DFI QM370 i3-8100H 8th Gen Com Express Basic Module

• DFI 8th Gen Com Express Module – QM370 – i3-8100H
• Dual channel DDR4 2666MHz SODIMM up to 32GB
• Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI; Supports three independent displays
• eDP resolution supports up to 4096×2304 @ 60Hz
• Multiple expansion: 1 PCIe x16, 8 PCIe x1
• Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
• 15-Year CPU Life Cycle Support Until Q1′ 32 (Based on Intel IOTG Roadmap)

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Description

  • Dual channel DDR4 2666MHz SODIMM up to 32GB
  • Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI; Supports three independent displays
  • eDP resolution supports up to 4096×2304 @ 60Hz
  • Multiple expansion: 1 PCIe x16, 8 PCIe x1
  • Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
  • 15-Year CPU Life Cycle Support Until Q1′ 32 (Based on Intel IOTG Roadmap)

 

Specification

System
Processor
8th Generation Intel® Core™ Processors, BGA 1440
Intel® Xeon® E-2176M Processor, 6 Cores, 12M Cache, 2.7GHz (4.4GHz), 45W
Intel® Core™ i7-8850H Processor, 6 Cores, 12M Cache, 2.6GHz (4.3GHz), 45W
Intel® Core™ i5-8400H Processor, 4 Cores, 8M Cache, 2.5GHz (4.2GHz), 45W
Intel® Core™ i3-8100H Processor, 4 Cores, 6M Cache, 3.0GHz, 45W
Chipset
Intel® CM246 Chipset (Support ECC)
Intel® QM370 Chipset
Memory
Two 260-pin SODIMM up to 32GB
Dual Channel DDR4 2666MHz
BIOS
AMI SPI 128Mbit
Graphics
Controller
Intel® HD Graphics
Feature
OpenGL up to 4.5, DirectX 11, OpenCL 2.1
HW Decode: HEVC/H.265, H.264, M/JPEG, MPEG2, VC1/WMV9, VP8 (8-bit), VP9 (10-bit)
HW Encode: HEVC/H.265, M/JPEG, MPEG2, VP8
Display
1 x VGA/DDI (DDI available upon request)
1 x LVDS/eDP (eDP available upon request)
2 x DDI (HDMI/DVI/DP++)
VGA: resolution up to 1920×1200 @ 60Hz
LVDS: dual channel 24-bit, resolution up to 1920×1200 @ 60Hz
HDMI: resolution up to 4096×2160 @ 30Hz 24bpp
DVI: resolution up to 1920×1200 @ 60Hz
DP++/eDP: resolution up to 4096×2304 @ 60Hz
Triple Displays
VGA + LVDS + DDI or VGA + DDI 1 + DDI 2
eDP + 2 DDI (available upon request)
Expansion
Interface
1 x PCIe x16 or 2 x PCIe x8 (Gen 3)
8 x PCIe x1 or 2 x PCIe x4 or 4 x PCIe x2 (Gen 3)
1 x LPC
1 x I2C
1 x SMBus
2 x UART (TX/RX)
Audio
Interface
HD Audio
Ethernet
Controller
1 x Intel® I219LM with iAMT12.0 PCIe (10/100/1000Mbps)
I/O
USB
4 x USB 3.1
8 x USB 2.0
SATA
4 x SATA 3.0 (up to 6Gb/s)
RAID 0/1/5/10
DIO
1 x 8-bit DIO (Default 4 inputs and 4 outputs)
Watchdog Timer
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
Security
TPM
Available Upon Request
Power
Type
12V, 5VSB, VCC_RTC (ATX mode)
12V, VCC_RTC (AT mode)
Consumption
Typical: 12V @ 0.85A (13.07Watt)
Max.: 12V @ 5.75A (74.084Watt)
OS Support
OS Support
Windows: Windows 10 IoT Enterprise 64-bit
Linux
Environment
Temperature
Operating: 0 to 60°C, -40 to 85°C
Storage: -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
1,360,171 hrs @ 25°C; 892,642 hrs @ 45°C; 624,277 hrs @ 60°C excluding accessories
Calculation Model: Telcordia Issue 4
Environment: GB, GC – Ground Benign, Controlled
Mechanism
Compliance
PICMG COM Express® R2.1, Type 6
Dimensions (W x H x D)
COM Express® Basic
95mm (3.74″) x 125mm (4.9″)
Packing List
Packing List
1 CH960-CM246/QM370 board
1 Cooler (Height: 36.58mm): Wide Temp: A71-111100-010G, Standard: A71-111100-000G

 

Ordering Information

Model Name Part Number Description
CH960-QM370TS-8850H 770-CH9601-000G Cooler, Intel Core i7-8850H, 1 LVDS, 1 VGA, 1 LAN, 4 USB 3.0, 8 USB 2.0, 2 SODIMM DDR4, -40 to 85°C
CH960-CM246BS-2176M 770-CH9601-100G Cooler, Intel Xeon E-2176M, 1 LVDS, 1 VGA, 1 LAN, 4 USB 3.0, 8 USB 2.0, 2 SODIMM DDR4, 0 to 60°C
CH960-QM370BS-8850H 770-CH9601-200G Cooler, Intel Core i7-8850H, 1 LVDS, 1 VGA, 1 LAN, 4 USB 3.0, 8 USB 2.0, 2 SODIMM DDR4, 0 to 60°C
CH960-QM370BS-8400H 770-CH9601-500G Cooler, Intel Core i5-8400H, 1 LVDS, 1 VGA, 1 LAN, 4 USB 3.0, 8 USB 2.0, 2 SODIMM DDR4, 0 to 60°C
CH960-QM370BS-8100H 770-CH9601-700G Cooler, Intel Core i3-8100H, 1 LVDS, 1 VGA, 1 LAN, 4 USB 3.0, 8 USB 2.0, 2 SODIMM DDR4, 0 to 60°C

 

Datasheet

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BVM Customisation Service

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish.

 

If you’re unable to find an off-the-shelf product that meets your specific requirements, don’t hesitate to contact our in-house design team. They possess the expertise to customise an existing product to your exact specifications or embark on a fresh design journey to create a customized solution tailored to your requirements.

Our design professionals are dedicated to delivering exceptional results, ensuring that the final product not only meets but exceeds your expectations. When you collaborate with our team, you open the door to a world of possibilities, where innovation and creativity converge to bring your vision to life.

Whether it’s modifying an existing product or crafting an entirely new one, our design experts are committed to providing you with a comprehensive, end-to-end solution that perfectly suits your needs. Your satisfaction is our top priority, and we’re here to turn your ideas into reality.

 

Design | Develop | Test | Manufacture

With over three decades of experience in designing custom industrial and embedded computer and display solutions across a wide array of industries, we’re here to turn your ideas into reality

 

Here’s a selection of our design, manufacturing & associated services: –

Design to Order Banner

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a brand-new product from scratch or working with an existing prototype.

Build to Order Banner

Build to Order: Embedded Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

Embedded Software Banner

Embedded Software Services : Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

Manufacturer : DFI

Motherboard

  • Form Factor :

CPU

  • Powered By : Intel
  • CPU Family : iCore
  • CPU Generation :
  • CPU Model : i3-8100H
  • CPU Speed : 3.0Ghz
  • CPU Cores : Quad Core

Memory

  • Memory Installed :
  • Memory Slots : 2
  • Memory Type : 2666Mhz DDR4

I/O and Expansion

  • Expansion Slots : PCIe, SATA
  • LAN Ports : 1
  • Serial Ports :
  • USB 2 Ports : 8
  • USB 3 Ports :
  • USB 3.1 Ports : 4
  • Video Output : DDI, eDisplayPort, LVDS, VGA
  • Multi Display : Triple Display
  • Wireless Connectivity :

Operating System

  • OS :

Certifications

  • Certifications :

Industry

  • Industry :

Features

  • 24/7 Use :
  • 4G-GPS :
  • Artificial Intelligence Use :
  • ATEX :
  • High Performance :
  • Industrial :
  • In-Vehicle :
  • IoT :
  • IP Rating :
  • Low Powered :
  • Mini-ITX :
  • Multi Displays : Triple
  • NUC :
  • Other Features :
  • PoE :
  • Rugged :
  • Ryzen :
  • System Type : Computer-On-Module
  • Touchscreen :
  • Whiskey Lake :
  • Wide Temp :

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