System Type: Rugged NVIDIA Jetson Orin NX / Xavier NX Edge AI Computer
CPU: NVIDIA Jetson Orin NX or Xavier NX
RAM: 8 – 16Gb
Expansion: 2x mini-PCIe sockets for WIFI/GNSS/NVMe/CAN modules, 1x 3042/3052 M.2 B key socket for 4G/5G mobile communication
Other features: Rugged -25°C to 70°C fanless operation, 4x IEEE 802.3bt PoE++ GbE ports with screw-lock, 1x hardware configurable RS232/RS422/RS485 port, 8V to 35V wide-range DC input with built-in ignition power control, MIL-STD-810G and EN 50155 certified.
RAM: Up to 64GB DDR5 4800 with Intel R680E PCH (2x SODIMM)
Expansion: Three x8, Gen3 PCIe slots (x4 signal) for add-on cards
Other features: Supports dual NVIDIA RTX series 350W GPUs with patent-pending locking mechanism, 2x 2.5GbE and 1x GbE and 1x optional 10GBASE-T Ethernet, 1x internal M.2 NVMe, 2x 2.5″ SATA trays and 1x optional NVMe tray, Supports 8 to 48V wide-range DC input with ignition power control, Rugged, -25°C to 60°C operation.
CPU: Supports Intel 13th/12th-Gen Core up to 16C/ 24T 35W/ 65W CPU
RAM: Up to 64 GB DDR5 4800 SDRAM (two SODIMM slots)
Expansion: M.2 2280 M key socket (Gen4x4) supporting NVMe SSD, Accommodates two 2.5″ SATA HDD/ SSD with RAID 0/ 1 support, MezIO interface for add-on expansion
Other features: -25°C to 60°C wide temperature rugged operation, 5x 2.5GbE and 1xGbE with optional PoE+ (ports 3~6), 1x USB 3.2 Gen2x2 type-C and 6x USB 3.2 type-A ports
System Type: AI-enabled 6-port GMSL2 Camera Frame Grabber Card
CPU: NVIDIA Jetson Xavier NX
RAM: 8 – 16Gb
Expansion: x2 Gen3 PCI Express interface
Other features: 6x GMSL2 FAKRA Z inputs supporting automotive GMSL2 cameras, Turnkey solution with pre-installed GMSL2 camera driver for selected cameras, Powered by NVIDIA Jetson Xavier NX bundled with JetPack 4.6.1, 21 TOPS AI performance with up to 22 streams simultaneous 1080p@30FPS video encoding capability, 1x GPS PPS input for frame sync calibration, 1x isolated CAN 2.0 and 1x RS232, -25°C to 60°C operating temperature with airflow
System Type: Intelligent Frame Grabber Card with PoE+ ports
CPU: NVIDIA Jetson Orin NX
RAM: 8 – 16Gb
Expansion: x1 Gen2 PCI Express interface
Other features: Powered by NVIDIA Jetson Orin NX bundled with JetPack 5.1, Single-slot half-length PCIe card form factor, 4x PoE+ 2.5 GbE ports with a 50W total power budget, 100 TOPS AI inference performance capable of up to four simultaneous streams of 4K@30FPS video decoding, 1x isolated RS-485 and 1x RS-232, -25°C to 60°C operating temperature with airflow
System Type: Intelligent Frame Grabber Card with USB 3.2 ports
CPU: VIDIA Jetson Orin NX
RAM: 8 – 16Gb
Expansion: x1 Gen2 PCI Express interface
Other features: Powered by NVIDIA Jetson Orin NX bundled with JetPack 5.1, Single-slot width, standard PCIe half-length card form factor, 6x USB 3.2 ports, each port with user-configurable 900mA and 1500mA current limit, 100 TOPS AI inference performance, Software-programmable per-port power on/off control, 1x isolated RS-485 and 1x RS-232, -25°C to 60°C operating temperature with airflow
Other features: IP67-rated design, specifically for outdoor environments, High AI computing performance for GPU accelerated processing, -30°C to +50°C operating temperature range, 100 to 240 VAC wide range power input with 10kV surge protection, 4 N-jack antenna openings with water-proof design, 1 IEEE 802.3at GbE PoE (30W)
Other features: High AI computing performance for GPU-accelerated processing, Ideal for edge AI smart city applications, Supports one 15W GbE PoE for camera, Wide operating temperature from -30°C to +60°C, Supports JetPack, Supports Allxon Device Management Solutions (Allxon DMS)
Other features: High AI computing performance for GPU-accelerated processing, Ideal for intelligent edge applications, AGV, AMR, and computer vision, Wide operating temperature from -30°C to +50°C, Supports JetPack
Other features: Wide power input range of 9 to 36 VDC (ignition by option), Supports four PoE for GigE cameras and LiDAR connectivity, -30°C to +60°C operating temperature range, Supports device management and optional out-of-band service powered by Allxon, Optional SerDes FPD-LINK III
Expansion: Dual GbE for GigE cameras and LiDAR connectivity, Dual COM/Dual CANbus/8-CH DI/DO
Other features: Hailo-8 AI processor, up to 26 TOPS, Advanced AI performance, ideal for smart city applications, Supports Wi-Fi/Bluetooth/5G/LTE wireless connection, Wide operating temperature from -20°C to +70°C, Supports Linux operating system
Other features: Hailo-8 AI processor, up to 26 TOPS, Palm size with high AI computing performance, Supports Wi-Fi/Bluetooth/5G/LTE wireless connection, Wide operating temperature from -10°C to +60°C, Wide voltage input from 12 to 24 VDC, Supports Windows 10 and Linux, Ideal for edge AI smart city applications
Expansion: Support M.2 B key 3052 5G cellular module
Other features: Multiple displays: 4 DP (from MXM), 1 DP++/HDMI (auto-detection), AI accelerated: up to 110W GPU MXM module supported, Rich I/O connectivity: 4 LAN, 4 USB 3.1, 6 USB 2.0, 2 COM, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
System Type: AI-Enabled 5G MXM PoE High Performance System
CPU: 8th/9th Generation Intel Core Processors
RAM: Dual Channel DDR4 2666/2400 MHz by SODIMMs up to 64GB
Expansion: Multiple Expansion Slots for 3G/LTE/5G Cellular Support
Other features: 4 x RJ45 type PoE ports at 15W, AI Accelerated: Up to 110W GPU MXM Module Supported, Extended Operating Temperature: -25°C to 70°C, Support 5G Communication, 15-Year CPU Life Cycle Support Until Q1′ 34 (Based on Intel IOTG Roadmap)
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When a standard embedded design won’t suffice for what you need, you can always turn to BVM for help and use our custom design and manufacturing services.
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