DFI TGH960 Intel Tiger Lake iCore / Xeon Com Express Basic Module

  • Product Name: DFI TGH960
  • Module Form Factor: Intel Tiger Lake iCore / Xeon Com Express Basic Module
  • CPU: 11th Generation Intel Processor COM Express Basic
  • RAM: DDR4 3200MHz SODIMM up to 128GB
  • Expansion: Multiple expansion: 1 PCIe x16, 8 PCIe x1, 1 LPC, 1 I2C, 1 SMBus
  • Other features: VGA + LVDS*/eDP + 3 DDI, DP++ supports 4K resolution, Rich I/O: 1 Intel 2.5GbE, 4 USB 3.2 Gen2, 8 USB 2.0, 15-Year CPU Life Cycle Support Until Q2′ 36 (Based on Intel IOTG Roadmap)

Description

TGH960 – DFI provides off-the-shelf and reliable System-On-Modules that include COM Express Mini, COM Express Compact and COM Express Basic, based on Intel, AMD, and ARM latest platforms. In addition, DFI’s value-added design-in services help fast customization for various embedded computing solutions.

Key Features

  • 11th Generation Intel® Processor COM Express® Basic
  • DDR4 3200MHz SODIMM up to 128GB
  • VGA + LVDS*/eDP + 3 DDI
  • DP++ supports 4K resolution
  • Multiple expansion: 1 PCIe x16, 8 PCIe x1, 1 LPC, 1 I2C, 1 SMBus
  • Rich I/O: 1 Intel 2.5GbE, 4 USB 3.2 Gen2, 8 USB 2.0
  • 15-Year CPU Life Cycle Support Until Q2′ 36 (Based on Intel IOTG Roadmap)

TGH960 Specification

System

Processor
11th Gen Intel® Core™ Processors, BGA 1787
Intel® Xeon® W-11865MRE, 8 Cores, 24M Cache, 2.6GHz (4.7GHz), 45W (RM590E)
Intel® Xeon® W-11865MLE, 8 Cores, 24M Cache, 1.5GHz (4.5GHz), 25W (RM590E)
Intel® Core™ i7-11850HE, 8 Cores, 24M Cache, 2.6GHz (4.7GHz), 45W (RM590E/QM580E)
Intel® Xeon® W-11555MRE, 6 Cores, 12M Cache, 2.6GHz (4.5GHz), 45W (RM590E)
Intel® Xeon® W-11555MLE, 6 Cores, 12M Cache, 1.9GHz (4.4Hz), 25W (RM590E)
Intel® Core™ i5-11500HE, 6 Cores, 12M Cache, 2.6GHz (4.5GHz), 45W (RM590E/QM580E)
Intel® Xeon® W-11155MRE, 4 Cores, 8M Cache, 2.4GHz (4.4GHz), 45W (RM590E)
Intel® Xeon® W-11155MLE, 4 Cores, 8M Cache, 1.8GHz (3.1GHz), 25W (RM590E)
Intel® Core™ i3-1100HE, 4 Cores, 8M Cache, 2.4GHz (4.4GHz), 45W (RM590E/QM580E/HM570E)
Intel® Celeron® 6600HE, 2 Cores, 8M Cache, 2.6GHz, 35W (RM590E/QM580E/HM570E)
Chipset
Intel® RM590E/QM580E/HM570E Chipset
Memory
Four 260-pin SODIMM up to 128GB
Dual Channel DDR4 3200MHz
BIOS
AMI SPI 256Mbit

Graphics

Controller
Intel® Iris® Xe Graphics
Feature
OpenGL 4.5, DirectX 12, OpenCL 2.1
HW Decode: MPEG2, WMV9, AVC/H264, JPEG/MJPEG, HEVC/H265, VP9, AV1
HW Encode: AVC/H264, JPEG, HEVC/H265, VP9
Display
1 x VGA
1 x LVDS/eDP (eDP available upon request)
3 x DDI (HDMI/DP++)
Multiple Display
VGA + LVDS + 2 DDI or
VGA + 3 DDI or
LVDS + 3 DDI

Storage

SSD
(Option)
NVMe SSD:
PCIe x4 Gen4, 64GB~1TB
SSD and 2nd DDR4 SO-DIMM(DIMM2) is alternative function.

Expansion

Interface
1 x PCIe x16 (Gen 4)
8 x PCIe x1 (Gen 3)
1 x LPC
1 x I2C
1 x SMBus
2 x UART (TX/RX)

Audio

Audio Codec
HD Audio

Ethernet

PHY
1 x Intel® I225 series (10/100/1000Mbps/2.5G)

I/O

USB
4 x USB 3.2 Gen2
8 x USB 2.0
SATA
4 x SATA 3.0 (up to 6Gb/s)
support RAID 0/1/5/10
DIO
1 x 8-bit DIO (Default 4 inputs and 4 outputs)

Watchdog Timer

Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds

Security

TPM
TPM2.0 (Available Upon Request)

Power

Type
8.5V~20V, 5VSB, VCC_RTC (ATX mode)
8.5V~20V, VCC_RTC (AT mode)
Consumption
TBD

OS Support

Microsoft
Windows 10 IoT Enterprise 64-bit
Linux
Ubuntu 20.04

Environment

Temperature
Operating: 0 to 60°C, -40 to 85°C
Storage: -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
TBD

Mechanism

Dimensions
COM Express® Basic
95mm (3.74″) x 125mm (4.9″)
Compliance
PICMG COM Express® R3.0, Type 6

Country of Origin

Country of Origin
Taiwan

 

BVM Custom Carrier Board Design Service:

If you cant find an “off the shelf” carrier board that meets your requirements speak with our in house design team who can customize an existing board or design a new one.

Click here to find out more.

BVM Customisation Service
Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

Here’s a selection of our design, manufacturing & associated services: –

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Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

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Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs, Panel PCs and Mini-ITX PCs

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Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

  • Windows image capture from customers HDD
  • Linux image capture from customers HDD
  • Android image capture from customers HDD
  • Windows / Linux Deployment from customers image
  • Custom Windows images, create and deploy
  • Update management
  • Custom Linux and Android images
  • Custom BIOS

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

Click here to find out more.

BVM Custom Carrier Board Design Service:

If you cant find an “off the shelf” carrier board that meets your requirements speak with our in house design team who can customize an existing board or design a new one.

If you’re unable to find an off-the-shelf carrier board that meets your specific requirements, don’t hesitate to contact our in-house design team. They possess the expertise to customise an existing carrier board to your exact specifications or embark on a fresh design journey to create a customized solution tailored to your requirements. Our design professionals are dedicated to delivering exceptional results, ensuring that the carrier board not only meets but exceeds your expectations. When you collaborate with our team, you open the door to a world of possibilities, where innovation and creativity converge to bring your vision to life.

Whether it’s modifying an existing carrier board or crafting an entirely new one, our design experts are committed to providing you with a comprehensive, end-to-end solution that perfectly suits your needs. Your satisfaction is our top priority, and we’re here to turn your ideas into reality.

Custom Carrier Board 1

Custom Carrier Board & PCB Design Services

BVM has been designing custom carrier boards and embedded electronics for over 30 years, delivering reliable solutions from concept through to production. Our experience spans legacy 16-bit systems to today’s high-speed PCIe, x86, and ARM-based platforms. Whether you’re developing with COM Express, SMARC, Qseven, OSM, NVIDIA Jetson, Raspberry Pi, BeagleBone, Arduino, or another embedded platform, we can design a custom carrier board tailored to your application and ready for long-term deployment.

Our UK-based engineering team provides complete PCB design, prototyping, and manufacturing services, including:

  • Custom Carrier Board & PCB Design – Tailored carrier boards designed to meet your exact performance, connectivity, and environmental requirements.
  • Electronic Component Selection & Procurement – Expert sourcing of reliable, long-life components to ensure availability, quality, and cost-effectiveness.
  • PCB Assembly & Manufacturing – Complete prototype and production PCB assembly using high-quality manufacturing processes and rigorous quality control.
  • Cable & Wiring Harness Design & Assembly – Custom cable assemblies and wiring harnesses designed for reliable integration and simplified installation.
  • Potting, Encapsulation & Thermal Protection – Protective solutions that improve durability, environmental resistance, and thermal performance in demanding applications.
  • Product Configuration, Testing & Custom Test Rig Design – Comprehensive product configuration and validation, including bespoke test fixtures for efficient manufacturing.
  • Bespoke Production Test Software – Custom software developed to automate testing, verify functionality, and streamline production processes.

From prototype to volume production, BVM ensures your carrier board is designed for reliability, manufacturability, and long-term success.

Click here to find out more.