon Request)

Power
Type
8.5V~20V, 5VSB, VCC_RTC (ATX mode)
8.5V~20V, VCC_RTC (AT mode)
Consumption
TBD

OS Support
Microsoft
Windows 10 IoT Enterprise 64-bit
Linux
Ubuntu 20.04

Environment
Temperature
Operating: 0 to 60°C, -40 to 85°C
Storage: -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
TBD

Mechanism
Dimensions
COM Express® Basic
95mm (3.74″) x 125mm (4.9″)
Compliance
PICMG COM Express® R3.0, Type 6

Country of Origin
Country of Origin
Taiwan

Datasheet

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If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can design a new product from start to finish.

 

Design | Develop | Test | Manufacture

Here’s a selection of our design, manufacturing

& associated services: –

 

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a brand-new product from scratch or working with an existing prototype.DesignToOrder

Build to Order: Embedded Computer Design and Customisation Services​

Take an existing system and we can:BuildToOrder

  • Custom specification (CPU, Ram, I/O, Storage)
  • Chassis customisation and branding
  • Custom BIOS
  • Software – Custom OS Image
  • Custom Packaging and branding
  • Integrating newly designed or existing hardware into a larger system

Build to order Racks and Towers, Peli Case PCs and Mini-ITX PCs

Embedded Software Services : Configuration, Integration and Deployment

Porting, Integration & DeploymentEmbeddedSoftware

  • Windows image capture from customers HDD
  • Linux image capture from customers HDD
  • Windows / Linux Deployment from customers image
  • Custom Windows images, create and deploy
  • Update management
  • Custom Linux and Android images?
  • Custom BIOS

Manufacturer : DFI

Motherboard

  • Form Factor : Com Express

CPU

  • Powered By : Intel
  • CPU Family : iCore, Xeon
  • CPU Generation : Tiger Lake
  • CPU Model : 6600HE, i3-1100HE, i5-11500HE, i7-11850HE, W-11155MLE, W-11155MRE, W-11555MLE, W-11555MRE, W-11865MLE, W-11865MRE
  • CPU Speed :
  • CPU Cores : 6 Cores, 8 Cores, Dual Core, Quad Core

Memory

  • Memory Installed :
  • Memory Slots : 4
  • Memory Type : 3200Mhz DDR4

I/O and Expansion

  • Expansion Slots : NVMe, PCIe, SATA
  • LAN Ports : 1
  • Serial Ports :
  • USB 2 Ports : 8
  • USB 3 Ports :
  • USB 3.1 Ports : 4
  • Video Output : DDI, LVDS, VGA
  • Multi Display : Triple Display
  • Wireless Connectivity :

Operating System

  • OS : Linux, Windows

Certifications

  • Certifications :

Industry

  • Industry :

Features

  • 24/7 Use :
  • 4G-GPS :
  • Artificial Intelligence Use :
  • ATEX :
  • High Performance :
  • Industrial :
  • In-Vehicle :
  • IoT :
  • IP Rating :
  • Low Powered :
  • Mini-ITX :
  • Multi Displays : Triple
  • NUC :
  • Other Features : GPIO
  • PoE :
  • Rugged :
  • Ryzen :
  • System Type : COM
  • Touchscreen :
  • Whiskey Lake :
  • Wide Temp :

Categories :

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