RAM: 1 x 204-pin DDR3L SO-DIMM, 8 GB pre-installed
Expansion: M.2 A-key slot for expansion
Other features: Two GbE LAN ports, Triple USB 3.2 Gen1, Pre-installed a Mustang-MPCIE-MX2 that has two Intel Myriad X VPUs for AI deep learning workload consolidation
Other features: Modular Design with Panel Size 23.8”, Front IP66 Waterproof and Dustproof, Panel Mount, Fanless with Smart Thermal Control, Full Flat Design with Resistive or P-cap Touch, CE, FCC, VCCI Class B Passed
Other features: Modular Design with Panel Size 15”, Front IP66 Waterproof and Dustproof, Panel Mount, Fanless with Smart Thermal Control, Full Flat Design with Resistive or P-cap Touch, CE, FCC, VCCI Class B Passed
Other features: Modular Design with Panel Size 21.5”, Front IP66 Waterproof and Dustproof, Panel Mount, Fanless with Smart Thermal Control, Full Flat Design with Resistive or P-cap Touch, CE, FCC, VCCI Class B Passed
Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Rich I/O connectivity: 2 GbE, 4 COM, 4 USB 3.1, 2 USB 2.0 (Q370 only), Support 5G Communication, Operating Temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
RAM: Two 2133 MHz DDR4 SODIMM socket support dual Channel, non-ECC, up to 32GB
Expansion: MXM 3.0 Module by Project Support, M.2 type SATA SSD
Other features: Highest Level EMC 4.0/ Safety 3.1 Certification Ready, Integrated Hot-Swappable Batteries, 24/7 Run-Time, Support Intel vPro by Optional i7/i5 CPU, Support i-Control Management for Power /Thermal /Battery, FHD Capture Card as Option, Low Noise Smart Fan Solution
System Type: Ultra Small Mini PC Fanless Embedded System
CPU: AMD Ryzen Embedded R1000 Series
RAM: DDR4 2400 MHz SODIMM down up to 4GB/8GB (memory onboard)
Expansion: 1 x Mini-PCIe (PCIe signal)
Other features: Ultra Small Size: 110 x 80mm x 60mm (W x H x D), User-friendly design for installing SIM card, I/O: 1 Intel GbE, 1 USB 3.1 Gen 2, 2 Micro HDMI, 10-Year CPU Life Cycle Support Until Q1’30 (Based on AMD Roadmap)
Expansion: Multiple I/O interfaces for versatile connectivity
Other Features: IP67-rated waterproof and dustproof design, extreme ruggedization to IEC 60068-2-64, wide operating temperature range (-20 to 70°C)
BVM Design and Manufacturing Services: The manufacturer behind the solutions you know
When a standard embedded design won’t suffice for what you need, you can always turn to BVM for help and use our custom design and manufacturing services.
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