IEI ITG-100AI Fanless Ultra Compact Size AI Embedded System
- Product Name: IEI ITG-100AI
- System Type: Fanless Ultra Compact Size AI Embedded System
- CPU: Intel Atom x5-E3930 1.3GHz (up to 1.8 GHz)
- RAM: 1x 204-pin DDR3L SO-DIMM slot pre-installed with 8 GB memory
- Expansion: M.2 A-key slot for WiFi Module
- Other features: Two GbE LAN ports, Two RS-232/422/485, Pre-installed Mustang-MPCIE-MX2, 2 x Intel Myriad X VPU for AI deep learning workload consolidation
Description
The ITG-100-AL uses Intel Atom X5-E3930 1.3GHz (burst speed up to 1.8GHz, dual core – TDP 6.5W) and provides up to 8GB memory (DDR3L SO-DIMM).
Ultra-compact Size
Where space limitation is a constraint, the IEI ITG-100-AL not only provides a palm-sized design to meet the tightest of space availabilities, but also comes with a capable selection of I/O ports.
The ITG-100-AL is operational across diverse range of temperatures, from -20°C through to +60℃, making it the perfect solution in the role of a data collection gateway across a variety of internal or external applications.
Key Features
- Intel Atom x5-E3930 1.3GHz (up to 1.8 GHz)
- Two GbE LAN ports
- Two RS-232/422/485
- M.2 A-key slot for WiFi Module
- Pre-installed Mustang-MPCIE-MX2, 2 x Intel Myriad X VPU for AI deep learning workload consolidation
Key Features of Intel® Movidius™ Myriad™ X VPU
- Native FP16 support
- Rapidly port and deploy neural networks in Caffe and Tensorflow formats
- End-to-End acceleration for many common deep neural networks
- Industry-leading Inferences/S/Watt performance
Ultra-compact Size
Space limitation is one of the constraints commonly seen in today’s industrial environment. Under tight restrictions, the ITG-100AI-AL not only provides palm-sized design to meet the space requirement, but also comes with adequate basic I/O interfaces for various application
Application
The ITG-100AI is pre-installed with a Mustang-MPCIE-MX2 AI accelerator card, which includes two Intel® Movidius™ Myriad™ X VPU, to provide a flexible AI inference solution. VPU is short for vision processing unit. It can run AI faster, and is well suited for low power consumption applications such as surveillance, retail and transportation. With the advantage of power efficiency and high performance to dedicate Deep Neural Networks (DNN) topologies, it is perfect to be implemented in AI edge computing device to reduce total power usage, providing longer duty time for the rechargeable edge computing equipment.
Surveillance | Retail | Transportation |
Fully Integrated I/O
Specification
Spec Item | Description |
---|---|
Form factor | |
SBC Form Factor | CPU: Intel® Atom™ x5-E3930 1.3GHz (up to 1.8 GHz, dual core, TDP=6.5W) Chipset: SoC System Memory: 1x 204-pin DDR3L SO-DIMM slot pre-installed with 8 GB memory Power: Input : 2-pin terminal block: 9~36V DC-in Reliability: Operating Shock: Half-sine wave shock 5G, 11ms, 100 shocks per axis, IEC68-2-27 Operating Vibration: MIL-STD-810G 514.6C-1 Safety/EMC: CE/FCC |
I/O Interface | |
I/O Ports | USB: 2 x USB 3.0 Ethernet:2 x RJ-45 PCIe GbE by Intel® I211 controller COM Port:2 x RS-232/422/485 (DB-9/RJ45) Display:1 x VGA |
Expansion Slots | |
Expansion Slots | M.2: 1 x M.2 A key 2230 (PCIe by 1, USB2.0) PCIe Mini: Pre-installed Mustang-MPCIE-MX2 |
System | |
Cooling method / System Fan | Fanless |
Drive Bays | SATADOM: Pre-installed 128GB eMMC: 1 x eMMC 5.0 support (up to 32GB optional) Micro SD: 1 x Micro SD Slot |
Indicator & Buttons | |
Buttons | 1 x Power Button 1 x Reset Button 1 x AT/ATX Switch |
Indicators | 1 x LED for HDD (Yellow) 1 x LED for Power (Green) |
Physical Characteristics | |
Construction | Extruded aluminum alloy |
Colour | |
Colour | Blue & Silver |
Dimensions | |
Dimensions | 137 x 102.8 x 49.4 (WxDxH) (mm) |
Environment | |
Operating Temperature | -20°C ~ 50°C with air flow |
Humidity | 10% ~ 95%, non-condensing |
Ordering Information
Item No. | Description |
---|---|
ITG-100AI-E1/8GB/S-R10 | Fanless embedded system, Intel®Apollo Lake x5-E3930 1.3GHz (up to 1.8GHz, dual core), 8GB DDR3L pre-installed memory, VGA, M.2, COM, 9-36V DC, Mustang-MPCIE-MX2 and RoHS |
Related
Datasheet
Download(944 KB)BVM Customisation Service
If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish.
If you’re unable to find an off-the-shelf product that meets your specific requirements, don’t hesitate to contact our in-house design team. They possess the expertise to customise an existing product to your exact specifications or embark on a fresh design journey to create a customized solution tailored to your requirements. Our design professionals are dedicated to delivering exceptional results, ensuring that the final product not only meets but exceeds your expectations. When you collaborate with our team, you open the door to a world of possibilities, where innovation and creativity converge to bring your vision to life.
Whether it’s modifying an existing product or crafting an entirely new one, our design experts are committed to providing you with a comprehensive, end-to-end solution that perfectly suits your needs. Your satisfaction is our top priority, and we’re here to turn your ideas into reality.
Design | Develop | Test | Manufacture
With over three decades of experience in designing custom industrial and embedded computer and display solutions across a wide array of industries, we’re here to turn your ideas into reality
Here’s a selection of our design, manufacturing & associated services: –
Design to Order: OEM/ODM Embedded Product Design ServicesFor customers designing a brand-new product from scratch or working with an existing prototype.
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Build to Order: Embedded Computer Design and Customisation ServicesTake an existing system and we can:
Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs Embedded Software Services : Configuration, Integration and DeploymentPorting, Integration & Deployment
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ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:
Testing |
Materials Management |
Logistics and Tracking |
External Manufacturing |
• Burn in Test • Temp / Thermal Testing • Environmental Testing • Safety Testing • Software Compatibility Test |
• Vendor Selection and Component Procurement • Product Traceability • Obsolescence, End of Life and Last Time Procurement Management • Simple to use on-line RMA System |
• Traceability of Shipments • Product Labelling • OEM/Branded Packaging • System Branding • Custom Labels |
• Surface Mount: – High Speed Placement • Conventional Through Hole Insertion & Assembly • Automated Optical Inspection • Bespoke PCB Test |
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Related
Manufacturer : IEI
CPU
- Powered By : Intel
- CPU Family : Atom
- CPU Generation : Apollo Lake
- CPU Model : x5-E3930
Memory
- Memory Installed : 8Gb
- Memory Slots : 1
- Memory Type : DDR3
I/O and Expansion
- Expansion Slots : M.2, Micro SD, Mini PCIe
- LAN Ports : 2
- Serial Ports : 2
- USB 2 Ports :
- USB 3 Ports : 2
- USB 3.X / USB C / USB 4.0 :
- Video Output : VGA
- Multi Display :
Operating System
- OS :
Certifications
- Certifications :
Features
- 5G-4G-GPS :
- Artificial Intelligence Use : Artificial Intelligence, Edge Computing, Machine Learning, Machine Vision
- IP Rating :
- Rugged : Yes
- System Type : Box PC
- Wide Temp : Yes
Categories : All Industrial and Embedded Computers, Ultra Compact PCs | IoT and Edge Computers