DFI M8M051 NXP i.MX 8M 2.5″ Pico-ITX SBC

2.5″ Pico-ITX, NXP i.MX 8M Series, 1 LPDDR4 SODIMM, 1 M.2 B, 1 M.2 E, 1 LAN, 1 Micro SD, 2 USB 3.1 Gen1, 3 USB 2.0, 3 COM, 1 HDMI/LVDS, Yocto 2.5 on eMMC, Android 9.0, -5 to 65°C, -30 to 80 °C

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Description

  • NXP i.MX 8M Processors
  • Single Channel LPDDR4 up to 3200 MHz
  • Single Display: HDMI/LVDS
  • HDMI: resolution up to 4096×2160 @60Hz / LVDS: resolution up to 1920×1080 @60Hz
  • Multiple Expansion: 1 M.2 B Key, 1 M.2 E Key
  • Rich I/O: 1 Intel GbE, 3 COM, 2 USB 3.1 Gen1, 3 USB 2.0
  • 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on NXP Roadmap)

Specification

System

Processor
i.MX 8M applications processors
NXP i.MX 8M Quad Cortex-A53, 1.5GHz (Commercial)
NXP i.MX 8M Dual Cortex-A53, 1.5GHz (Commercial)
NXP i.MX 8M Quad Cortex-A53, 1.3GHz (Industrial)
NXP i.MX 8M Dual Cortex-A53, 1.3GHz (Industrial)
Memory
2GB/4GB Memory Down
Single Channel LPDDR4 up to 3200 MHz

Graphics

Controller
GC7000 Lite
Feature
OpenVG 1.1, OGL ES 3.1, Vulkan, OCL 1.2 FP
VPU Decode: 4Kp60 HEVC H.265, VP9, 4Kp60 H.264
Display
1 x HDMI (default)
1 x LVDS
HDMI: resolution up to 4096×2160 @60Hz
LVDS: resolution up to 1920×1080 @60Hz
Single Display
HDMI or LVDS

Expansion

Interface
1 x M.2 B key 3042/2242 (USB 3.1 Gen1), Nano SIM slot support
1 x M.2 E key 2230 (PCIe x1/USB 2.0)

Audio

Audio Codec
SGTL5000

Ethernet

Controller
1 x AR8035 Ethernet (10/100/1000Mbps)

Rear I/O

Ethernet
1 x GbE (RJ-45)
Serial
1 x RS485
USB
2 x USB 3.1 Gen1
1 x Micro USB 2.0 (Download mode)
Display
1 x HDMI

Internal I/O

Serial
1 x RS232
1 x RS-232/422/485 (2 x 6 pin header, 1.27mm pitch)
USB
2 x USB 2.0 (1.27mm pitch)
Display
1 x LVDS LCD Panel Connector
1 x Backlight Power
Audio
1 x Audio (Line-out/Mic-in, 2.00mm pitch)
DIO
1 x 8-bit DIO (2 x 6 header, 1.27mm pitch)
SD
1 x Micro SD Slot
CANBus
1 x CANBus 2.0
I2C
1 x I2C (1.27mm pitch)
eMMC
Support eMMC 5.1 16GB on board (default)
Support up to 64GB (opt.)

Watchdog Timer

Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
Power
Type
Single 12V +/-10% DC
Connector
2-poles Terminal Block (default)
DC Jack (available upon request)
Consumption
TBD
RTC Battery
CR2032 Coin Cell

OS Support

OS Support
Yocto 2.5 on eMMC (default)
Android 9.0

Environment

Temperature
Operating: -5 to 65°C; -30 to 80 °C
Storage: -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
TBD

Mechanism

Dimensions
2.5″ SBC Form Factor
100mm (3.94″) x 72mm (2.83″)
Height
PCB: 1.6mm
Top Side: 15mm
Bottom Side: 4mm

Standards and Certifications

Certifications
CE, FCC, RoHS

Packing List

Packing List
1 M8M051 board
1 Terminal block for RS485 (COM3) 342-361021-000G
1 Heat sink A71-008150-000G

Country of Origin

Country of Origin
Taiwan

 

Ordering Information

  • M8M051-BCC-41QDC – Quad core Processor, 4GB Memory, 16GB eMMC, 1 GbE, 1 RS-485, 1 RS-232, 1 RS-232/422/485, 2 USB 3.1 Gen1, 3 USB 2.0, 12VDC, Fanless Thermal, -5 to 65°C
  • M8M051-BCC-21DLC – Dual core Processor, 2GB Memory, 16GB eMMC, 1 GbE, 1 RS-485, 1 RS-232, 1 RS-232/422/485, 2 USB 3.1 Gen1, 3 USB 2.0, 12VDC, Fanless Thermal, -5 to 65°C
  • M8M051-ECC-41QDI – Quad core Processor, 4GB Memory, 16GB eMMC, 1 GbE, 1 RS-485, 1 RS-232, 1 RS-232/422/485, 2 USB 3.1 Gen1, 3 USB 2.0, 12VDC, Fanless Thermal, -30 to 80°C
  • M8M051-ECC-21DLI – Dual core Processor, 2GB Memory, 16GB eMMC, 1 GbE, 1 RS-485, 1 RS-232, 1 RS-232/422/485, 2 USB 3.1 Gen1, 3 USB 2.0, 12VDC, Fanless Thermal, -30 to 80°C

Datasheet

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If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can design a new product from start to finish.

 

Design | Develop | Test | Manufacture

Here’s a selection of our design, manufacturing

& associated services: –

 

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a brand-new product from scratch or working with an existing prototype.DesignToOrder

Build to Order: Embedded Computer Design and Customisation Services​

Take an existing system and we can:BuildToOrder

  • Custom specification (CPU, Ram, I/O, Storage)
  • Chassis customisation and branding
  • Custom BIOS
  • Software – Custom OS Image
  • Custom Packaging and branding
  • Integrating newly designed or existing hardware into a larger system

Build to order Racks and Towers, Peli Case PCs and Mini-ITX PCs

Embedded Software Services : Configuration, Integration and Deployment

Porting, Integration & DeploymentEmbeddedSoftware

  • Windows image capture from customers HDD
  • Linux image capture from customers HDD
  • Windows / Linux Deployment from customers image
  • Custom Windows images, create and deploy
  • Update management
  • Custom Linux and Android images?
  • Custom BIOS

Manufacturer : DFI

Motherboard

  • Form Factor : Pico-ITX

CPU

  • Powered By : ARM
  • CPU Family : ARM
  • CPU Generation : ARM Cortex
  • CPU Model : Cortex A53
  • CPU Speed : 1.3Ghz, 1.5Ghz
  • CPU Cores : Dual Core, Quad Core

Memory

  • Memory Installed : 2Gb, 4Gb
  • Memory Slots :
  • Memory Type : 3200Mhz DDR4

I/O and Expansion

  • Expansion Slots : M.2
  • LAN Ports : 1
  • Serial Ports : 1
  • USB 2 Ports : 2
  • USB 3 Ports :
  • USB 3.1 Ports : 2
  • Video Output : HDMI
  • Multi Display :
  • Wireless Connectivity :

Operating System

  • OS : Android, Linux

Certifications

  • Certifications :

Industry

  • Industry :

Features

  • 24/7 Use :
  • 4G-GPS :
  • Artificial Intelligence Use :
  • ATEX :
  • High Performance :
  • Industrial :
  • In-Vehicle :
  • IoT : Yes
  • IP Rating :
  • Low Powered :
  • Mini-ITX :
  • Multi Displays :
  • NUC :
  • Other Features : CANBus, GPIO
  • PoE :
  • Rugged : Yes
  • Ryzen :
  • System Type : SBC
  • Touchscreen :
  • Whiskey Lake :
  • Wide Temp : Yes

Categories :