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Industrial Computers | Embedded Systems | Boards & Modules

  • WPC 767F S

    Wincomm WPC-767F Edge AI Fanned Medical PC

    • Product Name: Wincomm WPC-767F
    • System Type: Edge AI Fanned Medical PC
    • CPU: Powerful 8th/9th Gen. Intel Core i7/i5, 35W Max.
    • RAM: Supports Dual Channel DDR4 SODIMM up to 32GB
    • Expansion: 1 X PCIex16 (25W), 1 X PCIex4, 1 X Mini-PCIe
    • Other features: Medical Grade 4th UL/EN 60601-1 Certified, Smart Fan w/Hospital White Housing, Support RAID 0,1 w/Doorway 2nd Storage, HDD Anti-vibration mechanism, Rich I.O., Up to 6 X USB, 1 X VGA/DVI-D/DP, 2 LAN & 2 COM.
  • ES220 CSSide200612 w600

    DFI ES220-CS High Performance 9th/8th Gen iCore Embedded System

    • Product Name: DFI ES220-CS
    • System Type: High Performance 9th/8th Gen iCore Embedded System
    • CPU: 8th/9th Gen Intel Core Processors with Intel C246/Q370/H310 Chipset
    • RAM: 2 DDR4 SODIMM up to 64GB
    • Expansion: Single/Triple storage: 1 M.2 SSD + 2 2.5″ SSD (option) (with RAID supported)
    • Other features: Rich I/O connectivity: 2 Intel GbE, 4 USB 3.1, 2 USB 2.0, 2 COM, 2 HDMI 2.0 Support resolution 4K@60Hz, Acoustic level support full load 36dB @operating temperature 45° C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
  • FS053

    DFI FS053 NXP i.MX6 2.5″ Fanless Pico-ITX SBC

    • Product Name: DFI FS053
    • Motherboard Form Factor: 2.5″ Pico-ITX
    • CPU: NXP i.MX6 Processor
    • RAM: DDR3L SDRAM memory down, up to 4GB
    • Expansion: 1 Mini PCIe, 1 SD
    • Other features: Dual independent displays: HDMI + LVDS, Rich I/O: 2 GbE, 2 COM, 4 USB 2.0, 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on NXP Roadmap)
  • PPC F 1

    IEI PPC-FxxD Series 15″ – 18.5″ 8th Gen Industrial Panel PC Series

    • Product Name: EI PPC-FxxD
    • Screen Size: 15″ – 18.5″ 
    • CPU: 8th Gen Intel Whiskey Lake-U Processors
    • RAM: 2 x 260-pin 2400 MHz dual-channel DDR4 unbuffered SO-DIMM
    • Expansion: Support NVMe SSD
      Other features: Low power consumption and fanless design, IP66-rated front panel for water and dust resistance, Touch screen with anti-UV / anti-glare coating, Support PoE PD power
  • EC102 XNX 1 1

    DFI EC102-XNX NVIDIA Jetson Xavier NX Embedded System

    • Product Name: DFI EC102-XNX
    • System Type: NVIDIA Jetson Industrial PC
    • CPU: NVIDIA Jetson Xavier NX
    • RAM: 8Gb
    • Expansion: 20 pins with 1 x UART, 2 x I2C, 9 x GPIOs
    • Other features: 91.4mm (W) x 70mm (H) x 76.6mm (D), Fanless chassis technology, 1 x HDMI 2.0a/b Type-A supports 4K@60Hz
  • ITG 100AI 1

    IEI ITG-100AI Fanless Ultra Compact Size AI Embedded System

    • Product Name: IEI ITG-100AI
    • System Type: Fanless Ultra Compact Size AI Embedded System
    • CPU: Intel Atom x5-E3930 1.3GHz (up to 1.8 GHz)
    • RAM: 1x 204-pin DDR3L SO-DIMM slot pre-installed with 8 GB memory
    • Expansion: M.2 A-key slot for WiFi Module
    • Other features: Two GbE LAN ports, Two RS-232/422/485, Pre-installed Mustang-MPCIE-MX2, 2 x Intel Myriad X VPU for AI deep learning workload consolidation
  • FS051

    DFI FS051 NXP i.MX6 2.5″ Fanless Pico-ITX SBC

    • Product Name: DFI FS051
    • Motherboard Form Factor: 2.5″ Pico-ITX
    • CPU: NXP i.MX6 Processor
    • RAM: DDR3L SDRAM memory down, up to 4GB
    • Expansion: 1 Mini PCIe, 1 SD, 1 SIM (Optional)
    • Other features: Dual independent displays: HDMI + LVDS, Rich I/O: 1 GbE, 3 COM, 5 USB 2.0, 1 CANBus, 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on NXP Roadmap)
  • tKINO ULT6 1

    IEI tKINO-ULT6 Intel iCore Tiger Lake USB4 Mini-ITX SBC

    • Product Name: IEI tKINO-ULT6
    • Motherboard Form Factor: Mini-ITX
    • CPU: Intel iCore Tiger Lake
    • RAM: Supports DDR4-3200 memory
    • Expansion: PCIe x8 Gen 4.0 slot (x4 signal)
    • Other features: Thin Mini-ITX form factor with 11th Gen. Intel Tiger Lake-UP3 Processor support, Wide range 9~36V DC Input, Support quadruple independent displays (HDMI, DP, eDP/LVDS, USB4), Dual Intel 2.5GbE LAN, M.2 A key for WIFI+Bluetooth (PCIe x1/USB 2.0), M.2 M key for Storage (PCIe x2/SATA)
  • M8M051

    DFI M8M051 NXP i.MX 8M 2.5″ Pico-ITX SBC

    • Product Name: DFI M8M051
    • Motherboard Form Factor: 2.5″ Pico-ITX
    • CPU: NXP i.MX 8M Processors
    • RAM: Single Channel LPDDR4 up to 3200 MHz
    • Expansion: Multiple Expansion: 1 M.2 B Key, 1 M.2 E Key
    • Other features: Single Display: HDMI/LVDS (HDMI: resolution up to 4096×2160 @60Hz / LVDS: resolution up to 1920×1080 @60Hz), Rich I/O: 1 Intel GbE, 3 COM, 2 USB 3.1 Gen1, 3 USB 2.0, 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on NXP Roadmap)
  • IEI POCi 3

    IEI 22” POCi-W22C 8th Gen Medical Grade Panel PC

    • Product Name: IEI POCi-W22C
    • Screen Size: 22”
    • CPU: 14nm 8th Generation Intel Whiskey Lake U
    • RAM: DDR4 SO-DIMM up to 64GB
    • Expansion: Modular PCIe x4 expansion slot
    • Other features: Aluminium front bezel (IP66) & PC/ABS rear cover, Chemical etching AG coating, Dual reading light, FHD IPS panel with optional DICOM preset module
  • IEI POCi 3

    IEI 24” POCi-W24C 8th Gen Medical Grade Panel PC

    • Product Name: IEI POCi-W24C
    • Screen Size: 24”
    • CPU: 14nm 8th Generation Intel Whiskey Lake U
    • RAM: DDR4 SO-DIMM up to 64GB
    • Expansion: Modular PCIe x4 expansion slot
    • Other features: Aluminium front bezel (IP66) & PC/ABS rear cover, Chemical etching AG coating, Dual reading light, FHD IPS panel with optional DICOM preset module
  • IDS 310AI 1

    IEI IDS-310AI Fanless Ultra Compact AI System

    • Product Name: IEI IDS-310AI
    • System Type: Fanless Ultra Compact Size AI System
    • CPU: Intel Celeron J3455 1.5GHz (up to 2.3GHz, quad-core, TDP 10W)
    • RAM: 1 x 204-pin DDR3L SO-DIMM, 8 GB pre-installed
    • Expansion: M.2 A-key slot for expansion
    • Other features: Two GbE LAN ports, Triple USB 3.2 Gen1, Pre-installed a Mustang-MPCIE-MX2 that has two Intel Myriad X VPUs for AI deep learning workload consolidation
  • CH961 front

    DFI CH961 8th/9th Gen Intel iCore Xeon COM Express Basic

    • Product Name: DFI CH961
    • Module Form Factor: COM Express Basic
    • CPU: 8th/9th Gen Intel iCore Xeon Celeron
    • RAM: Dual channel DDR4 2666MHz SODIMM up to 96GB
    • Expansion: Multiple expansion: 1 PCIe x16, 8 PCIe x1
    • Other features: Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI Supports three independent displays; DP++ resolution supports up to 4096×2304 @ 60Hz; Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
  • 3I110HW 1

    Lex 3I110HW Embedded 11th Gen Tiger Lake 3.5″ SBC

    • Product Name: Lex 3I110HW
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: 11th Gen Intel Tiger Lake-UP3 – i7 / i5 / i3 / Celeron
    • RAM: 2 x DDR4 SODIMM (Max. 64GB)
    • Expansion: Multiple Independent display: VGA, HDMI, DP, DP (Type C), eDP or LVDS; 3 x Intel GbE LAN, 1 x USB 3.0 (type C), 6 x USB 2.0; 4 x COM, 4DI / 4DO, 1 x Mini PCIe, 1 x SIM; 1 x M.2 B Key, 1 x M.2 M Key
    • Other features: TPM 2.0 (Optional), Battery Charger Function (3I110BW)
  • PALM 3A100DW R 1

    LEX PALM-3A100DW-R AMD Ryzen Embedded Computer

    • Product Name: Lex PALM-3A100DW-R
    • System Type: AMD Ryzen Embedded Computer
    • CPU: AMD Ryzen Embedded R1000 Series SoC
    • RAM: 2 x DDR4 2400 MHz SODIMM, Max. 32GB
    • Expansion: 2 x HDMI, 1 x DP, 3 x GbE, 4 x USB, 8DI / 8DO, 2 x COM, 1 x Mini PCIe, 2 x SIM, 1 x M.2
    • Other features: With Independent Three 4K Display