RAM: 1 x 260-pin DDR4 3200 MHz SO-DIMM up to 32GB (Support Non-ECC, unbuffered memory)
Expansion: 1 x MiniPCIe socket (support mSATA), 1 x M.2 (Key E 2230) and 2 x M.2 (Key M 2280) for NVMe, 1 x SIM slot
Other features: 6 x USB3.2 Gen2, 2 x SATA3, Dual Gigabit Ethernet, 2 x RS232 ports, 2 x RS232/422/485 ports, 2 x USB2.0 ports, Intel High Definition Audio.
RAM: 2 x DDR4 SO-DIMM 3200 MHz up to 64GB, support Non-ECC, unbuffered memory
Expansion: 1 x PCIE X16 slot, 1 x MiniPCIe socket (supporting mSATA), 1 x M.2 (Key M 2280) and 1 x M.2 (Key E 2230)
Other features: 6 x USB3.2 Gen2, 3 x SATAIII, Dual Gigabit Ethernet, 4 x RS232 ports, 2 x RS232/422/485 ports, 2 x USB2.0 ports, Intel High Definition Audio, 1 x SIM slot.
Expansion: 1 PCIe x16, 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
Other features: Multiple Displays: 2 x DP++, 1 LVDS/eDP; Supports up to 4K/2K resolution; Rich I/O: 1 Intel 2.5GbE, 2 Intel GbE, 4 COM, 4 USB 3.2 Gen2, 4 USB 2.0; 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
Other features: Four independent displays: DP++ + DP++ + DP++ + DP++; Rich I/O: 2 GbE, 6 COM, 3 USB 3.0, 6 USB 2.0; 10-Year CPU Life Cycle Support Until Q1′ 28 (Based on AMD Roadmap)
Other features: Four independent displays: DP++ + DP++ + DP++ + DP++; Rich I/O: 2 GbE, 6 COM, 2 USB 3.1 Gen2, 7 USB 2.0, SATA 3.0; 10-Year CPU Life Cycle Support Until Q4′ 30 (Based on AMD Roadmap)
CPU: Intel 10th Gen (Comet lake-S) Core Processors with Q470E chipset
RAM: 2 x 260-pin SO-DIMM, Support Dual Channel DDR4 2933 (i9/i7 CPU) / 2666 (i5/i3 CPU) / 2400 (Pentium/ Celeron CPU), up to 64GB
Expansion: Supports MXM Graphics Card (Type-A or Type-B, Up to 150W); 1 x PCIe x4 Gen3, 1 x mini-PCIe
Other features: 4 x USB 3.2 Gen1, 1 x USB 3.2 Gen1 (Type-C), 4 x USB 2.0, 1 x M.2 Key E, 2 x M.2 Key M, 1 x M.2 Key B, 6 x COM, 4 x SATA3; 1 x Intel 1 Gigabit LAN, 1 x Intel 2.5 Gigabit LAN; Support Hepta display, 1 x DP 1.2, 1 x VGA, 1 x eDP 1.4 / LVDS (from CPU) and 3 x DP 1.2, 1 x HDMI 2.0a (from MXM); TPM 2.0 on Board; Supports Intel vPro, AMT, RAID 0/1/5/10; 18~26V DC-In wide range DC input with lockable connector (Max power 300W)
Other features: Dual independent displays: HDMI + LVDS, Rich I/O: 2 GbE, 2 COM, 4 USB 2.0, 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on NXP Roadmap)
Other features: Dual independent displays: HDMI + LVDS, Rich I/O: 1 GbE, 3 COM, 5 USB 2.0, 1 CANBus, 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on NXP Roadmap)
Other features: Thin Mini-ITX form factor with 11th Gen. Intel Tiger Lake-UP3 Processor support, Wide range 9~36V DC Input, Support quadruple independent displays (HDMI, DP, eDP/LVDS, USB4), Dual Intel 2.5GbE LAN, M.2 A key for WIFI+Bluetooth (PCIe x1/USB 2.0), M.2 M key for Storage (PCIe x2/SATA)
Expansion: Multiple Expansion: 1 M.2 B Key, 1 M.2 E Key
Other features: Single Display: HDMI/LVDS (HDMI: resolution up to 4096×2160 @60Hz / LVDS: resolution up to 1920×1080 @60Hz), Rich I/O: 1 Intel GbE, 3 COM, 2 USB 3.1 Gen1, 3 USB 2.0, 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on NXP Roadmap)
Expansion: Multiple Independent display: VGA, HDMI, DP, DP (Type C), eDP or LVDS; 3 x Intel GbE LAN, 1 x USB 3.0 (type C), 6 x USB 2.0; 4 x COM, 4DI / 4DO, 1 x Mini PCIe, 1 x SIM; 1 x M.2 B Key, 1 x M.2 M Key
Other features: TPM 2.0 (Optional), Battery Charger Function (3I110BW)
BVM Design and Manufacturing Services: The manufacturer behind the solutions you know
When a standard embedded design won’t suffice for what you need, you can always turn to BVM for help and use our custom design and manufacturing services.
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