Industrial Computers | Embedded Systems | Boards & Modules
Showing 621–640 of 826 results
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DFI GHF51 1.8″ AMD Ryzen SBC – Industrial Pi – Dev Kit
- Product Name: DFI GHF51-R1102G
- Motherboard Form Factor: 1.8″ SBC
- CPU: AMD Ryzen Embedded R1000 Series
- RAM: Single Channel DDR4 Memory Down up to 4GB/8GB
- Expansion: Expansion and Storage: 1 Mini PCIe, 1 SMBus
- Other features: Small form factor for space-limited applications, HDMI 1.4 resolution supports up to 4096×2160 @ 24Hz, Rich I/O: 1 Intel GbE, 1 USB 3.1 Gen 2, 2 Micro HDMI, 10-Year CPU Life Cycle Support Until Q1’30 (Based on AMD Roadmap)
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DFI EC510-CS/EC511-CS 8th/9th Gen 5G Fanless Industrial Computer
- Product Name: DFI EC510-CS/EC511-CS
- System Type: Fanless Embedded System
- CPU: 8th/9th Gen Intel Core
- RAM: Supports DDR4 SODIMM up to 64GB
- Expansion: 1 PCIe and 3 M.2 slots support NVMe
- Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Support 4 PoE (EC51x-CS6G86E-Q), Support 5G Communication, Operating Temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
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DFI EC543-CS 8th/9th Gen 5G Fanless Industrial Computer
- Product Name: DFI EC543-CS
- System Type: Fanless Embedded System
- CPU: 8th/9th Gen Intel Core
- RAM: Supports DDR4 SODIMM up to 64GB
- Expansion: 3 PCIe, 1 PCI, and 3 M.2 slots support NVMe
- Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Support 4 PoE (EC543-CS6G86E-Q configuration), Support 5G communication, Operating temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
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DFI EC500-CS 8th/9th Gen 5G Fanless Embedded System
- Product Name: DFI EC500-CS
- System Type: Fanless Embedded System
- CPU: 8th/9th Gen Intel Core
- RAM: Supports DDR4 SODIMM up to 64GB
- Expansion: 3 M.2 slots support NVMe
- Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Rich I/O connectivity: 2 GbE, 4 COM, 4 USB 3.1, 2 USB 2.0 (Q370 only), Support 5G Communication, Operating Temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
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Wincomm WMP-24H_MXM 23.8″ MXM Medical Panel PC
- Product Name: Wincomm WMP-24H_MXM
- Screen Size: 23.8″
- CPU: Intel 7th generation Core i7/i5/i3/Celeron
- RAM: Two 2133 MHz DDR4 SODIMM socket support dual Channel, non-ECC, up to 32GB
- Expansion: MXM 3.0 Module by Project Support, M.2 type SATA SSD
- Other features: Highest Level EMC 4.0/ Safety 3.1 Certification Ready, Integrated Hot-Swappable Batteries, 24/7 Run-Time, Support Intel vPro by Optional i7/i5 CPU, Support i-Control Management for Power /Thermal /Battery, FHD Capture Card as Option, Low Noise Smart Fan Solution
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DFI EC90A-GH AMD Ryzen Ultra Compact Fanless Embedded System
- Product Name: DFI EC90A-GH
- System Type: Ultra Small Mini PC Fanless Embedded System
- CPU: AMD Ryzen Embedded R1000 Series
- RAM: DDR4 2400 MHz SODIMM down up to 4GB/8GB (memory onboard)
- Expansion: 1 x Mini-PCIe (PCIe signal)
- Other features: Ultra Small Size: 110 x 80mm x 60mm (W x H x D), User-friendly design for installing SIM card, I/O: 1 Intel GbE, 1 USB 3.1 Gen 2, 2 Micro HDMI, 10-Year CPU Life Cycle Support Until Q1’30 (Based on AMD Roadmap)
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DFI ECX700-ADP 12th Gen Outdoor Ruggedized IPC67 Mini PC
- Product Name: DFI ECX700-ADP
- System Type: Outdoor Ruggedized IPC67 Box PC
- CPU: Intel Alder Lake-P Processor i5-1245UE / i7-1265UE
- RAM: Supports DDR4 memory
- Expansion: Multiple I/O interfaces for versatile connectivity
- Other Features: IP67-rated waterproof and dustproof design, extreme ruggedization to IEC 60068-2-64, wide operating temperature range (-20 to 70°C)
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DFI ECX700-AL Outdoor Ruggedized IPC67 Grade Box PC
- Product Name: DFI ECX700-AL
- System Type: Ruggedized Outdoor IoT IP67 Fanless Embedded System
- CPU: Intel Atom Processor E3900 Series
- RAM: 4GB DDR3 onboard, 64G eMMC
- Expansion: 1 x Full-size Mini PCIe for 4G LTE module, 1 x Full-size Mini PCIe for Canbus, 1 x M.2 2230 (USB2.0/PCIe) for WiFi module
- Other features: Ruggedized IPC67 Grade Box PC, Outdoor IoT Gateway Application, Operating temperature: -40° to 70° C, 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap)
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Wincomm WMP-22G 21.5″ Medical Cart Panel PC
- Product Name: Wincomm WMP-22G
- Screen Size: 21.5″
- CPU: Kabylake 7th generation Intel Core i7/i5/i3/Celeron (15W max.)
- RAM: Two 2133 MHz DDR4 SODIMM socket support dual Channel, non-ECC, up to 32GB
- Expansion: M.2 type SATA SSD
- Other features: EMC 4.0/ Safety 3.1 certification ready, Integrated hot-swappable batteries, 24/7 run-time, Support Intel vPro technology by CPU, Support remote monitor / control / device update sw, FHD capture card as option
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Wincomm WMP-22H_MXM 21.5″ MXM Medical Panel PC
- Product Name: Wincomm WMP-22H_MXM
- Screen Size: 21.5″
- CPU: Kabylake 7th generation Intel Core i7/i5/i3/Celeron processor (15W max.)
- RAM: Two 2133 MHz DDR4 SODIMM socket support dual Channel, non-ECC, up to 32GB
- Expansion: MXM 3.0 Module by Project Support, M.2 type SATA SSD
- Other features: Highest Level EMC 4.0/ Safety 3.1 Certification Ready, Integrated Hot-Swappable Batteries, 24/7 Run-Time, Support Intel vPro by Optional i7/i5 CPU, Support i-Control Management for Power /Thermal /Battery, FHD Capture Card as Option, Low Noise Smart Fan Solution
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DFI EC100-XNX NVIDIA Jetson Xavier NX PoE Embedded System
- Product Name: DFI EC100-XNX
- System Type: Industrial PC
- CPU: NVIDIA Jetson Xavier NX
- RAM: 8Gb
- Expansion: 20 pins with 1 x UART, 2 x I2C, 9 x GPIOs
- Other features: Fully supports NVIDIA Jetson Xavier NX, 8 x 10/100 MbE with PoE, Fanless chassis technology, 1 x HDMI 2.0a/b Type-A supports 4K@60Hz
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BVM Industrial 1U 19″ Rack Mount Chassis – CHASSIS-RM201
• BVM – CHASSIS-RM201 – Industrial 1U 19″ Rack Mount Chassis | Rack Mount PC Computer Systems
• Rugged design to meet most applications.
• Front ventilation for superior cooling.
• Front Access Dual USB Port for software maintenance.
• 1 x Blower fan for CPU Cooling
• Short depth design for space critical applications
• Equipped with 250watt PSU -
BVM Industrial 2U 19″ Rack Mount iCore or Celeron – SYS-RM202
• BVM – SYS-RM202 – Industrial 2U 19″ Rack Mount iCore or Celeron System | Rack Mount PC Computer Systems
• High performance 2U rack mount system
• Choice of microATX motherboards
• Choice of iCore or Celeron CPU
• User specified SSD or HDD (up to 4 drives)
• High reliability 460 Watt PS/2 style PSU
• Efficient cooling with easy change, washable front access filters -
BVM Industrial 4U 19″ Rack Mount iCore or Celeron- SYS-RM204
• BVM – SYS-RM204 – Industrial 4U 19″ Rack Mount iCore or Celeron System | Rack Mount PC Computer Systems
• High performance 4U rack mount system
• Choice of microATX or ATX
• Choice of iCore or Celeron CPU
• User specified SSD or HDD (up to 8 drives)
• High reliability 460/600 Watt PSU
• Efficient cooling with easy change, washable front access filters -
BVM Design Services – Custom Industrial Racks
BVM – Custom_Industrial_Computer – Design and integration services – Custom Rack | Rack Mount PC Computer Systems
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APLEX APC-3072 7″ Fanless IP66 E3845 Vehicle Management Panel PC
- Product Name: Aplex APC-3072
- Screen Size: 7″
- CPU: Intel Atom Processor E3845
- RAM: 4GB DDR3L Memory onboard
- Expansion: 1 x Mini-PCIe full size for option 3G/LTE/GPS, 1 x Mini-PCIe half size slot for option WIFI/BT, 1 x SIM slot onboard, 1 x SMA connector for option GPS antenna
- Other features: High Brightness LED Backlight LCD, Rugged Engineering Plastics Enclosure and Fanless Design, 6~36V DC Wide-ranging Power Input, HDD/SSD: 1 x Micro SD onboard, 1 x mSATA MO-300 slot
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APLEX APC-3082 8″ Fanless IP66 E3845 Vehicle Management Panel PC
- Product Name: Aplex APC-3082
- Screen Size: 8″
- CPU: Intel Atom Processor E3845
- RAM: 4GB DDR3L Memory onboard
- Expansion: 1 x Mini-PCIe full size for option 3G/LTE/GPS, 1 x Mini-PCIe half size slot for option WIFI/BT, 1 x SIM slot onboard, 1 x SMA connector for option GPS antenna
- Other features: High Brightness LED Backlight LCD, Rugged Engineering Plastics Enclosure and Fanless Design, 6~36V DC Wide-ranging Power Input, HDD/SSD: 1 x Micro SD onboard, 1 x mSATA MO-300 slot
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DFI AL553 Intel Atom E3900 3.5″ SBC
- Product Name: DFI AL553
- Motherboard Form Factor: 3.5″ SBC
- CPU: Intel Atom E3900
- RAM: 1 DDR3L SODIMM up to 8GB
- Expansion: Three independent displays: VGA + LVDS + HDMI; Multiple expansion: 1 M.2 B Key, 1 M.2 E Key, Mini PCIe
- Other features: Rich I/O: 2 Intel GbE, 1 COM, 2 USB 3.1 Gen1, 4 USB 2.0; 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap)
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ASRock Industrial NUC-1185G7E 11th Gen Tiger Lake Edge AI NUC SBC
- Product Name: ASRock Industrial NUC-1185G7E Edge AI NUC SBC
- Motherboard Form Factor: NUC
- CPU: Intel 11th Gen (Tiger Lake-UP3) Core Processors
- RAM: 2 x 260-pin SO-DIMM DDR4 3200 MHz, up to 64GB
- Expansion: 6 x USB 3.2 Gen2, 2 x USB 2.0, 1 x M.2 Key M, 1 x M.2 Key E, 1 x COM, 1 x SATA3
- Other features: 1 x Intel 1 Gigabit LAN, 1 x Intel 2.5 Gigabit LAN, Supports Quad display, 1 x HDMI 2.0a, 3 x DP 1.4 (2 from Type-C), TPM onboard, 12V~19V DC-In
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Commell LE-37O Tiger Lake Celeron 3.5″ SBC
- Product Name: Commell LE-37O
- Motherboard Form Factor: 3.5″ SBC
- CPU: Intel Tiger Lake UP3 Processor in the FCBGA1449 sockets
- RAM: One DDR4 3200 MHz SO-DIMM up to 32 GB, support Non-ECC, unbuffered memory
- Expansion: LVDS interface: Onboard 18/24-bit single/dual channel LVDS connector with +3.3V/+5V/+12V supply; Display port interface: Onboard Display port connector; HDMI interface: Onboard HDMI connector; VGA interface: Onboard VGA connector
- Other features: LAN Interface: 1 x Intel i219-LM Gigabit PHY LAN (Support iAMT 15.0), 1 x Intel i225-LM Gigabit LAN (up to 2.5GbE)
