CPU: Supports Intel 13th/12th-Gen Core 35W/ 65W LGA1700 CPU
RAM: Up to 64 GB DDR5 4800 SDRAM (two SODIMM slots)
Expansion: Patented Cassette for PCI/PCIe add-on card accommodation, Supports M.2 Gen4x4 NVMe and 2x SATA ports, MezIO interface for easy function expansion
Other features: Rugged, -25°C to 70°C fanless operation, Up to 5x 2.5GbE and 1x GigE ports with optional PoE+, supporting 9.5 KB jumbo frame, 1x USB 3.2 Gen2x2 type-C and 6x USB 3.2 Gen2x1 type-A ports, VGA/ DVI/ DP triple independent display, supporting 4K2K resolution
CPU: Intel 13th/12th-Gen Core 35W/ 65W LGA1700 CPU
RAM: Up to 32GB non-ECC DDR4 3200 SDRAM (one SODIMM slot)
Expansion: Supports 1x M.2 2280 Gen4 x4 NVMe and 1x 3.5″/2.5″ SATA HDD/SSD storage
Other features: Compact 212 x 165 x 80 mm footprint, Rugged, -10°C to 60°C fanless operation, 2x 2.5GbE and 4x USB3.2 Gen 1 with screw-lock, 4-CH isolated DI and 4-CH isolated DO (Nuvo-9505D only), VGA + DP dual display outputs
CPU: Intel 13th/12th-Gen Core 35W/ 65W LGA1700 CPU
RAM: Up to 32GB non-ECC DDR4 3200 SDRAM (one SODIMM slot)
Expansion: 1xM.2 2280 Gen4x4 NVMe and 1x hot-swappable HDD tray for storage
Other features: 212 x 165 x 63 mm low-profile design, Rugged, -25°C to 60°C fanless operation, 4x 2.5GbE with optional PoE+ and 4x USB3.2 Gen 1 with screw-lock, 4-CH isolated DI and 4-CH isolated DO, VGA + DP dual display outputs, Optional ignition power control
CPU: Intel 13th/12th-Gen Core 35W/ 65W LGA1700 CPU
RAM: Up to 32GB non-ECC DDR4 3200 SDRAM (one SODIMM slot)
Expansion: 1xM.2 2280 Gen4x4 NVMe and 1x hot-swappable HDD tray for storage
Other features: 212 x 165 x 63 mm low-profile design, Rugged, -25°C to 60°C fanless operation, 4x 2.5GbE with optional PoE+ and 4x USB3.2 Gen 1 with screw-lock, 4-CH isolated DI and 4-CH isolated DO, VGA + DP dual display outputs, Optional ignition power control
CPU: Intel Elkhart Lake Atom x6211E dual-core processor
RAM: Up to 32 GB DDR4-3200 SDRAM (one SODIMM slot)
Expansion: M.2 2280 M key SATA storage, One M.2 B key socket supporting 5G/4G 3042/3052 modules, One M.2 E key socket for WiFi 5/WiFi 6 modules
Other features: 52 x 89 x 112 mm extremely compact form factor, Rugged -25°C to 70°C fanless wide-temperature operation, Two GigE ports, two USB 3.1 Gen1 ports, and two USB 2.0 ports, One COM port with RS-232/422/485 modes and three RS-232 COM ports
System Type: Ultra-compact Fanless Embedded Computer
CPU: Intel Elkhart Lake Atom x6425E quad-core 2.0GHz/3.0GHz 12W processor
RAM: Up to 32 GB DDR4-3200 SDRAM by one SODIMM socket
Expansion: M.2 2280 M key SATA interface, MezIO compatible
Other features: Rugged -25 °C to 70 °C fanless operation, 2x 2.5GbE PoE+ ports and 1x 2.5GbE port with screw-lock, 2x USB 3.1 Gen1 and 2x USB 2.0 ports with screw-lock, Dual DP display outputs supporting 4096 x 2160 resolution, Front I/O access DIN-mounting design
CPU: Intel Elkhart Lake Atom x6425E quad-core 2.0GHz/3.0GHz 12W processor
RAM: Up to 32 GB DDR4-3200 SDRAM by one SODIMM socket
Expansion: 1x M.2 2280 M key socket for SATA SSD
Other features: IP65-rated waterproof and dustproof design, 2x 2.5GbE Ethernet ports via M12 X-coded connectors, 1x isolated RS-232 and 1x isolated RS-422/485 via M12 A-coded connectors, 2x USB 2.0 ports via M12 A-coded connectors, 1x VGA port via M12 A-coded connector, 8-35V DC input with ignition power control input via M12 A-coded connector
CPU: Latest and Powerful Intel Atom x6000E Processor (Elkhart Lake-PU)
RAM: 2 x DDR4 3200MHz SO-DIMM, up to 32GB (In-Band ECC)
Expansion: Most Flexible IOs and Expansion for Industrial Applications
Other features: Fan-less and Rugged Design, Wide Temperature Operation (-40°C to 70°C), 6-36VDC Wide Range Power Inputs, Intel TCC and TSN Support for Real-Time Computing, DIN Rail or Wall Mount Options, 4 x Intel 1G LAN (2 Support IEEE 802.3AF PoE Ports), 1 x Intel 2.5G LAN, Support Intel IN-Band ECC
System Type: 13th Gen Raptor Lake Rugged Industrial IoT Controller
CPU: Intel 13th Gen Core Embedded & Industrial Processors
RAM: Scalable power and performance in BGA for edge controller
Expansion: High performance Intel Iris Xe Graphics architecture
Other features: Fan-less and Rugged Design, Wide Temperature Operating (-40°C to 70°C), 9V ~ 36VDC Wide Range Power Inputs, Intel TCC and TSN Support for Real-Time Computing, 3 x Intel i226-IT LAN (Support vPro), 2 x Intel i210-AT LAN (Support IEEE 802.3AF PoE), Support Intel IN-Band ECC
RAM: Two 260-pin SODIMM up to 32GB (CM238 supports ECC) Dual Channel DDR4 2400MHz
Expansion: Not specified
Other features: Support Adaptive Display Platform, Supports 9~36V Power Input, Multiple Panel Sizes with Resistive/P-Capacitive Touch Screen, IP65 Front Panel Protection, 15-Year CPU Life Cycle Support Until Q1′ 32 (Based on Intel IOTG Roadmap)
CPU: 11th Gen. Intel Tiger Lake Core i3/i5 Processor
RAM: 2 x 260Pin SO-DIMM DDR4 slot, up to 64GB 3200MHz
Expansion: Expansion via full-size mini-PCIe and M.2 slots
Other features: Flat Front Panel Touch Screen with IP66 front bezel, Fanless Design, DC 9~36V Wide-Ranging Power Input, Supports TPM2.0 hardware security, Panel Mounting Kit
CPU: 11th Gen. Intel Tiger Lake Core i3/i5 Processor
RAM: 2 x 260Pin SO-DIMM DDR4 slot, up to 64GB 3200MHz
Expansion: Expansion via full-size mini-PCIe and M.2 slots
Other features: Flat Front Panel Touch Screen with IP66 front bezel, Fanless Design, DC 9~36V Wide-Ranging Power Input, Supports TPM2.0 hardware security, High Brightness 1,000 nits (optional)
Features: Projected Capacitive Multi-touch or Resistive Touch, IP Rating: IP65 Front Panel, Support 3 Signal Interfaces: VGA/DVI/HDMI, Support Modular Extended Display: 1 x HDBaseT / 2 x HDBaseT / Wifi Display, Various Mounting Type: VESA Mount 75 / Panel Mount, Advanced Voltage: Support USB Type C (Optional)
Features: Projected Capacitive Multi-touch or Resistive Touch, IP Rating: IP65 Front Panel, Support 3 Signal Interfaces: VGA/DVI/HDMI, Support Modular Extended Display: 1 x HDBaseT / 2 x HDBaseT / Wifi Display, Various Mounting Type: VESA Mount 75 / Panel Mount, Advanced Voltage: Support USB Type C
Product Name: Winmate IP65 USB C Industrial Touch Display Series
Screen Size: 7″ to 15.6″
Resolution: 1024 x 600, 1280 x 800, 1024 x 768, 1920 x 1080
Features: USB Type-C connectivity, durable chassis design, VESA mount compatibility, PCAP touch technology, and front IP65 rating for dust and water protection
CPU: 12th Generation Intel Core with Intel H610E/Q670E/R680E
RAM: Supports DDR4 SODIMM up to 64GB
Expansion: Three M.2 slots
Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Rich I/O connectivity: 2 GbE, 6 COM, 4 USB 3.1, 2 USB 2.0, Support 5G Communication, Operating Temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q4′ 36 (Based on Intel IOTG Roadmap)
BVM Design and Manufacturing Services: The manufacturer behind the solutions you know
When a standard embedded design won’t suffice for what you need, you can always turn to BVM for help and use our custom design and manufacturing services.
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