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Industrial Computers | Embedded Systems | Boards & Modules

  • IMB 1313
    ASRock Industrial IMB-X1313 Intel Xeon / 10th Gen Micro ATX Motherboard
    • Product Name: Asrock IMB-X1313
    • Motherboard Form Factor: Micro ATX
    • CPU: Intel Xeon W-1200 series & Intel 10th Gen (Comet lake-S) Core Processors with W480E chipset
    • RAM: 4 x 288-pin Long-DIMM, Support Dual Channel DDR4 2933 (i9/i7 CPU)/2666 (i5/i3 CPU)/ 2400 (Pentium/ Celeron CPU), up to 128GB, Support ECC Long DIMM memory modules
    • Expansion: 1 x PCIe x16 Gen3, 1 x PCIe x8 Gen3, 2 x PCIe x4 Gen3
    • Other features: 4 x USB 3.2 Gen2, 4 x USB 3.2 Gen1, 4 x USB 2.0, 8 x SATA3, 1 x M.2 Key E,1 x M.2 Key M, 1 x M.2 Key B, 6 x COM, 1 x Intel 1 Gigabit LAN, 1 x Intel 2.5 Gigabit LAN, Support Triple display, 1 x DP1.2, 1 x VGA, 1 x LVDS (eDP1.4 optional), 1 x HDMI 2.0a, TPM 2.0 onboard, ATX-PWR (24+8-pin)
  • SDML WLF191025R1 w600
    DFI SDML-WL 8th Gen Intel iCore Smart Display Module
    • Product Name: DFI SDML-WL
    • Module Form Factor: Smart Display Module
    • CPU: 8th Gen Intel iCore
    • RAM: 2 DDR4 2400MHz SODIMM up to 32GB
    • Expansion: 1 M.2 E Key, 1 M.2 M Key, 1 M.2 B Key
    • Other features: HDMI resolution up to 4096 x 2160 @ 60Hz, DisplayPort resolution up to 4096 x 2304 @ 60Hz, Rich I/O: 1 Intel GbE, 4 USB3.1, 1 USB3.1 Type C, 15-Year CPU Life Cycle Support Until Q3′ 34 (Based on Intel IOTG Roadmap)
  • IMB 1711
    ASRock Industrial IMB-X1711 Intel Xeon / 10th Gen ATX Motherboard
    • Product Name: Asrock IMB-X1711
    • Motherboard Form Factor: ATX
    • CPU: Intel Xeon W-1200 series & Intel 10th Gen (Comet lake-S) Core Processors with W480E chipset
    • RAM: 4 x 288-pin Long-DIMM, Support Dual Channel DDR4 2933 (i9/i7 CPU)/2666 (i5/i3 CPU)/ 2400 (Pentium/ Celeron CPU), up to 128GB, Support ECC Long DIMM memory modules
    • Expansion: 1 x PCIe x16 Gen3, 1 x PCIe x8 Gen3, 3 x PCIe x4 Gen3, 2 x PCI, 1 x M.2 Key E, 1 x M.2 Key M, 1 x M.2 Key B, 6 x COM, 6 x SATA3
    • Other features: 4 x USB 3.2 Gen2, 4 x USB 3.2 Gen1, 4 x USB 2.0, 1 x Intel 1 Gigabit LAN, 1 x Intel 2.5 Gigabit LAN, Support Triple display, 1 x DP1.2, 1 x VGA, 1 x HDMI 2.0a, TPM 2.0 onboard, ATX-PWR (24+8-pin)
  • WL551 Front060520 R1 w600
    DFI WL551 Intel 8th Gen Whiskey Lake iCore 3.5″ SBC
    • Product Name: DFI WL551
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: 8th Gen Intel Core Processor
    • RAM: Not specified
    • Expansion: Dual independent displays: DP + HDMI, 1 LVDS or eDP (opt.); Multiple Expansion: 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
    • Other features: 4K High Resolution: Supports 4K/2K resolution; Rich I/O 1: 3 Intel GbE, 1 COM, 4 USB 3.1 Gen2, 2 USB 2.0; 15-Year CPU Life Cycle Support Until Q2′ 35 (Based on Intel IOTG Roadmap)
  • iBOX TGLL1
    ASRock Industrial iBOX-1215UE Intel Alder Lake-P i3 Fanless Mini PC
    • Product Name: Asrock iBOX-1215UE
    • System Type: Industrial Fanless BOX PC
    • CPU: Intel 12th Gen (Alder Lake-P) Core Processors
    • RAM: 2 x 260-pin SO-DIMM up to 64GB DDR4 3200 MHz
    • Expansion: 6 x USB 3.2 Gen2, 2 x USB 2.0, 1 x M.2 Key M, 1 x M.2 Key E, 1 x COM, 1 x SATA3
    • Other features: 2 x Intel 2.5 Gigabit LAN, Supports Quad display, 1 x HDMI 2.0b, 3 x DP 1.4a (2 from Type C), TPM 2.0 onboard IC, 19V/90W Power Adapter, 171.8 x 50.05 x 109.45 mm, Fanless Embedded BOX PC
  • IMB 1222 WVL1
    ASRock Industrial IMB-1222-WV 10th Gen Mini-ITX Motherboard
    • Product Name: Asrock IMB-1222-WV
    • Motherboard Form Factor: Mini-ITX
    • CPU: Intel 10th Gen (Comet lake-S) Core Processors with Q470E chipset
    • RAM: 2 x 260-pin SO-DIMM Support Dual Channel DDR4 2933 (i9 / i7 CPU) / 2666 (i5 / i3 CPU) / 2400 (Pentium / Celeron CPU), up to 64GB
    • Expansion: 1 x PCIe x16 Gen3, 6 x USB 3.2 Gen1, 4 x USB 2.0, 1 x M.2 Key E, 1 x M.2 Key M, 1 x M.2 Key B, 4 x COM, 2 x SATA3
    • Other features: 1 x Intel 2.5 Gigabit LAN, 1 x Intel 1 Gigabit LAN, Support Triple display, 2 x DP 1.2, 1 x LVDS or eDP, 1 x HDMI 2.0a, TPM 2.0 onboard, 12V~28V DC-in
  • WL968 Front200506 R1 w600
    DFI WL968 Whiskey Lake 8th Gen Intel iCore COM Express Compact
    • Product Name: DFI WL968
    • Module Form Factor: COM Express Compact
    • CPU: 8th Generation Intel Core Processor
    • RAM: DDR4 2400/2133MHz SODIMM up to 64GB
    • Expansion: Multiple expansion: 8 PCIe x1, 1 LPC, 1 I2C, 1 SMBus
    • Other features: VGA/DDI + LVDS/eDP + DDI; DP++ supports 4K x 2K resolution; Rich I/O: 1 Intel GbE, 4 USB 3.0, 8 USB 2.0; 15-Year CPU Life Cycle Support Until Q2′ 35 (Based on Intel IOTG Roadmap)
  • POC 17C ULT3
    IEI 17” POC-17C 6th Gen iCore Medical Panel PC
    • Product Name: IEI POC-17C
    • Screen Size: 17″
    • CPU: 6th Generation Intel mobile ULT Core i7-6600U / Core i5-6300U / Celeron 3855U
    • RAM: Two 260-pin 2133/1866 MHz dual-channel DDR4 non-ECC unbuffered SO-DIMMs
    • Expansion: RAID function supported (RAID 0 and RAID 1) (only for Core i5 or Core i7)
    • Other features: 17″ FHD LED panel (1280 x 1024), Projected Capacitive type with 10-point multi-touch, IP65 compliant front bezel, Anti-bacteria cover
  • MXM IPC Q370L1
    ASRock Industrial MXM IPC-Q370 Micro-STX Motherboard
    • Product Name: Asrock MXM IPC-Q370
    • Motherboard Form Factor: Micro-STX
    • CPU: Intel 9th / 8th Gen (Coffee Lake-S) Core Processors with Q370 chipset
    • RAM: 2 x 260-pin SO-DIMM up to 64GB DDR4 2666 MHz (32GB per DIMM)
    • Expansion: 1 x MXM PCIe x16 (Gen3), 4 x USB 3.1 Gen1, 3 x USB 2.0, 2 x M.2 Key M, 1 x M.2 Key E, 1 x COM, 2 x SATA3
    • Other features: 2 x Intel Gigabit LAN, Supports Hexa Display, 5 x DP 1.2, 1 x VGA, 1 x eDP, TPM Header, 19V DC-In
  • BCE0716L 3
    MACTRON BCE0716 Intel i5-1135G7 Fanless Embedded System
    • Product Name: MACTRON BCE0716
    • System Type: Fanless Embedded Box PC
    • CPU: Intel Core i5-1135G7
    • RAM: 1 x SO-DIMM, DDR4 4GB, 4800 MHz (Max.32GB)
    • Expansion: Support 6 x USB(V3.0), Support 1 x SATA III (6.0Gb/s) Connector, Support 1 x M.2 Slot
    • Other features: Fanless Housing Design & Compact Mini Size & Rich IO Ports, Support 2 x RTL8111E Gigabit LAN, Support Windows 7 / 8 / 10, Linux OS
  • iBOX TGLL1
    ASRock Industrial iBOX-1245UE Intel Alder Lake-P i5 Fanless Mini PC
    • Product Name: Asrock iBOX-1245UE
    • System Type: Industrial Fanless BOX PC
    • CPU: Intel 12th Gen (Alder Lake-P) Core Processors
    • RAM: 2 x 260-pin SO-DIMM up to 64GB DDR4 3200 MHz
    • Expansion: 6 x USB 3.2 Gen2, 2 x USB 2.0, 1 x M.2 Key M, 1 x M.2 Key E, 1 x COM, 1 x SATA3
    • Other features: 2 x Intel 2.5 Gigabit LAN, Supports Quad display, 1 x HDMI 2.0b, 3 x DP 1.4a (2 from Type C), TPM 2.0 onboard IC, 19V/90W Power Adapter, 171.8 x 50.05 x 109.45 mm, Fanless Embedded BOX PC
  • AL053M080213RAw600
    DFI AL053 Intel Atom Processor E3900 Pico-ITX
    • Product Name: DFI AL053
    • Motherboard Form Factor: Pico-ITX SBC
    • CPU: Intel Atom X5-E3930 / X5-E3940 / 7-E3950 / N3350
    • RAM: 1 DDR3L SODIMM up to 8GB
    • Expansion: 1 Mini PCIe, 1 M.2, 1 SMBus
    • Other features: Two independent displays: LVDS + Mini DP++, Rich I/O: 1 Intel GbE, 1 COM, 2 USB 3.1 Gen1, 2 USB 2.0, 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap)
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  • WLP series
    Wincomm WLP-7F20 Series 15″ – 22″ 6th Gen Rugged Industrial Panel PC Series
    • Product Name: Wincomm WLP-7F20 Series 6th Gen iCore Rugged Industrial Panel PC
    • Screen Size: 15″ – 22″
    • CPU: Intel 6th gen. Skylake Core i CPU
    • RAM: Two 2133 MHz DDR4 SODIMM socket support dual Channel, non-ECC, up to 32GB
    • Expansion: Not specified
    • Other features: Intel Core i7/i5 Fanless Industrial Panel PC, 16:9 Full HD 1920 x 1080 LCD, Full flat resistive/P-cap touch with front IP66 design, Front Panel mount housing, CE, FCC, VCCI Class B passed, Optional WLAN with external antenna
  • tgu968 top web
    DFI TGU968 Tiger Lake 11th Gen Intel iCore COM Express Compact
    • Product Name: DFI TGU968
    • Module Form Factor: COM Express Compact
    • CPU: 11th Generation Intel Processor
    • RAM: DDR4 3200MHz SODIMM up to 64GB
    • Expansion: Multiple expansion: 8 PCIe x1, 1 I2C, 1 SMBus
    • Other features: VGA/DDI + LVDS/eDP + DDI; DP++ supports 4K x 2K resolution; Rich I/O: 1 Intel 2.5GbE, 4 USB 3.1, 8 USB 2.0; 15-Year CPU Life Cycle Support Until Q2′ 35 (Based on Intel IOTG Roadmap)
  • IMB 1711
    ASRock Industrial IMB-1711 Intel 10th Gen ATX Motherboard
    • Product Name: Asrock IMB-1711
    • Motherboard Form Factor: ATX
    • CPU: Intel 10th Gen (Cometlake-S) Core Processors with Q470E chipset
    • RAM: 4 x 288-pin Long-DIMM, Support Dual Channel DDR4 2933 (i9/i7 CPU)/2666 (i5/i3 CPU)/ 2400 (Pentium/ Celeron CPU), up to 128GB
    • Expansion: 1 x PCIe x16 Gen3, 1 x PCIe x8 Gen3, 3 x PCIe x4 Gen3, 2 x PCI, 1 x M.2 Key E,1 x M.2 Key M, 1 x M.2 Key B, 6 x COM, 6 x SATA3
    • Other features: 4 x USB 3.2 Gen2, 4 x USB 3.2 Gen1, 4 x USB 2.0, 1 x Intel 1 Gigabit LAN, 1 x Intel 2.5 Gigabit LAN, Support Triple display, 1 x DP1.2, 1 x VGA, 1 x HDMI 2.0a, TPM 2.0 onboard, ATX-PWR (24+8-pin)
  • Jetway M192 1
    Jetway MI92 Series 10th Gen iCore Mini-ITX Motherboard
    • Product Name: Jetway MI92 Series
    • Motherboard Form Factor: Mini-ITX
    • CPU: Intel 10th LGA1200 Socket Processor (Max. 65W TDP)
    • RAM: 2* DDR4 2666MHz SO-DIMM up to 32 GB
    • Expansion: 1* PCIe x16 slot, 1* M.2 M-key 2242/2280 (SATA/PCIe x4) support NVMe, 1* M.2 E-key 2230 (PCIe x1/USB2.0) support CNVio
    • Other features: 2* 10/100/1000 Base-TX Ethernet Ports, 2* HDMI, 1* DP, 1* eDP, 2* COM (support RS232/422/485), 4* USB3.1 Gen.2, 2* USB3.1 Gen.1 & 2* USB2.0, 4* SATA III (6Gb/s) support RAID 0, 1, 5, 10, Support onboard TPM 2.0 (MI92-12 only)
  • BCE0726L 2
    MACTRON BCE0726 Intel i7-8550U Fanless Embedded System
    • Product Name: MACTRON BCE0726
    • System Type: Fanless Embedded Box PC
    • CPU: Intel Core i7-8550U
    • RAM: Support 1 x SO-DIMM DDR4-2400Hz, up to 16GB
    • Expansion: Support 2 x COM (RS232), Support 1 x SATSIII (6.0Gb/s) Connector, Support 1 x M.2 2280 Slot
    • Other features: Fanless Housing Design & Compact Mini Size & Rich IO Ports, Support 2 x Intel i211-AT Gigabit LAN, Support Windows 10, Linux OS
  • 4x4 V2000L1
    ASRock Industrial 4X4-V2000M Ryzen Embedded V2718 4″ SBC
    • Product Name: Asrock 4X4-V2000M
    • Motherboard Form Factor: 4″ X 4″ SBC
    • CPU: AMD Ryzen Embedded V2718
    • RAM: 2 x 260-pin non-ECC/ECC SO-DIMM up to 64GB DDR4 3200 MHz
    • Expansion: 4 x USB 3.2 Gen2, 4 x USB 2.0, 1 x M.2 Key M, 1 x M.2 Key E, 1 x COM, 1 x SATA3
    • Other features: 1 x Realtek 1 Gigabit LAN, 1 x Realtek 2.5 Gigabit LAN, Supports Quad display, 1 x HDMI 2.0a, 3 x DP 1.2a (2 from Type C), TPM onboard, 12V~19V DC-In
  • 2I810D b1
    LEX 2I810D 8th Gen Intel Whiskey Lake-U i7/i5/i3 4xGBe Pico-ITX
    • Product Name: Lex 2I810D
    • Motherboard Form Factor: Pico-ITX SBC
    • CPU: 8th Gen Intel Whiskey Lake-U i7/i5/i3
    • RAM: 1 x DDR4 SODIMM socket, Max. 16GB
    • Expansion: 2 x Mini PCIe
    • Other features: Multiple Independent display: VGA & HDMI, 4 x Intel GbE LAN, 3 x USB 3.0, 4 x USB 2.0, 2 x COM, 4DI/4DO, TPM 2.0 (Optional)
  • EC700 AL 1
    DFI EC700-AL Fanless Wide Temp Embedded Ultra Compact PC
    • Product Name: DFI EC700-AL
    • System Type: Fanless Wide Temp Embedded Ultra Compact PC
    • CPU: Intel Atom Processor E3900 Series, BGA 1296
    • RAM: DDR3L-1866 memory onboard + 1 SODIMM up to 8GB
    • Expansion: Supports 2 Mini PCIe and 1 M.2 slots
    • Other features: Displays: 1 DP/HDMI combo + 1 DP/VGA, Rich I/O ports: up to 4 Intel GbE, 4 COM, 4 USB, Extended operating temperature: -40 to 70°C, 15-Year CPU Life Cycle Support Until Q1’31 (Based on Intel IOTG Roadmap)