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ALL INDUSTRIAL AND EMBEDDED COMPUTERS

  • PALM 3A100DW R 1

    LEX PALM-3A100DW-R AMD Ryzen Embedded Computer

    • Product Name: Lex PALM-3A100DW-R
    • System Type: AMD Ryzen Embedded Computer
    • CPU: AMD Ryzen Embedded R1000 Series SoC
    • RAM: 2 x DDR4 2400 MHz SODIMM, Max. 32GB
    • Expansion: 2 x HDMI, 1 x DP, 3 x GbE, 4 x USB, 8DI / 8DO, 2 x COM, 1 x Mini PCIe, 2 x SIM, 1 x M.2
    • Other features: With Independent Three 4K Display
  • PALM 3A100DW V 1

    LEX PALM-3A100DW-V AMD Ryzen Embedded Computer

    • Product Name: Lex PALM-3A100DW-V
    • System Type: AMD Ryzen Embedded Computer
    • CPU: AMD Ryzen Embedded V1000 Series SoC
    • RAM: 2 x DDR4 2400 MHz SODIMM, Max. 32GB
    • Expansion: 2 x HDMI, 2 x DP, 3 x GbE, 4 x USB, 8DI / 8DO, 2 x COM, 1 x Mini PCIe, 2 x SIM, 2 x M.2
    • Other features: With Independent Four 4K Display
  • APOLLO 3I370DW 1

    LEX APOLLO 3I370DW 8th/9th Gen Edge AI Industrial Computer

    • Product Name: Lex APOLLO 3I370DW
    • System Type: Edge AI Computing Platform
    • CPU: Intel 8th/9th Gen Coffee Lake-S i7/i5/i3/Pentium/Celeron
    • RAM: 2 x DDR4 SODIMM socket, Max. 64GB
    • Expansion: 1 x M.2 B Key, 1 x Mini PCIe, 1 x PCIe x16 Slot
    • Other features: Intel Q370 Chipset, Multiple Independent display: HDMI, DP, 5 x Intel GbE LAN, 4 x USB 3.1 (2~4 x COM), DIO (optional), Supports NVIDIA RTX3070 GPU Card
  • APOLLO RS 3I370DW 1

    LEX APOLLO-RS 3I370DW 8th/9th Gen Fanless Embedded Computer

    • Product Name: Lex APOLLO-RS 3I370DW
    • System Type: Fanless Embedded Computer
    • CPU: Intel 8th/9th Gen Coffee Lake-S i7/i5/i3/Pentium/Celeron
    • RAM: 2 x DDR4 SODIMM socket, Max. 64GB
    • Expansion: DIO (optional), 1 x M.2 B Key, 1 x Mini PCIe, 2 x PCIe slot
    • Other features: Intel Q370 Chipset, Multiple Independent display: HDMI, DP, 5 x Intel GbE LAN, 4 x USB 3.1, 2~4 x COM
  • APOLLO S 3I370DW 1

    LEX APOLLO-S 3I370DW 8th/9th Gen Fanless Embedded Computer

    • Product Name: Lex APOLLO-S 3I370DW
    • System Type: Fanless Embedded Computer
    • CPU: Intel 8th/9th Gen Coffee Lake-S i7/i5/i3/Pentium/Celeron
    • RAM: 2 x DDR4 SODIMM socket, Max. 64GB
    • Expansion: DIO (optional), 1 x M.2 B Key, 1 x Mini PCIe
    • Other features: Intel Q370 Chipset, Multiple Independent display: HDMI, DP, 5 x Intel GbE LAN, 4 x USB 3.1, 2~4 x COM
  • SKY 2 2I810D 1

    LEX SKY 2 2I810D Compact Fanless 8th Gen Embedded Computer

    • Product Name: Lex SKY 2 2I810D
    • System Type: Fanless Embedded Computer
    • CPU: 8th Gen Intel Whiskey Lake-U i7/i5/i3 CPU
    • RAM: 1 x DDR4 SODIMM socket, Max. 32GB
    • Expansion: Multiple Independent display: VGA & HDMI, 2 x Mini PCIe
    • Other features: 4 x Intel GbE LAN, 3 x USB 3.0, 2 x COM, 4DI/4DO
  • TWISTER CI370D 1

    LEX TWISTER CI370D 8th/9th Gen PCIe Fanless Industrial Computer

    • Product Name: Lex TWISTER CI370D
    • System Type: PCIe Fanless Embedded Computer
    • CPU: Intel 8th/9th Gen Coffee Lake-S i7/i5/i3/Pentium/Celeron CPU
    • RAM: 2 x DDR4 SODIMM socket, Max. 64GB
    • Expansion: 9 x Intel GbE LAN, 2 x SFP Fiber, 4 x USB 3.1, 2 x COM, 1 x M.2 B Key, 2 x SIM, 2 x Mini PCIe, 1 x PCIe x 16 (PCIe x 16 + PCIe x 4 Signal)
    • Other features: Intel Q370 Chipset, Multiple Independent display: HDMI, DP
  • TINOL CI370D 1

    LEX TINO CI370D 8th/9th Gen Fanless Embedded Computer

    • Product Name: Lex TINO CI370D
    • System Type: Fanless Embedded Computer
    • CPU: Intel 8th/9th Gen Coffee Lake-S i7/i5/i3/Pentium/Celeron
    • RAM: 2 x DDR4 SODIMM socket, Max. 64GB
    • Expansion: 1 x M.2 B Key, 2 x SIM, 2 x Mini PCIe
    • Other features: Intel Q370 Chipset, Multiple Independent display: HDMI, DP, 9 x Intel GbE LAN, 2 x SFP Fiber, 4 x USB 3.1, 2 x COM
  • EC51X CSSide210310R1 w600

    DFI EC510-CS/EC511-CS 8th/9th Gen 5G Fanless Industrial Computer

    • Product Name: DFI EC510-CS/EC511-CS
    • System Type: Fanless Embedded System
    • CPU: 8th/9th Gen Intel Core
    • RAM: Supports DDR4 SODIMM up to 64GB
    • Expansion: 1 PCIe and 3 M.2 slots support NVMe
    • Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Support 4 PoE (EC51x-CS6G86E-Q), Support 5G Communication, Operating Temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
  • EC543 CSSide210324 w600

    DFI EC543-CS 8th/9th Gen 5G Fanless Industrial Computer

    • Product Name: DFI EC543-CS
    • System Type: Fanless Embedded System
    • CPU: 8th/9th Gen Intel Core
    • RAM: Supports DDR4 SODIMM up to 64GB
    • Expansion: 3 PCIe, 1 PCI, and 3 M.2 slots support NVMe
    • Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Support 4 PoE (EC543-CS6G86E-Q configuration), Support 5G communication, Operating temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
  • EC500 CSSide200824 w600

    DFI EC500-CS 8th/9th Gen 5G Fanless Embedded System

    • Product Name: DFI EC500-CS
    • System Type: Fanless Embedded System
    • CPU: 8th/9th Gen Intel Core
    • RAM: Supports DDR4 SODIMM up to 64GB
    • Expansion: 3 M.2 slots support NVMe
    • Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Rich I/O connectivity: 2 GbE, 4 COM, 4 USB 3.1, 2 USB 2.0 (Q370 only), Support 5G Communication, Operating Temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
  • EC90ASide210324 w600

    DFI EC90A-GH AMD Ryzen Ultra Compact Fanless Embedded System

    • Product Name: DFI EC90A-GH
    • System Type: Ultra Small Mini PC Fanless Embedded System
    • CPU: AMD Ryzen Embedded R1000 Series
    • RAM: DDR4 2400 MHz SODIMM down up to 4GB/8GB (memory onboard)
    • Expansion: 1 x Mini-PCIe (PCIe signal)
    • Other features: Ultra Small Size: 110 x 80mm x 60mm (W x H x D), User-friendly design for installing SIM card, I/O: 1 Intel GbE, 1 USB 3.1 Gen 2, 2 Micro HDMI, 10-Year CPU Life Cycle Support Until Q1’30 (Based on AMD Roadmap)
  • ECX700 ADP 1

    DFI ECX700-ADP 12th Gen Outdoor Ruggedized IPC67 Mini PC

    • Product Name: DFI ECX700-ADP
    • System Type: Outdoor Ruggedized IPC67 Box PC
    • CPU: Intel Alder Lake-P Processor i5-1245UE / i7-1265UE
    • RAM: Supports DDR4 memory
    • Expansion: Multiple I/O interfaces for versatile connectivity
    • Other Features: IP67-rated waterproof and dustproof design, extreme ruggedization to IEC 60068-2-64, wide operating temperature range (-20 to 70°C)
  • ECX700 ALSide201126R2 W600

    DFI ECX700-AL Outdoor Ruggedized IPC67 Grade Box PC

    • Product Name: DFI ECX700-AL
    • System Type: Ruggedized Outdoor IoT IP67 Fanless Embedded System
    • CPU: Intel Atom Processor E3900 Series
    • RAM: 4GB DDR3 onboard, 64G eMMC
    • Expansion: 1 x Full-size Mini PCIe for 4G LTE module, 1 x Full-size Mini PCIe for Canbus, 1 x M.2 2230 (USB2.0/PCIe) for WiFi module
    • Other features: Ruggedized IPC67 Grade Box PC, Outdoor IoT Gateway Application, Operating temperature: -40° to 70° C, 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap)
  • EC100 XNX side w600

    DFI EC100-XNX NVIDIA Jetson Xavier NX PoE Embedded System

    • Product Name: DFI EC100-XNX
    • System Type: Industrial PC
    • CPU: NVIDIA Jetson Xavier NX
    • RAM: 8Gb
    • Expansion: 20 pins with 1 x UART, 2 x I2C, 9 x GPIOs
    • Other features: Fully supports NVIDIA Jetson Xavier NX, 8 x 10/100 MbE with PoE, Fanless chassis technology, 1 x HDMI 2.0a/b Type-A supports 4K@60Hz