COM Express vs Qseven vs SMARC: A Comparison of Modular Embedded Computing Standards

What is Modular Embedded Computing?

As the demand for embedded computing systems continues to grow, there has been an increasing need for small, low-power and high-performance computing modules that can be used as building blocks for a wide range of applications. COM Express, Qseven and SMARC are three of the most popular modular standards for embedded computing, each with its own unique form factor and electrical interface. In this article, we will compare these three standards and discuss the key differences between them to help you decide which one is best suited for your specific application.

COM Express, Qseven and SMARC

COM Express, Qseven and SMARC are all types of computer modules that are used as building blocks for embedded systems. They are designed to be small and lightweight, with a focus on low power consumption and high performance, and are commonly used in applications such as industrial automation, medical devices and transportation systems.

Here is a brief overview of the main differences between these types of modules:

• COM Express (Computer on Module Express) is a modular standard that defines a common form factor and electrical interface for computer modules. It is based on the PCI Express and USB standards, and are designed to be used with a carrier board. COM Express modules are widely used in a variety of applications, including industrial automation, medical devices and transportation systems, due to their high performance and flexible I/O capabilities.
• Qseven (Qseven Module Standard) is another popular modular standard for embedded computing systems. Like COM Express, it is based on the PCI Express and USB standards, and are designed to be used with a carrier board. Qseven modules are smaller and more compact than COM Express modules, and are typically used in applications that require low power consumption and a high degree of ruggedness.
• SMARC (Smart Mobility ARChitecture) is a modular standard for small, low-power embedded computing systems that defines a common form factor and electrical interface for computer modules. SMARC modules are based on the PCI Express, USB and LPC (Low Pin Count) standards, and are designed to be used with a carrier board. SMARC modules are designed for use in mobile and handheld applications, and are known for their low power consumption and small size.

There are other types of computer modules in addition to COM Express, Qseven and SMARC, such as ETX (Embedded Technology eXtended), XTX (eXtended Technology eXtended) and SUMIT (Stackable Unified Module Interconnect Technology). Each of these standards has its own unique form factor and electrical interface, and are designed to meet the specific needs of different types of embedded systems.

COM Express

COM Express (Computer on Module Express) is a modular standard for embedded computing systems that defines a common form factor and electrical interface for computer modules. It is based on the PCI Express standards and is designed to be used with a carrier board.

There are several types of COM Express modules, which are defined by their size, power requirements, and electrical interface standards. The most common COM Express modules are:

• COM Express Basic: This is one of the the smallest and most basic type of COM Express module, with a size of 95mm x 125mm and a minimum of four PCI Express lanes.
• COM Express Compact: This is a smaller version of the basic type, with a size of 84mm x 55mm and a minimum of two PCI Express lanes.
• COM Express Mini: This is the smallest COM Express module, with a size of 74mm x 42mm and a minimum of one PCI Express lane.
• Mini type with power connectors: This is a version of the mini type that includes power connectors for external power supply.
• Standard type: This is a larger COM Express module, with a size of 125mm x 95mm and a minimum of eight PCI Express lanes.

The different types of COM Express modules, including Type 2, Type 6, Type 7 and Type 10, refer to specific combinations of processor, chipset and graphics options, as well as various performance and power characteristics. Here’s a brief overview of the differences between each type:

• COM Express Type 2: These modules are designed for low-power, mobile computing applications, and typically feature Intel Atom, Celeron, or Pentium processors, with limited graphics capabilities.
• COM Express Type 6: These modules are the most common type of COM Express module, designed for high-performance embedded computing applications, and feature Intel Core i7/i5/i3 or Xeon processors, with integrated graphics or optional discrete graphics support.
• COM Express Type 7: These modules are designed for network and storage applications that require high-speed data transfer and multiple Ethernet ports, and typically feature Intel Xeon-D or Atom processors, with integrated 10GbE Ethernet.
• COM Express Type 10: These modules are designed for small form factor applications that require low power consumption, and typically feature Intel Atom or Celeron processors, with integrated graphics or optional discrete graphics support.

Qseven

Qseven (Qseven Module Standard) is a modular standard for small, low-power embedded computing systems that defines a common form factor and electrical interface for computer modules. There are several types of Qseven modules, which are defined by their size, power requirements and electrical interface standards. The most common types of Qseven modules are:

• Type 1: This is the smallest and most basic type of Qseven module, with a size of 70mm x 70mm and a maximum power consumption of 7 watts.
• Type 2: This is a slightly larger Qseven module, with a size of 70mm x 100mm and a maximum power consumption of 15 watts.
• Type 3: This is a larger Qseven module, with a size of 95mm x 95mm and a maximum power consumption of 25 watts.
• Type 4: This is the largest Qseven module, with a size of 95mm x 125mm and a maximum power consumption of 25 watts.

SMARC

SMARC (Smart Mobility ARChitecture) is a modular standard for small, low-power embedded computing systems that defines a common form factor and electrical interface for computer modules. It is based on the PCI Express, USB and LPC (Low Pin Count) standards, and are designed to be used with a carrier board.

There are several types of SMARC modules, which are defined by their size, power requirements, and electrical interface standards. The most common types of SMARC modules are:

• SMARC 2.0: This is the latest version of the SMARC standard, with a size of 82mm x 50mm and a maximum power consumption of 7 watts. It is based on the PCI Express 3.0, USB 3.1 and LPC standards.
• SMARC 2.1: This is an updated version of the SMARC 2.0 standard, with a size of 82mm x 50mm and a maximum power consumption of 7 watts. It is based on the PCI Express 3.0, USB 3.1, and LPC standards, and adds support for MIPI-DSI and MIPI-CSI interfaces.
• SMARC 1.1: This is an older version of the SMARC standard, with a size of 82mm x 70mm and a maximum power consumption of 15 watts. It is based on the PCI Express 2.0, USB 2.0 and LPC standards.

Each type of module (COM Express, QSEVEN and SMARC) has a different set of electrical interface standards, which define the types and number of connectors, signals and power requirements for the module. It is important to choose the right type of module for your application based on your specific requirements for size, power consumption and electrical interface standards.

Modular Embedded Computing Examples

Here are a few examples of industries that commonly use Embedded Computing modules:

• Industrial automation: Embedded Computing modules are often used in industrial automation systems due to their ability to withstand harsh environments and support a wide range of I/O interfaces.
• Medical devices: Embedded Computing modules are commonly used in medical devices such as diagnostic equipment, monitoring systems, and patient data systems due to their compact size, low power consumption and high performance.
• Transportation systems: Embedded Computing modules are used in transportation systems such as trains, buses and aircraft due to their ability to withstand vibration and extreme temperatures, as well as their high-speed communication capabilities.
• Military and aerospace: Embedded Computing modules are used in military and aerospace applications due to their ruggedness, high performance and ability to support a wide range of I/O interfaces.
• Telecommunications: Embedded Computing modules are commonly used in telecommunications systems such as routers, switches and base stations due to their high performance and ability to support a wide range of I/O interfaces.

Designing a Carrier Board for an Embedded Computing Module

Designing a PCB carrier board for a COM Express, SMARC or Qseven module involves a number of considerations, including the following:

• Mechanical compatibility: The carrier board must be mechanically compatible with the module, which means it must have the correct mounting holes, connectors, and other mechanical features to securely hold and connect the module.
• Electrical compatibility: The carrier board must also be electrically compatible with the module, which means it must have the correct connectors, signals, and power requirements to properly interface with the module.
• System requirements: The carrier board must also be designed to meet the specific requirements of the system in which it will be used, such as the required I/O interfaces, power supply, and other features.
• EMI/EMC considerations: The carrier board should be designed to minimize EMI (electromagnetic interference) and meet EMC (electromagnetic compatibility) standards to ensure that it does not interfere with other electronic devices and is resistant to external interference.
• Cost and manufacturing considerations: The carrier board should be designed to be cost-effective and suitable for mass production.

The design process for a carrier board for any of these types of modules will involve selecting the appropriate connectors and components, laying out the PCB and verifying that the design meets the necessary mechanical, electrical and system requirements. It is important to carefully plan and test the design to ensure that the carrier board will function properly and meet the needs of the intended application.

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