DFI TGH960 Intel Tiger Lake iCore / Xeon Com Express Basic Module

• DFI TGH960 Intel Tiger Lake iCore / Xeon Com Express Basic Module
• 11th Generation Intel® Processor COM Express® Basic
• DDR4 3200MHz SODIMM up to 128GB
• VGA + LVDS*/eDP + 3 DDI
• DP++ supports 4K resolution
• Multiple expansion: 1 PCIe x16, 8 PCIe x1, 1 LPC, 1 I2C, 1 SMBus
• Rich I/O: 1 Intel 2.5GbE, 4 USB 3.2 Gen2, 8 USB 2.0
• 15-Year CPU Life Cycle Support Until Q2′ 36 (Based on Intel IOTG Roadmap)

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Description

  • 11th Generation Intel® Processor COM Express® Basic
  • DDR4 3200MHz SODIMM up to 128GB
  • VGA + LVDS*/eDP + 3 DDI
  • DP++ supports 4K resolution
  • Multiple expansion: 1 PCIe x16, 8 PCIe x1, 1 LPC, 1 I2C, 1 SMBus
  • Rich I/O: 1 Intel 2.5GbE, 4 USB 3.2 Gen2, 8 USB 2.0
  • 15-Year CPU Life Cycle Support Until Q2′ 36 (Based on Intel IOTG Roadmap)

Specification

System

Processor
11th Gen Intel® Core™ Processors, BGA 1787
Intel® Xeon® W-11865MRE, 8 Cores, 24M Cache, 2.6GHz (4.7GHz), 45W (RM590E)
Intel® Xeon® W-11865MLE, 8 Cores, 24M Cache, 1.5GHz (4.5GHz), 25W (RM590E)
Intel® Core™ i7-11850HE, 8 Cores, 24M Cache, 2.6GHz (4.7GHz), 45W (RM590E/QM580E)
Intel® Xeon® W-11555MRE, 6 Cores, 12M Cache, 2.6GHz (4.5GHz), 45W (RM590E)
Intel® Xeon® W-11555MLE, 6 Cores, 12M Cache, 1.9GHz (4.4Hz), 25W (RM590E)
Intel® Core™ i5-11500HE, 6 Cores, 12M Cache, 2.6GHz (4.5GHz), 45W (RM590E/QM580E)
Intel® Xeon® W-11155MRE, 4 Cores, 8M Cache, 2.4GHz (4.4GHz), 45W (RM590E)
Intel® Xeon® W-11155MLE, 4 Cores, 8M Cache, 1.8GHz (3.1GHz), 25W (RM590E)
Intel® Core™ i3-1100HE, 4 Cores, 8M Cache, 2.4GHz (4.4GHz), 45W (RM590E/QM580E/HM570E)
Intel® Celeron® 6600HE, 2 Cores, 8M Cache, 2.6GHz, 35W (RM590E/QM580E/HM570E)
Chipset
Intel® RM590E/QM580E/HM570E Chipset
Memory
Four 260-pin SODIMM up to 128GB
Dual Channel DDR4 3200MHz
BIOS
AMI SPI 256Mbit

Graphics

Controller
Intel® Iris® Xe Graphics
Feature
OpenGL 4.5, DirectX 12, OpenCL 2.1
HW Decode: MPEG2, WMV9, AVC/H264, JPEG/MJPEG, HEVC/H265, VP9, AV1
HW Encode: AVC/H264, JPEG, HEVC/H265, VP9
Display
1 x VGA
1 x LVDS/eDP (eDP available upon request)
3 x DDI (HDMI/DP++)
Multiple Display
VGA + LVDS + 2 DDI or
VGA + 3 DDI or
LVDS + 3 DDI

Storage

SSD
(Option)
NVMe SSD:
PCIe x4 Gen4, 64GB~1TB
SSD and 2nd DDR4 SO-DIMM(DIMM2) is alternative function.

Expansion

Interface
1 x PCIe x16 (Gen 4)
8 x PCIe x1 (Gen 3)
1 x LPC
1 x I2C
1 x SMBus
2 x UART (TX/RX)

Audio

Audio Codec
HD Audio

Ethernet

PHY
1 x Intel® I225 series (10/100/1000Mbps/2.5G)

I/O

USB
4 x USB 3.2 Gen2
8 x USB 2.0
SATA
4 x SATA 3.0 (up to 6Gb/s)
support RAID 0/1/5/10
DIO
1 x 8-bit DIO (Default 4 inputs and 4 outputs)

Watchdog Timer

Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds

Security

TPM
TPM2.0 (Available Upon Request)

Power

Type
8.5V~20V, 5VSB, VCC_RTC (ATX mode)
8.5V~20V, VCC_RTC (AT mode)
Consumption
TBD

OS Support

Microsoft
Windows 10 IoT Enterprise 64-bit
Linux
Ubuntu 20.04

Environment

Temperature
Operating: 0 to 60°C, -40 to 85°C
Storage: -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
TBD

Mechanism

Dimensions
COM Express® Basic
95mm (3.74″) x 125mm (4.9″)
Compliance
PICMG COM Express® R3.0, Type 6

Country of Origin

Country of Origin
Taiwan

Datasheet

Download

BVM Customisation Service

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish.

 

If you’re unable to find an off-the-shelf product that meets your specific requirements, don’t hesitate to contact our in-house design team. They possess the expertise to customise an existing product to your exact specifications or embark on a fresh design journey to create a customized solution tailored to your requirements.

Our design professionals are dedicated to delivering exceptional results, ensuring that the final product not only meets but exceeds your expectations. When you collaborate with our team, you open the door to a world of possibilities, where innovation and creativity converge to bring your vision to life.

Whether it’s modifying an existing product or crafting an entirely new one, our design experts are committed to providing you with a comprehensive, end-to-end solution that perfectly suits your needs. Your satisfaction is our top priority, and we’re here to turn your ideas into reality.

 

Design | Develop | Test | Manufacture

With over three decades of experience in designing custom industrial and embedded computer and display solutions across a wide array of industries, we’re here to turn your ideas into reality

 

Here’s a selection of our design, manufacturing & associated services: –

Design to Order Banner

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a brand-new product from scratch or working with an existing prototype.

Build to Order Banner

Build to Order: Embedded Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

Embedded Software Banner

Embedded Software Services : Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

Manufacturer : DFI

Motherboard

  • Form Factor :

CPU

  • Powered By : Intel
  • CPU Family : iCore, Xeon
  • CPU Generation : Tiger Lake
  • CPU Model : 6600HE, i3-1100HE, i5-11500HE, i7-11850HE, W-11155MLE, W-11155MRE, W-11555MLE, W-11555MRE, W-11865MLE, W-11865MRE
  • CPU Speed :
  • CPU Cores : 6 Cores, 8 Cores, Dual Core, Quad Core

Memory

  • Memory Installed :
  • Memory Slots : 4
  • Memory Type : 3200Mhz DDR4

I/O and Expansion

  • Expansion Slots : NVMe, PCIe, SATA
  • LAN Ports : 1
  • Serial Ports :
  • USB 2 Ports : 8
  • USB 3 Ports :
  • USB 3.1 Ports : 4
  • Video Output : DDI, LVDS, VGA
  • Multi Display : Triple Display
  • Wireless Connectivity :

Operating System

  • OS : Linux, Windows

Certifications

  • Certifications :

Industry

  • Industry :

Features

  • 24/7 Use :
  • 4G-GPS :
  • Artificial Intelligence Use :
  • ATEX :
  • High Performance :
  • Industrial :
  • In-Vehicle :
  • IoT :
  • IP Rating :
  • Low Powered :
  • Mini-ITX :
  • Multi Displays : Triple
  • NUC :
  • Other Features : GPIO
  • PoE :
  • Rugged :
  • Ryzen :
  • System Type : Computer-On-Module
  • Touchscreen :
  • Whiskey Lake :
  • Wide Temp :

Categories :