Certified and Specialist Computer Solutions - PCs, Panel PCs and Displays

  • IDS 310AI 1
    IEI IDS-310AI Fanless Ultra Compact AI System
    • Product Name: IEI IDS-310AI
    • System Type: Fanless Ultra Compact Size AI System
    • CPU: Intel Celeron J3455 1.5GHz (up to 2.3GHz, quad-core, TDP 10W)
    • RAM: 1 x 204-pin DDR3L SO-DIMM, 8 GB pre-installed
    • Expansion: M.2 A-key slot for expansion
    • Other features: Two GbE LAN ports, Triple USB 3.2 Gen1, Pre-installed a Mustang-MPCIE-MX2 that has two Intel Myriad X VPUs for AI deep learning workload consolidation
  • PALM 3A100DW R 1
    LEX PALM-3A100DW-R AMD Ryzen Embedded Computer
    • Product Name: Lex PALM-3A100DW-R
    • System Type: AMD Ryzen Embedded Computer
    • CPU: AMD Ryzen Embedded R1000 Series SoC
    • RAM: 2 x DDR4 2400 MHz SODIMM, Max. 32GB
    • Expansion: 2 x HDMI, 1 x DP, 3 x GbE, 4 x USB, 8DI / 8DO, 2 x COM, 1 x Mini PCIe, 2 x SIM, 1 x M.2
    • Other features: With Independent Three 4K Display
  • PALM 3A100DW V 1
    LEX PALM-3A100DW-V AMD Ryzen Embedded Computer
    • Product Name: Lex PALM-3A100DW-V
    • System Type: AMD Ryzen Embedded Computer
    • CPU: AMD Ryzen Embedded V1000 Series SoC
    • RAM: 2 x DDR4 2400 MHz SODIMM, Max. 32GB
    • Expansion: 2 x HDMI, 2 x DP, 3 x GbE, 4 x USB, 8DI / 8DO, 2 x COM, 1 x Mini PCIe, 2 x SIM, 2 x M.2
    • Other features: With Independent Four 4K Display
  • APOLLO RS 3I370DW 1
    LEX APOLLO-RS 3I370DW 8th/9th Gen Fanless Embedded Computer
    • Product Name: Lex APOLLO-RS 3I370DW
    • System Type: Fanless Embedded Computer
    • CPU: Intel 8th/9th Gen Coffee Lake-S i7/i5/i3/Pentium/Celeron
    • RAM: 2 x DDR4 SODIMM socket, Max. 64GB
    • Expansion: DIO (optional), 1 x M.2 B Key, 1 x Mini PCIe, 2 x PCIe slot
    • Other features: Intel Q370 Chipset, Multiple Independent display: HDMI, DP, 5 x Intel GbE LAN, 4 x USB 3.1, 2~4 x COM
  • APOLLO S 3I370DW 1
    LEX APOLLO-S 3I370DW 8th/9th Gen Fanless Embedded Computer
    • Product Name: Lex APOLLO-S 3I370DW
    • System Type: Fanless Embedded Computer
    • CPU: Intel 8th/9th Gen Coffee Lake-S i7/i5/i3/Pentium/Celeron
    • RAM: 2 x DDR4 SODIMM socket, Max. 64GB
    • Expansion: DIO (optional), 1 x M.2 B Key, 1 x Mini PCIe
    • Other features: Intel Q370 Chipset, Multiple Independent display: HDMI, DP, 5 x Intel GbE LAN, 4 x USB 3.1, 2~4 x COM
  • TINOL CI370D 1
    LEX TINO CI370D 8th/9th Gen Fanless Embedded Computer
    • Product Name: Lex TINO CI370D
    • System Type: Fanless Embedded Computer
    • CPU: Intel 8th/9th Gen Coffee Lake-S i7/i5/i3/Pentium/Celeron
    • RAM: 2 x DDR4 SODIMM socket, Max. 64GB
    • Expansion: 1 x M.2 B Key, 2 x SIM, 2 x Mini PCIe
    • Other features: Intel Q370 Chipset, Multiple Independent display: HDMI, DP, 9 x Intel GbE LAN, 2 x SFP Fiber, 4 x USB 3.1, 2 x COM
  • WLPM 924 S
    Wincomm WLPM-V24 24″ AMD Ryzen Modular Industrial Panel PC
    • Product Name: Wincomm WLPM-V24
    • Screen Size: 24″
    • CPU: AMD Ryzen CPU, V1605B, QC, 2GHz, 12-25W
    • RAM: Dual Channel DDR4 2400 MHz (V1605B/ V1202B), 32 GB
    • Expansion: Optional Expansion Slot PCIex8
    • Other features: Modular Design with Panel Size 23.8”, Front IP66 Waterproof and Dustproof, Panel Mount, Fanless with Smart Thermal Control, Full Flat Design with Resistive or P-cap Touch, CE, FCC, VCCI Class B Passed
  • WLPM 915 S
    Wincomm WLPM-V15 15″ AMD Ryzen Modular Industrial Panel PC
    • Product Name: Wincomm WLPM-V15
    • Screen Size: 15″
    • CPU: AMD Ryzen CPU, V1605B, QC, 2GHz, 12-25W
    • RAM: Dual Channel DDR4 2400 MHz (V1605B/ V1202B), 32 GB
    • Expansion: Optional Expansion Slot PCIex8
    • Other features: Modular Design with Panel Size 15”, Front IP66 Waterproof and Dustproof, Panel Mount, Fanless with Smart Thermal Control, Full Flat Design with Resistive or P-cap Touch, CE, FCC, VCCI Class B Passed
  • WLPM 924 S
    Wincomm WLPM-V22 22″ AMD Ryzen Modular Industrial Panel PC
    • Product Name: Wincomm WLPM-V22
    • Screen Size: 22″
    • CPU: AMD Ryzen CPU, V1605B, QC, 2GHz, 12-25W
    • RAM: Dual Channel DDR4 2400 MHz (V1605B/ V1202B), 32 GB
    • Expansion: Optional Expansion Slot PCIex8
    • Other features: Modular Design with Panel Size 21.5”, Front IP66 Waterproof and Dustproof, Panel Mount, Fanless with Smart Thermal Control, Full Flat Design with Resistive or P-cap Touch, CE, FCC, VCCI Class B Passed
  • WMP 19K main
    Wincomm WMP-19K GTX 1060 19″ Medical AI Panel PC
    • Product Name: Wincomm WMP-19K GTX 1060
    • Screen Size: 19″
    • CPU: Intel 8th/9th Generation Core i5/i7
    • RAM: Supports Dual Channel DDR4 up to 64GB
    • Expansion: Support PCIe Expansion for Intel Movidius Vision AI Card
    • Other features: Anti-Bacteria (MRSA) Plastic Housing & Touch, 19″ 1280×1024 LCD Diagnostic Panel, EN/UL 60601-1 Safety & EMC Latest Version & MDR Certification Ready, Independent GeForce GTX 1060 Graphic Card with 6GB dedicated video memory
  • WMP 24K main
    Wincomm WMP-24K RTX 2060 23.8″ Medical AI Panel PC
    • Product Name: Wincomm WMP-24K RTX 2060
    • Screen Size: 23.8″
    • CPU: Intel 8th/9th Generation Core i7/i5
    • RAM: Two 2666 MHz DDR4 SODIMM socket support dual Channel, non-ECC, up to 64GB
    • Expansion: Optional PCIe Expansion for Intel Movidius AI Kits
    • Other features: 23.8″ 16:9 1920 x 1080 FHD & Optional 3840 X 2160 UHD Diagnostic Panel, Medical Latest MDR/EN/UL 60601-1 & 60601-1-2 Certifications, Anti-bacteria Hospital White Plastic Housing, Front IP65 Ingress Protection & IPX1 Whole System, Optional Independent GeForce RTX 2060 Graphic Card
  • EC500 CSSide200824 w600
    DFI EC500-CS 8th/9th Gen 5G Fanless Embedded System
    • Product Name: DFI EC500-CS
    • System Type: Fanless Embedded System
    • CPU: 8th/9th Gen Intel Core
    • RAM: Supports DDR4 SODIMM up to 64GB
    • Expansion: 3 M.2 slots support NVMe
    • Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Rich I/O connectivity: 2 GbE, 4 COM, 4 USB 3.1, 2 USB 2.0 (Q370 only), Support 5G Communication, Operating Temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
  • WMP series
    Wincomm WMP-24H_MXM 23.8″ MXM Medical Panel PC
    • Product Name: Wincomm WMP-24H_MXM
    • Screen Size: 23.8″
    • CPU: Intel 7th generation Core i7/i5/i3/Celeron
    • RAM: Two 2133 MHz DDR4 SODIMM socket support dual Channel, non-ECC, up to 32GB
    • Expansion: MXM 3.0 Module by Project Support, M.2 type SATA SSD
    • Other features: Highest Level EMC 4.0/ Safety 3.1 Certification Ready, Integrated Hot-Swappable Batteries, 24/7 Run-Time, Support Intel vPro by Optional i7/i5 CPU, Support i-Control Management for Power /Thermal /Battery, FHD Capture Card as Option, Low Noise Smart Fan Solution
  • EC90ASide210324 w600
    DFI EC90A-GH AMD Ryzen Ultra Compact Fanless Embedded System
    • Product Name: DFI EC90A-GH
    • System Type: Ultra Small Mini PC Fanless Embedded System
    • CPU: AMD Ryzen Embedded R1000 Series
    • RAM: DDR4 2400 MHz SODIMM down up to 4GB/8GB (memory onboard)
    • Expansion: 1 x Mini-PCIe (PCIe signal)
    • Other features: Ultra Small Size: 110 x 80mm x 60mm (W x H x D), User-friendly design for installing SIM card, I/O: 1 Intel GbE, 1 USB 3.1 Gen 2, 2 Micro HDMI, 10-Year CPU Life Cycle Support Until Q1’30 (Based on AMD Roadmap)
  • ECX700 ADP 1
    DFI ECX700-ADP 12th Gen Outdoor Ruggedized IPC67 Mini PC
    • Product Name: DFI ECX700-ADP
    • System Type: Outdoor Ruggedized IPC67 Box PC
    • CPU: Intel Alder Lake-P Processor i5-1245UE / i7-1265UE
    • RAM: Supports DDR4 memory
    • Expansion: Multiple I/O interfaces for versatile connectivity
    • Other Features: IP67-rated waterproof and dustproof design, extreme ruggedization to IEC 60068-2-64, wide operating temperature range (-20 to 70°C)
  • ECX700 ALSide201126R2 W600
    DFI ECX700-AL Outdoor Ruggedized IPC67 Grade Box PC
    • Product Name: DFI ECX700-AL
    • System Type: Ruggedized Outdoor IoT IP67 Fanless Embedded System
    • CPU: Intel Atom Processor E3900 Series
    • RAM: 4GB DDR3 onboard, 64G eMMC
    • Expansion: 1 x Full-size Mini PCIe for 4G LTE module, 1 x Full-size Mini PCIe for Canbus, 1 x M.2 2230 (USB2.0/PCIe) for WiFi module
    • Other features: Ruggedized IPC67 Grade Box PC, Outdoor IoT Gateway Application, Operating temperature: -40° to 70° C, 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap)
  • WMP series
    Wincomm WMP-22G 21.5″ Medical Cart Panel PC
    • Product Name: Wincomm WMP-22G
    • Screen Size: 21.5″
    • CPU: Kabylake 7th generation Intel Core i7/i5/i3/Celeron (15W max.)
    • RAM: Two 2133 MHz DDR4 SODIMM socket support dual Channel, non-ECC, up to 32GB
    • Expansion: M.2 type SATA SSD
    • Other features: EMC 4.0/ Safety 3.1 certification ready, Integrated hot-swappable batteries, 24/7 run-time, Support Intel vPro technology by CPU, Support remote monitor / control / device update sw, FHD capture card as option
  • WMP series
    Wincomm WMP-22H_MXM 21.5″ MXM Medical Panel PC
    • Product Name: Wincomm WMP-22H_MXM
    • Screen Size: 21.5″
    • CPU: Kabylake 7th generation Intel Core i7/i5/i3/Celeron processor (15W max.)
    • RAM: Two 2133 MHz DDR4 SODIMM socket support dual Channel, non-ECC, up to 32GB
    • Expansion: MXM 3.0 Module by Project Support, M.2 type SATA SSD
    • Other features: Highest Level EMC 4.0/ Safety 3.1 Certification Ready, Integrated Hot-Swappable Batteries, 24/7 Run-Time, Support Intel vPro by Optional i7/i5 CPU, Support i-Control Management for Power /Thermal /Battery, FHD Capture Card as Option, Low Noise Smart Fan Solution
  • EC100 XNX side w600
    DFI EC100-XNX NVIDIA Jetson Xavier NX PoE Embedded System
    • Product Name: DFI EC100-XNX
    • System Type: Industrial PC
    • CPU: NVIDIA Jetson Xavier NX
    • RAM: 8Gb
    • Expansion: 20 pins with 1 x UART, 2 x I2C, 9 x GPIOs
    • Other features: Fully supports NVIDIA Jetson Xavier NX, 8 x 10/100 MbE with PoE, Fanless chassis technology, 1 x HDMI 2.0a/b Type-A supports 4K@60Hz
  • APC 3072 1
    APLEX APC-3072 7″ Fanless IP66 E3845 Vehicle Management Panel PC
    • Product Name: Aplex APC-3072
    • Screen Size: 7″
    • CPU: Intel Atom Processor E3845
    • RAM: 4GB DDR3L Memory onboard
    • Expansion: 1 x Mini-PCIe full size for option 3G/LTE/GPS, 1 x Mini-PCIe half size slot for option WIFI/BT, 1 x SIM slot onboard, 1 x SMA connector for option GPS antenna
    • Other features: High Brightness LED Backlight LCD, Rugged Engineering Plastics Enclosure and Fanless Design, 6~36V DC Wide-ranging Power Input, HDD/SSD: 1 x Micro SD onboard, 1 x mSATA MO-300 slot