IEI DRPC-W Series:
Compact & Reliable DIN-Rail Embedded Systems for Industrial Applications
iEi’s DRPC-W series is a collection of compact and robust DIN-rail mounted embedded system PC’s designed around iEi’s 3.5″ single board computer series – “Wafer”. With their compact sizing, the system PC’s are perfectly placed to suit installations where physical space is limited but there’s still the demand for a PC that has an extensive array of i/o – and enhanced performance.
With their aforementioned compact form factor and DIN-rail mounting capability, the DRPC-W series offers both versatility and ease of integration for a variety of industrial applications. The series comes in three main SKU’s, namely :
IEI DRPC-W Series of DIN-Rail Embedded Systems
DRPC-W-EHL Fanless Elkhart Lake Celeron DIN-Rail Embedded System
- Intel Celeron J6412 processor
- DIN-rail palm-size for limited space
- Fanless -20°C ~ 60°C operating temp
- 2 x 2.5 GbE, 2 x USB 3.2
- Dual display via HDMI & DP
- 1 x M.2 A key 2230 for Wi-Fi & BT
- 1 x M.2 B key for 5G
DRPC-W-JL Fanless Jasper Lake Celeron DIN-Rail Embedded System
- Intel Celeron N5105 processor
- DIN-rail palm-size for limited space
- Fanless -20°C ~ 60°C operating temp
- 3 x 2.5 GbE, 2 x USB 3.2
- Dual display via HDMI & DP
- 1 x M.2 A key for Wi-Fi & BT
- 1 x M.2 B key for 5G/NVMe/AI accelerator
DRPC-W-TGL Fanless Tiger Lake iCore DIN-Rail Embedded System
- Intel Core i7-1185G7E, i5-1145G7E, i3-1115G4E, Intel Celeron 6305
- DIN-rail palm-size for limited space
- Fanless -20°C ~ 60°C operating temp
- 3 x 2.5 GbE, 4 x USB 3.2
- Triple display via 2 HDMI & DP
- 1 x M.2 A key 2230 for Wi-Fi & BT
- 1 x M.2 B key for 5G
Experience the power of the IEI DRPC-W series, where compactness meets exceptional performance, providing a reliable solution for IoT gateway, motion, and vision applications on the factory floor.
Optimized Efficiency and Unmatched Performance:
The DRPC-W-EHL with Intel Celeron J6412 Processor
Crafted around Intel’s 10nm Celeron Quad Core J6412 processor and Intel UHD graphics, the DRPC-W-EHL fanless embedded system is engineered to deliver performance whilst optimising energy consumption. Boasting a clock speed of 2.0 GHz and turbo speeds up to 2.60 GHz, the Intel Celeron J6412 Processor serves as the central engine for the DRPC-W-EHL fanless embedded system, offering a remarkable 2x performance enhancement compared to its processor predecessor, the Apollo Lake.
Empowering Efficiency:
The DRPC-W-JL with Intel Celeron Quad Core N5105 Processor
The DRPC-W-JL fanless embedded system is integrated with Intel’s advanced 10nm Celeron Quad Core N5105 processor and Intel UHD graphics. Boasting a clock speed of 2.0 GHz and turbo speeds of up to 2.90 GHz, the Intel Celeron N5105 Processor serves as the powerhouse for the DRPC-W-JL fanless embedded system, delivering an impressive 2x performance improvement compared to its processor predecessor, the Gemini Lake.
Enhanced Performance and Efficiency:
DRPC-W-TGL with 11th Gen Intel Core/Celeron Processors
The DRPC-W-TGL fanless embedded system leverages the power of Intel’s 11th Generation Core/Celeron processor and Intel UHD graphics. Featuring up to 4 cores and a maximum turbo frequency of 4.40 GHz, the processor provides the core abilities of the DRPC-W-TGL fanless embedded system, delivering exceptional performance with a notable 2x performance improvement over its processor predecessor, Whiskey Lake, providing for a significant upgrade in the meeting of demanding computing tasks.
Space-Saving Optimisation
The DRPC-W Series is designed to optimise size, ensuring minimal space consumption for cabinet installations. Designed around iEi’s industrial-grade 3.5″ “Wafer” embedded single board computers, the DRPC-W Series compact form factor still provides for capable i/o expansion – essential for IoT applications demanding scalable sensor connectivity.
Accelerating Time-to-Market through Customization
The DRPC-W Series stands out with its enclosure specifically tailored around iEi’s 3.5” ‘Wafer’ Series of Single Board Computers. The W-Series is set apart via the ability to customize i/o plates, providing flexibility to meet diverse requirements using IEI’s extensive range of 3.5″ SBC’s.
Whether you need a low-power or a high-performance platform, the DRPC-W Series offers a wide array of options to choose from to allow levels of customisation to ensure users can bring their applications to market as they require.
Enabling Remote Deployments with Scalable Wireless Communication
The DRPC-W Series is designed to facilitate remote and mobile deployments via a comprehensive range of wireless connectivity options. With built-in Bluetooth, WiFi, and 4G/LTE capabilities, the system empowers connectivity via a diverse array of industrial IoT devices. Whether it’s establishing connectivity in-field or enabling mobility within internal industrial settings, the DRPC-W series offers the needed flexibilities required for successful and scalable IoT deployments.
Reliability isn’t compromised even in the most extreme of environments
Wide Operating Temperature,
Shock and Vibration Resistance
-20°C
60°C
The DRPC-W series is engineered with a ruggedised chassis, designed to withstand the harshest of conditions encountered in Edge IoT computing applications. With a wide operating temperature range of -20°C to 60°C, the system ensures reliable performance and, additionally, exhibits exceptional shock and vibration resistance to ensure uninterrupted operation.
The DRPC-W Series undergoes rigorous test and validation procedures to guarantee its abilities in meeting the most demanding of requirements for complex edge computing applications. Additionally, the series holds multiple safety certifications, including CE and FCC – making it compliant with stringent EMC and safety standards for a broad cross mix of geographical regions in the meeting of strict regulatory frameworks.
Advanced Thermal Design for Fanless Operation
The DRPC-W-TGL sets a new standard in fanless system design with its optimised thermal management. By employing a Pin-Fin heatsink concept, the system ensures superior heat conduction and dissipation. The innovative design enhances two-dimensional heat conduction and minimises flow impedance, resulting in efficient thermal performance without the assistance of an internal fan.
Not only does the optimised thermal design enhance heat dissipation, but it also reduces the overall weight of the system by an impressive 35%. The reduced weight plays a crucial role in enhancing system reliability – especially in vibration-sensitive applications like AGV’s (Automated Guided Vehicles).
Compared to traditional plate fin heatsinks with continuous Parallel Fins, the DRPC-W-TGL demonstrates vastly superior performance. Its innovative thermal design allows for efficient heat management, ensuring reliable and robust operation – even in hot ambient temperature environments.
Unleashing Extreme Computing Power with an Advanced High-Efficiency Fan Kit
In scenarios that demand intensive computing power, users have the option to enhance the cooling capabilities of the DRPC-W-TGL by incorporating an external fan. This active cooling solution ensures that the system maintains optimal performance even in high-temperature environments.
Beyond providing exceptional cooling, the design offers a host of additional benefits. By preventing dust or particles from entering the hardware, the fan kit enhances the overall reliability of the system, ensuring longevity and uninterrupted operation. Additionally, the fan kit’s user-friendly design enables easy disassembly and cleaning to promote easy maintenance procedures.
IEI DRPC-W Series: Application Areas
Industrial Robotics
Seamless IoT Integration with Enhanced Connectivity
The DRPC-W series is engineered to provide optimal IoT integration capabilities, enabling faster connection speeds, expansion of bandwidth – and a versatile range of i/o interfaces. With 2.5GbE LAN and USB 3.2 Gen 2 ports, the series empowers connectivity with peripheral devices and systems such as PLMs, collaborative robotic arms, sensors and control centres.
By leveraging the advanced 2.5GbE LAN ports, the DRPC-W series ensures swift and reliable data transmission, facilitating efficient communication between interconnected devices. The USB 3.2 Gen 2 ports offer high-speed connectivity, enabling seamless interaction with a wide array of peripheral devices.
Warehouse Management
Unleashing Enhanced Connectivity with the DRPC-W Series
The DRPC-W series offers exceptional levels of connectivity. With up to 3 x 2.5GbE LAN ports, this series facilitates real-time access and storage control for IP cameras, ensuring efficient monitoring & surveillance – and its data management.
The series is designed with flexible expansion options to support a range of communication capabilities – and whether you require 5G, Bluetooth or Wi-Fi connectivity, the DRPC-W series can accommodate additional modules to enabling robust communications for your specific application needs.
Choosing the Right DRPC-W Solution
The DRPC-W Series offers a range of compact DIN-rail mount embedded systems to cater for a variety of needs. This series is specifically developed to support entry, middle and high-end 3.5″ single board computers, inclusive in iEi ‘WAFER’ series.
The user can confidently select the right embedded system that aligns with their requirements – and whether you need a compact solution for basic applications or a high-performance system for more the demanding of tasks, the DRPC-W Series provides the versatilities you’ll need.
DRPC-W-EHL Fanless Elkhart Lake Celeron DIN-Rail Embedded System
- Intel Celeron J6412 processor
- DIN-rail palm-size for limited space
- Fanless -20°C ~ 60°C operating temp
- 2 x 2.5 GbE, 2 x USB 3.2
- Dual display via HDMI & DP
- 1 x M.2 A key 2230 for Wi-Fi & BT
- 1 x M.2 B key for 5G
DRPC-W-JL Fanless Jasper Lake Celeron DIN-Rail Embedded System
- Intel Celeron N5105 processor
- DIN-rail palm-size for limited space
- Fanless -20°C ~ 60°C operating temp
- 3 x 2.5 GbE, 2 x USB 3.2
- Dual display via HDMI & DP
- 1 x M.2 A key for Wi-Fi & BT
- 1 x M.2 B key for 5G/NVMe/AI accelerator
DRPC-W-TGL Fanless Tiger Lake iCore DIN-Rail Embedded System
- Intel Core i7-1185G7E, i5-1145G7E, i3-1115G4E, Intel Celeron 6305
- DIN-rail palm-size for limited space
- Fanless -20°C ~ 60°C operating temp
- 3 x 2.5 GbE, 4 x USB 3.2
- Triple display via 2 HDMI & DP
- 1 x M.2 A key 2230 for Wi-Fi & BT
- 1 x M.2 B key for 5G
Experience the convenience and power of the DRPC-W Total Solution, offering an array of options to enhance your computing experience while maintaining a compact form factor and fanless design.
We like to make life easier ….
BVM supply a wide and diverse range of Industrial and Embedded Systems.
From Industrial Motherboards, SBCs and Box PCs, to Rack Mount computers and Industrial Panel PCs.
However, if you can’t find a solution that meets your needs from our wide & varied portfolio of standard products, speak to one of our team members around our bespoke design and manufacturing services. We can design a solution from ‘ground up’ – from concept to design – and through to system development and eventual mass production manufacture.
You can either call us directly on +(0) 1489 780 144 and talk to one of the team | E-mail us at sales@bvmltd.co.uk | Use the contact form on our website