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Industrial Computers | Embedded Systems | Boards & Modules

  • LE 37O 2D8 1
    Commell LE-37O 3.5″ Tiger Lake i7 SBC
    • Product Name: Commell LE-37O
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: Intel Tiger Lake UP3 Processor in the FCBGA1449 sockets
    • RAM: One DDR4 3200 MHz SO-DIMM up to 32 GB, support Non-ECC, unbuffered memory
    • Expansion: LVDS interface: Onboard 18/24-bit single/dual channel LVDS connector with +3.3V/+5V/+12V supply; Display port interface: Onboard Display port connector; HDMI interface: Onboard HDMI connector; VGA interface: Onboard VGA connector
    • Other features: LAN Interface: 1 x Intel i219-LM Gigabit PHY LAN(Support iAMT 15.0), 1 x Intel i225-LM Gigabit LAN (up to 2.5GbE)
  • LP 179 2D8 NEW 1
    Commell LP-179 Pico-ITX Celeron Tiger Lake SBC
    • Product Name: Commell LP-179
    • System Type: Pico-ITX SBC
    • CPU: Onboard Intel Tiger Lake UP3 Processor (Celeron)
    • RAM: 1 x DDR4 SO-DIMM 3200 MHz up to 32GB
    • Expansion: 1 x M.2 2230 Key E, 1 x M.2 2280 Key M support PCIe Gen4, 1 x SATA3
    • Other features: Integrated DisplayPort, HDMI, 1 x Intel Gigabit PHY LAN, 1 x Intel 2.5 Gigabit LAN, 2 x USB2.0, 2 x USB3.2 Gen2, 2 x RS232, Support Watchdog Timer, Support 4K resolution, DC input 12V ±5%
  • AL551 F 070824RAw600
    DFI AL551 Intel Atom E3900 3.5″ SBC
    • Product Name: DFI AL551
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: Intel Atom E3900
    • RAM: 1 DDR3L SODIMM up to 8GB
    • Expansion: Three independent displays: VGA + LVDS + DP++; Wireless communication: mini PCIe
    • Other features: Rich I/O: 2 Intel GbE, 2 COM, 2 USB 3.0, 4 USB 2.0; 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap)
  • AL700 Back Website
    DFI AL700 Intel Atom E3900 Qseven
    • Product Name: DFI AL700
    • Module Form Factor: Intel Atom E3900 Qseven
    • CPU: Intel Atom E3900 Series
    • RAM: 4GB/8GB DDR3L Dual Channel Memory Down
    • Expansion: Multiple expansions: 4 PCIe x1
    • Other features: Rich I/O: 1 Intel GbE, 1 USB 3.0, 8 USB 2.0; 1 DDI*, 1 LVDS*/(eDP + DDI) Supports triple displays: eDP+2DDI; 15-Year CPU Life Cycle Support Until Q1′ 31 (Based on Intel IOTG Roadmap)
  • AL701F090426 W600
    DFI AL701 Intel Atom E3900 Qseven
    • Product Name: DFI AL701
    • Module Form Factor: Intel Atom E3900 Qseven
    • CPU: Intel Atom E3900
    • RAM: 4GB/8GB LPDDR4 Dual Channel Memory
    • Expansion: Multiple expansions: 4 PCIe x1
    • Other features: 1 DDI*, 1 LVDS*/(eDP + DDI)；Supports triple displays: eDP+2DDI; DP++ resolution supports up to 4096×2160 @ 60Hz; Rich I/O: 1 Intel GbE, 1 USB 3.0, 8 USB 2.0; 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on Intel IOTG Roadmap)
  • AL968 Front Website
    DFI AL968 Intel Atom E3900 COM Express Compact
    • Product Name: DFI AL968
    • Module Form Factor: COM Express Compact
    • CPU: Intel Atom E3900 Series
    • RAM: Dual channel DDR3L 1600MHz SODIMM up to 8GB
    • Expansion: Multiple expansion: 4 PCIe x1, 1 LPC, 1 I2C, 1 SMBus, eMMC
    • Other features: Three independent displays: VGA*/DDI + LVDS*/eDP + DDI; Rich I/O: 1 Intel GbE, 4 USB 3.0, 8 USB 2.0, 2 SATA 3.0; 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on Intel IOTG Roadmap)
  • photo front AL9A8 RA
    DFI AL9A8 Intel Atom E3900 COM Express Mini
    • Product Name: DFI AL9A8
    • Module Form Factor: COM Express Mini
    • CPU: Intel Atom E3900 Processor Series
    • RAM: Dual Channel LPDDR4-2400MHz Memory Down up to 8GB
    • Expansion: Multiple expansions: 4 PCIe x1
    • Other features: Rich I/O: 1 Intel GbE, 2 USB 3.0, 8 USB 2.0; 1 LVDS/eDP, 1 DDI (HDMI/DP++) Supports dual displays: DDI + LVDS/eDP; 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on Intel IOTG Roadmap)
  • GH551F200130R1 W600
    DFI GH551 AMD Ryzen V1000/R1000 Series 3.5″ SBC
    • Product Name: DFI GH551
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: AMD Ryzen V1000/R1000 Series
    • RAM: 1 DDR4 2400MHz SODIMM up to 16GB
    • Expansion: Multiple displays: max. 4 DP++/3 DP++ + LVDS; Multiple Expansion: 1 M.2 M Key, 1 Mini PCIe
    • Other features: Rich I/O: 3 GbE, 2 USB 3.1 Gen2, 1 USB 2.0; 10-Year CPU Life Cycle Support Until Q1′ 31 (Based on AMD Roadmap)
  • ALF51F080111RAw600
    DFI ALF51 1.8″ Intel Atom X5 or Celeron Industrial Pi SBC
    • Product Name: DFI ALF51
    • Motherboard Form Factor: 1.8″ SBC
    • CPU: Intel Atom Processor E3900 Series or Celeron CPU
    • RAM: 2GB/4GB LPDDR4 Memory Down
    • Expansion: 1 Mini DP++
    • Other features: Rich I/O: 2 Intel GbE, 1 COM, 2 USB 3.1 Gen 1, 1 USB 2.0, 15-Year CPU Life Cycle Support Until Q4’31 (Based on Intel IOTG Roadmap), Operating: 0 to 60°C
  • RC300 CS SideIO200729R2 w600
    DFI VC300-CS AI-Enabled 5G MXM In-Vehicle PC
    • Product Name: DFI VC300-CS
    • System Type: AI-Enabled 5G MXM In-Vehicle PC
    • CPU: 8th/9th Generation Intel Core Processors
    • RAM: Dual Channel DDR4 2666/2400 MHz by SODIMMs up to 64GB
    • Expansion: 4 x 802.3af POE Ports, Multiple Expansion Slots for 3G/LTE/5G Cellular Support
    • Other features: AI Accelerated: Up to 110W GPU MXM Module Supported, Extended Operating Temperature: -25°C to 70°C, Support 5G Communication, 15-Year CPU Life Cycle Support Until Q1′ 34 (Based on Intel IOTG Roadmap)
  • ALF51F080111RAw600
    DFI ALF51-ET 1.8″ Intel Atom X5 or Celeron Industrial Pi SBC – Extended Temp
    • Product Name: DFI ALF51-ET
    • Motherboard Form Factor: 1.8″ SBC
    • CPU: Intel Atom Processor E3900 Series or Celeron
    • RAM: 2GB/4GB LPDDR4 Memory Down
    • Expansion: 1 Mini DP++
    • Other features: Rich I/O: 2 Intel GbE, 1 COM, 2 USB 3.1 Gen 1, 1 USB 2.0, 15-Year CPU Life Cycle Support Until Q4’31 (Based on Intel IOTG Roadmap), Operating: -40 to 85°C
  • ALF51F080111RAw600
    DFI ALF51-WT Intel Atom X5 or Celeron Industrial Pi SBC – Wide Temp
    • Product Name: DFI ALF51-WT
    • Motherboard Form Factor: 1.8″ SBC
    • CPU: Intel Atom Processor E3900 Series or Celeron
    • RAM: 2GB/4GB LPDDR4 Memory Down
    • Expansion: 1 Mini DP++
    • Other features: Rich I/O: 2 Intel GbE, 1 COM, 2 USB 3.1 Gen 1, 1 USB 2.0, 15-Year CPU Life Cycle Support Until Q4’31 (Based on Intel IOTG Roadmap), Operating: -20 to 70°C
  • KU968 Front Website
    DFI KU968 Kaby Lake 7th Gen Intel iCore COM Express Compact
    • Product Name: DFI KU968
    • Module Form Factor: COM Express Compact
    • CPU: 7th Gen Intel Core
    • RAM: Dual channel DDR4 2133MHz memory down up to 16GB
    • Expansion: Multiple expansion: 8 PCIe x1, 1 LPC, 1 I2C, 1 SMBus
    • Other features: Rich I/O: 1 Intel GbE, 4 USB 3.0, 8 USB 2.0; Three independent displays: VGA*/DDI + LVDS*/eDP + DDI; 15-Year CPU Life Cycle Support Until Q1′ 32 (Based on Intel IOTG Roadmap)
  • COM101 BAT Front Website
    DFI COM101-BAT Mini-ITX – COMe Basic/Compact Carrier Board
    • Product Name: DFI COM101-BAT
    • Motherboard Form Factor: Mini-ITX
    • CPU: Supports COMe Basic/Compact modules
    • RAM: Supports Compact/Basic modules
    • Expansion: Multiple displays (1 DP, 1 LVDS, 1 VGA)
    • Other features: Rich I/O (1 GbE, 6 USB)
  • COM332 B Front Website
    DFI COM332-B(R.A) Micro-ATX – COMe Basic/Compact Carrier Board
    • Product Name: DFI COM332-B
    • Motherboard Form Factor: Micro-ATX
    • CPU: Supports COMe Basic/Compact modules
    • RAM: Supports Compact and Basic modules
    • Expansion: Multiple displays (VGA, LVDS, DP, eDP)
    • Other features: Rich I/O (1 GbE, 4 USB 3.0, 4 USB 2.0)
  • COM332 BF070801w600
    DFI COM332-B(R.B1) Micro-ATX – COMe Basic/Compact Carrier Board
    • Product Name: DFI COM332-B
    • Motherboard Form Factor: Micro-ATX
    • CPU: Supports COMe Basic/Compact modules
    • RAM: Supports Compact and Basic modules
    • Expansion: Multiple displays (VGA, LVDS, DP, eDP)
    • Other features: Rich I/O (1 GbE, 4 USB 3.1, 4 USB 2.0)
  • COM333 Front Website
    DFI COM333-I Micro-ATX – COMe Basic/Compact Carrier Board
    • Product Name: DFI COM333-I
    • Motherboard Form Factor: Micro-ATX
    • CPU: Supports COMe Basic/Compact modules
    • RAM: Supports Compact and Basic modules
    • Expansion: Multiple expansion (8 PCIe x4 or 4 PCIe x8, 2 SATA 3.0)
    • Other features: Rich I/O (2 GbE, 4 10Gbase-KR, 4 USB 3.0/2.0, 1 COM)
  • RC300 CS Front200721 w600
    DFI RC-300-CS AI-Enabled 5G MXM Railway System
    • Product Name: DFI RC-300-CS
    • System Type: Railway System
    • CPU: 8th/9th Generation Intel Core Processors
    • RAM: Dual Channel DDR4 2666/2400 MHz by SODIMMs up to 64GB
    • Expansion: Multiple Expansion Slots for 3G/LTE/5G Cellular Support
    • Other features: AI-Enabled, 4 x M12 X-coded PoE Ports at 15W, AI Accelerated: Up to 110W GPU MXM Module Supported, Extended Operating Temperature: -25°C to 70°C Operation without Active Fan, Support 5G Communication, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
  • CS551B191017R1w600
    DFI CS551 Intel 8th/9th Gen Coffee Lake iCore 3.5″ SBC
    • Product Name: DFI CS551 3.5″ SBC
    • Motherboard Form Factor: 3.5″
    • CPU: 9th/8th Gen Intel Core with Intel C246
    • RAM: 1 DDR4 SODIMM up to 32GB
    • Expansion: Three independent displays: LVDS + DP++ + DP++; Multiple expansion: 1 M.2 M Key, 1 Mini PCIe
    • Other features: DP++ resolution up to 4096×2304 @ 60Hz; Rich I/O: 2 Intel GbE, 4 USB 3.1, 2 USB 2.0; 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on Intel IOTG Roadmap)
  • VC230 ALSide190313 w600
    DFI VC230-AL Intel Atom E3900 Series In-Vehicle PC
    • Product Name: DFI VC230-AL
    • System Type: Anti-vibration In-Vehicle PC
    • CPU: Intel Atom E3900 Series
    • RAM: 1 SODIMM Memory Support up to 8GB Single Channel DDR3L 1600/1866MHz
    • Expansion: 1 mSATA, eMMC (optional), 1 x Full-size Mini PCIe (PCIe/USB/Daul micro SIM), 1 x Full-size Mini PCIe (PCIe/USB/micro SIM), 1 x Half-size mSATA
    • Other features: Supports ignition delay on/off function, GPS Onboard, 3 SIM Slots Onboard, Supports Wi-Fi, 3G, and GPRS application, 15-Year CPU Life Cycle Support Until Q1′ 31 (Based on Intel IOTG Roadmap)