DFI EC70B Fanless Embedded BOX PC 6th Gen i3 / i5 / i7

  • Product Name: DFI EC70B-SU6864E-668
  • System Type: Fanless Embedded System
  • CPU: 6th Generation Intel Core
  • RAM: 4GB/8GB DDR4 memory onboard
  • Expansion: 1x 2.5″ SATA 3.0 drive bay, Supports 2 Mini PCIe for wireless application
  • Other features: Rich I/O ports: 2 Intel GbE, 4 COM, 4 USB 3.0, 15-Year CPU Life Cycle Support
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Description

Small and Lightweight, but Powerful!

Based on 6th Gen Intel Core i7/i5/i3 Processor

As a flawless combination of impressive stylish design and excellent computing capability,the EC70A/EC70B-SU Series brings a whole new concept to the IPC market. Based on the high-end 6th Gen Intel Core i7/i5/i3 processors, it delivers outstanding processing capability in a fanless and compact enclosure. And it is designed for space-limited and compute- intensive solutions like smart factory, digital healthcare, and surveillance.

Features

  • 6th Generation Intel Core Fanless Embedded System
  • 4GB/8GB DDR4 memory onboard
  • 1x 2.5″ SATA 3.0 drive bay
  • Supports 2 Mini PCIe for wireless application
  • Rich I/O ports: 2 Intel GbE, 4 COM, 4 USB 3.0
  • 15-Year CPU Life Cycle Support

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Industrial I/O Interfaces

With rich I/O interfaces covering 2 PoE GLAN and 6 high-speed USB 3.0 to connect to IP cameras, 8-bit Digital I/O connector, and 6 COM ports for legacy devices, the EC70B-SU enables a variety of industrial control applications

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Wide Operating Temperature Support

With ruggedized construction, EC70A/EC70B-SU can survives a wide -20°C to 60°C operating temperature range to satisfy the demands of industries in extreme and harsh environments.

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Covers a Wide Industrial Applications

Built with industrial-grade components inside and out, the 15~36V DC extended power input, and fanless design in a compact size make this scalable and cutting-edge solution suitable for demanding factory automation, transportation, and utilities & energy applications.

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Specifications

System
Processor 6th Generation Intel Core Processors, BGA 1356
  Intel Core i7-6600U Processor, Dual Core, 4M Cache, 2.6GHz, 15W
  Intel Core i5-6300U Processor, Dual Core, 3M Cache, 2.4GHz, 15W
  Intel Core i3-6100U Processor, Dual Core, 3M Cache, 2.3GHz, 15W
Memory 4GB/8GB Memory Onboard
  Dual Channel DDR4 2133MHz
BIOS Insyde SPI 128Mbit
Graphics
Controller Intel HD Graphics GT Series
Features OpenGL 5.0, DirectX 12, OpenCL 2.1
  HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9
  HW Encode: AVC/H.264, MPEG2, JPEG, HEVC/H265, VP8, VP9
Display 1 x VGA/DP++ (DP++ available upon request)
  1 x HDMI/DP++ (DP++ available upon request)
  VGA: resolution up to 1920×1200 @ 60Hz
  DP++: resolution up to 4096×2304 @ 60Hz
  HDMI: resolution up to 4096×2160 @ 24Hz or 2560×1600 @ 60Hz
Dual Displays VGA + HDMI
  VGA + DP++
  (DP++) + HDMI
  (DP++) + DP++
Storage
External/Internal 1 x mSATA
  1 x M.2 (2280 B Key) / CFast Slot (CFast slot available upon request)
Expansion
Interfaces 1 x Full-size Mini PCIe (PCIe+USB)
  1 x Half-size Mini PCIe (USB+PCIe or USB+SATA, PCIe/SATA is selected by jumper setting, USB+SATA by default)
Audio
Audio Codec Realtek ALC888 5.1-channel
Ethernet
Controller 1 x Intel I210AT PCIe (10/100/1000Mbps)
  1 x Intel I219LM with iAMT11.0 PCIe (10/100/1000Mbps) (only Core i7/i5 supports iAMT)
  2 x Intel I210IT PCIe (10/100/1000Mbps) for PoE
LED
Indicators 1 x Power LED
  1 x HDD LED
Front I/O
Serial 2 x RS-232/422/485 (DB-9, COM 1~2)
  3 x RS-232 (DB-9, COM 4~6, COM 4 supports 8-bit DIO by jumper setting)
USB 2 x USB 3.0 (type A)
Display 1 x VGA
Buttons 1 x Power Button
  1 x Reset Button
Wi-Fi Antenna 1 x Wi-Fi Module Antenna Hole
Rear I/O
Ethernet 2 x PoE (supports 802.3af)
  2 x GbE (RJ-45)
Serial 1 x RS-232 (DB-9, COM 3)
USB 4 x USB 3.0 (type A)
DIO 1 x 8-bit DIO
Display 1 x HDMI
Audio 1 x Line-out
  1 x Mic-in
Wi-Fi Antenna 2 x Wi-Fi Module Antenna Hole
Watchdog Timer
Output & Interval System Reset, Programmable via Software from 1 to 255 Seconds
Power  
Type Wide Range 15~36V
Connector DC Jack
OS Support
OS Support Windows 7 (32/64-bit)
  Windows 8.1 (64-bit)
  Windows 10
  WES 7
  WE8S
Environment
Operating Temperature -20 to 60°C
Storage Temperature -20 to 85°C
Relative Humidity 5 to 95% RH (non-condensing)
Mechanical
Construction Aluminum + Metal Aluminum
Mounting Wall/VESA/DIN Rail Mount
Dimensions (W x H x D) 184mm x 82mm x 118.4mm
Weight 1.6 Kg
Standards and Certifications
Shock Operating: 3G, 11ms
  Non-Operating: 5G, 11ms
Vibration Operating: Random 5~500Hz, IEC68-2-64 (3G)
  Non-Operating: Sine 10~500Hz, IEC68-2-6 (3G)

Ordering Information

EC70B-SU6864E-668 Intel Core i7-6600U, 1 HDMI, 1 VGA, 2 PoE, 2 LAN, 6 COM, 6 USB, 8GB DDR4 onboard
EC70B-SU6864E-664 Intel Core i7-6600U, 1 HDMI, 1 VGA, 2 PoE, 2 LAN, 6 COM, 6 USB, 4GB DDR4 onboard
EC70B-SU6864E-638 Intel Core i5-6300U, 1 HDMI, 1 VGA, 2 PoE, 2 LAN, 6 COM, 6 USB, 8GB DDR4 onboard
EC70B-SU6864E-634 Intel Core i5-6300U, 1 HDMI, 1 VGA, 2 PoE, 2 LAN, 6 COM, 6 USB, 4GB DDR4 onboard
EC70B-SU6864E-618 Intel Core i3-6100U, 1 HDMI, 1 VGA, 2 PoE, 2 LAN, 6 COM, 6 USB, 8GB DDR4 onboard
EC70B-SU6864E-614 Intel Core i3-6100U, 1 HDMI, 1 VGA, 2 PoE, 2 LAN, 6 COM, 6 USB, 4GB DDR4 onboard

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

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Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

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Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

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Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

Click here to find out more.