System Type: AI-enabled 6-port GMSL2 Camera Frame Grabber Card
CPU: NVIDIA Jetson Xavier NX
RAM: 8 – 16Gb
Expansion: x2 Gen3 PCI Express interface
Other features: 6x GMSL2 FAKRA Z inputs supporting automotive GMSL2 cameras, Turnkey solution with pre-installed GMSL2 camera driver for selected cameras, Powered by NVIDIA Jetson Xavier NX bundled with JetPack 4.6.1, 21 TOPS AI performance with up to 22 streams simultaneous 1080p@30FPS video encoding capability, 1x GPS PPS input for frame sync calibration, 1x isolated CAN 2.0 and 1x RS232, -25°C to 60°C operating temperature with airflow
System Type: Intelligent Frame Grabber Card with PoE+ ports
CPU: NVIDIA Jetson Orin NX
RAM: 8 – 16Gb
Expansion: x1 Gen2 PCI Express interface
Other features: Powered by NVIDIA Jetson Orin NX bundled with JetPack 5.1, Single-slot half-length PCIe card form factor, 4x PoE+ 2.5 GbE ports with a 50W total power budget, 100 TOPS AI inference performance capable of up to four simultaneous streams of 4K@30FPS video decoding, 1x isolated RS-485 and 1x RS-232, -25°C to 60°C operating temperature with airflow
System Type: Intelligent Frame Grabber Card with USB 3.2 ports
CPU: VIDIA Jetson Orin NX
RAM: 8 – 16Gb
Expansion: x1 Gen2 PCI Express interface
Other features: Powered by NVIDIA Jetson Orin NX bundled with JetPack 5.1, Single-slot width, standard PCIe half-length card form factor, 6x USB 3.2 ports, each port with user-configurable 900mA and 1500mA current limit, 100 TOPS AI inference performance, Software-programmable per-port power on/off control, 1x isolated RS-485 and 1x RS-232, -25°C to 60°C operating temperature with airflow
Other features: IP67-rated design, specifically for outdoor environments, High AI computing performance for GPU accelerated processing, -30°C to +50°C operating temperature range, 100 to 240 VAC wide range power input with 10kV surge protection, 4 N-jack antenna openings with water-proof design, 1 IEEE 802.3at GbE PoE (30W)
Other features: High AI computing performance for GPU-accelerated processing, Ideal for edge AI smart city applications, Supports one 15W GbE PoE for camera, Wide operating temperature from -30°C to +60°C, Supports JetPack, Supports Allxon Device Management Solutions (Allxon DMS)
Other features: High AI computing performance for GPU-accelerated processing, Ideal for intelligent edge applications, AGV, AMR, and computer vision, Wide operating temperature from -30°C to +50°C, Supports JetPack
Other features: Wide power input range of 9 to 36 VDC (ignition by option), Supports four PoE for GigE cameras and LiDAR connectivity, -30°C to +60°C operating temperature range, Supports device management and optional out-of-band service powered by Allxon, Optional SerDes FPD-LINK III
Expansion: Dual GbE for GigE cameras and LiDAR connectivity, Dual COM/Dual CANbus/8-CH DI/DO
Other features: Hailo-8™ AI processor, up to 26 TOPS, Advanced AI performance, ideal for smart city applications, Supports Wi-Fi/Bluetooth/5G/LTE wireless connection, Wide operating temperature from -20°C to +70°C, Supports Linux operating system
Other features: Hailo-8™ AI processor, up to 26 TOPS, Palm size with high AI computing performance, Supports Wi-Fi/Bluetooth/5G/LTE wireless connection, Wide operating temperature from -10°C to +60°C, Wide voltage input from 12 to 24 VDC, Supports Windows 10 and Linux, Ideal for edge AI smart city applications
Expansion: Support M.2 B key 3052 5G cellular module
Other features: Multiple displays: 4 DP (from MXM), 1 DP++/HDMI (auto-detection), AI accelerated: up to 110W GPU MXM module supported, Rich I/O connectivity: 4 LAN, 4 USB 3.1, 6 USB 2.0, 2 COM, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
System Type: AI-Enabled 5G MXM PoE High Performance System
CPU: 8th/9th Generation Intel® Core™ Processors
RAM: Dual Channel DDR4 2666/2400 MHz by SODIMMs up to 64GB
Expansion: Multiple Expansion Slots for 3G/LTE/5G Cellular Support
Other features: 4 x RJ45 type PoE ports at 15W, AI Accelerated: Up to 110W GPU MXM Module Supported, Extended Operating Temperature: -25°C to 70°C, Support 5G Communication, 15-Year CPU Life Cycle Support Until Q1′ 34 (Based on Intel IOTG Roadmap)
• 2U Chassis support 8 x 3.5” HDD Hot-Swap Bay+ 4 x PCIe SSD and 4 Full-High Card with 1200W Redundant PSU
• Dual Socket LGA 2011 R3 support Intel Xeon processor E5-2600 v3/v4 series
• Supports 16DIMM, DDR4 2400/2133/1866 LR DIMM, R DIMM
• Support 12 SATA3 (8 from 8087 connector, 4 from SATA ports)
• 2 x PCIe 3.0 x16, 1 x M.2 slot, 2 x Mezzanine slot.
• ASPEED 2400. Integrated IPMI 2.0 and KVM with Dedicated LAN
• 3U Rackmount with 1200W Redundant PSU (3+1)
• Dual Socket R3 (LGA2011) Intel Xeon E5-2600 v3&v4 Series Processors
• Supports 2400/2133/1866 16 x R DIMM, LR DIMM, max 512GB
• Supports 8x GPGPU/MIC card
• Supports Intel Dual GLAN and additional Mezzanine card to support 10G ethernet
• Supports 6 x SATA3 6.0 Gb/s (Hot Swap Bay)
• Supports 2 x Mezzanine LAN card or 2 x PCIE card
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