DFI VC900-M8M NXP i.MX 8M In-Vehicle PC

  • Product Name: DFI VC900-M8M
  • System Type: In-Vehicle PC
  • CPU: NXP i.MX8 series
  • RAM: 16GB/64GB eMMC and micro SD card slot
  • Expansion: Rich I/O: 1 GbE, 2 COM, 1 CANBus, 2 USB 3.0, 1 Micro USB (OTG)
  • Other features: Wide voltage: 936V vehicle power input with ACC/IGN function, Wide temperature: -20°C65°C operation without active fan

Description

DFI VC900-M8M is an energy-efficient and low-power system is powered by the NXP I.MX8M processor. The VC900-M8M is equipped with a 6-axis sensor (IMU), enabling fleet managers to gain better insights into driving behavior, motion sensing, sudden braking, and impact detection. With these capabilities, fleet managers can enhance their management strategies and promote safer driving practices.

In addition to the advanced sensor technology, DFI has collaborated with VicOne, a subsidiary of Trend Micro, to introduce a vehicle network security solution. This strategic partnership brings forth automotive cybersecurity solutions, bolstering the overall vision of road safety and providing robust protection against cyber threats.

DFI’s focus on the smart transportation industry and their commitment to incorporating innovative technologies such as the NXP I.MX8M processor and VicOne’s cybersecurity solutions showcase their dedication to creating reliable and secure systems for the automotive sector. By leveraging their expertise in embedded systems, DFI aims to contribute to the advancement of road safety and cybersecurity in the ever-evolving landscape of smart transportation.

Key Features

  • ARM-Based In-vehicle system
  • NXP i.MX8 series
  • 16GB/64GB eMMC and micro SD card slot
  • Rich I/O: 1 GbE, 2 COM, 1 CANBus, 2 USB 3.0, 1 Micro USB (OTG)
  • Wide voltage: 9~36V vehicle power input with ACC/IGN function
  • Wide temperature: -20°C~65°C operation without active fan

Specification

System

Processor
NXP i.MX8M Quad, Cortex-A53 1.3GHz (by model)
NXP i.MX8M Dual, Cortex-A53 1.3GHz (by model)
Memory
On board memory 2GB/4GB (by model)
Single channel LPDDR4 up to 3200 MHz

Display and Touch Screen

Sensor
3 axis Accelerometer (option)

Graphics

Display
1 x HDMI
resolution up to 1920×1080 @ 60 Hz

Storage

External
Micro SD card slot
Internal
eMMC 5.1 16GB on board, support up to 64GB (optional)

LED

Indicators
1 x Status LED

Front I/O

Ethernet
1 x Giga Lan, RJ-45
Serial
1 x RS-232/422/485
1 x RS-232(TX,RX,RTS,CTS)
2 x RS232 (TX,RX)
USB
2 x USB 3.0, type A
1 x OTG, micro USB
Display
1 x HDMI
Audio
with Amplifier to support 2W speaker (optional)
1 x Line-out & 1 x MIC-in (internal header)
Buttons
1 x Power reset button
CANBus
1 x CANbus, DB-9

Rear I/O

Antenna
4 x Antenna holes for LTE 4G, WiFi and GPS

Power

Type
Wide range 9~36V with ACC/IGN function
Connector
3-pole terminal block

OS Support

Linux
Yocto Linux 2.5
Android
Android 9.0 (option)

Environment

Operating Temperature
-20 to 65°C
Storage Temperature
-40 to 85°C
Relative Humidity
10 to 90% RH (non-condensing)

Mechanism

Construction
Sheet Metal
Mounting
DIN-Rail mount
Wall mount
Dimensions (W x H x D)
200 x 120 x 45mm
Weight
1.9kg
Colour
Black

Standards and Certifications

Shock
Operating/non-operating: MIL-STD-810G Method 516.6, Procedure 1
Vibration
Operating/non-operating: MIL-STD-810G Method 514.6, Category 4
Certifications
CE, FCC, e-Mark

Packing List

Packing List
1 x VC900-M8M system unit
1 x 3-pole terminal block cable for power input
1 x Wall mount bracket/screw pack
1 x Quick installation guide

Country of Origin

Country of Origin
Taiwan

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

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Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

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Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

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Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

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