MIL-STD PCs

  • ECX700 ADP 1

    DFI ECX700-ADP 12th Gen Outdoor Ruggedized IPC67 Mini PC

    • Product Name: DFI ECX700-ADP
    • System Type: Outdoor Ruggedized IPC67 Box PC
    • CPU: Intel Alder Lake-P Processor i5-1245UE / i7-1265UE
    • RAM: Supports DDR4 memory
    • Expansion: Multiple I/O interfaces for versatile connectivity
    • Other Features: IP67-rated waterproof and dustproof design, extreme ruggedization to IEC 60068-2-64, wide operating temperature range (-20 to 70°C)
    This product has multiple variants. The options may be chosen on the product page
  • ECX700 ALSide201126R2 W600

    DFI ECX700-AL Outdoor Ruggedized IPC67 Grade Box PC

    • Product Name: DFI ECX700-AL
    • System Type: Ruggedized Outdoor IoT IP67 Fanless Embedded System
    • CPU: Intel Atom Processor E3900 Series
    • RAM: 4GB DDR3 onboard, 64G eMMC
    • Expansion: 1 x Full-size Mini PCIe for 4G LTE module, 1 x Full-size Mini PCIe for Canbus, 1 x M.2 2230 (USB2.0/PCIe) for WiFi module
    • Other features: Ruggedized IPC67 Grade Box PC, Outdoor IoT Gateway Application, Operating temperature: -40° to 70° C, 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap)
    This product has multiple variants. The options may be chosen on the product page