CPU: 12th Generation Intel Core with Intel H610E/Q670E/R680E
RAM: Supports DDR4 SODIMM up to 64GB
Expansion: Three M.2 slots
Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Rich I/O connectivity: 2 GbE, 6 COM, 4 USB 3.1, 2 USB 2.0, Support 5G Communication, Operating Temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q4′ 36 (Based on Intel IOTG Roadmap)
Other features: IP65 Front Panel Protection, Rich I/O: 1 GbE, 2 COM, 1 CAN Bus, 2 USB 3.1 Gen1, 1 HDMI, Application Focus: In-Vehicle Driver HMI, Smart Power Ignition Control: Power delay and protection time setting
CPU: Intel Tiger Lake i5-1135G7 2.4GHz/QC processor (HPC270C-DCP1135G7) or Intel Tiger Lake 6305E 1.8GHz/DC processor (HPC270C-DCP6305E)
RAM: 2* DDR4 SO-DIMM (Max 64GB)
Expansion: Support for easy HDD and DARM installation, Support Cable-less design
Other features: 300 nits TFT LCD with LED backlight, LG in-cell 10-points Multi Capacitive Touch, A true Flat and Slim Design, Clear Image, support Cover-Glass Elimination, 12-36V DC-input Support, with Electrical Over Stress (EOS), OVP design
Product Name: Jetway Tiger Lake iCore Industrial Panel PC
Screen Size: 15″, 17″, 19″, 23.8″, 27″, or 32″ TFT LCD with LED backlight
CPU: Intel Tiger Lake i5-1135G7 2.4GHz/QC processor
RAM: 2* DDR4 SO-DIMM (Max 64GB)
Expansion: Not specified
Other features: 5 Wire Resistive Touch/Anti-Reflection Protection Glass, Support Open frameless design, Easy HDD and RAM installation, cable-free design, 2-36V DC-in, with Electrical Over Stress (EOS) and OVP design, Front bezel meets IP65-rated protection
Product Name: Jetway Tiger Lake Celeron IP65 Panel PC
Screen Size: 15″, 17″, 19″, 23.8″, 27″, or 32″ TFT LCD with LED backlight
CPU: Intel Tiger Lake 6305E processor
RAM: 2* DDR4 SO-DIMM (Max 64GB)
Expansion: Not specified
Other features: 5 Wire Resistive Touch/Anti-Reflection Protection Glass, Support Open frameless design, Easy HDD and RAM installation, cable-free design, 2-36V DC-in, with Electrical Over Stress (EOS) and OVP design, Front bezel meets IP65-rated protection
Other features: High AI computing performance for GPU-accelerated processing, Ideal for edge AI smart city applications, Supports one 15W GbE PoE for camera, Wide operating temperature from -30°C to +60°C, Supports JetPack, Supports Allxon Device Management Solutions (Allxon DMS)
Other features: 1920 x 1080 FHD LED panel with direct optical bonding, Anti-glare technology for sunlight readability, Dual battery with hot-swappable design, Flip design for quick switching between rugged laptop and rugged tablet modes, Magnesium alloy enclosure with double injection for drop protection, Integrated smart card reader
CPU: 12th Gen. Intel Processor Family – Alder Lake Processor (i5-1235U)
RAM: Up to 64Gb DDR4
Expansion: Expansion slot for optional 2nd SSD and smart card reader
Other features: 1920 x 1080 FHD LED panel with direct optical bonding, Anti-glare technology for sunlight readability, Dual battery with hot-swappable design, Flip design for quick switching between rugged laptop and rugged tablet modes, Magnesium alloy enclosure with double injection for drop protection, Integrated smart card reader
Other features: High AI computing performance for GPU-accelerated processing, Ideal for intelligent edge applications, AGV, AMR, and computer vision, Wide operating temperature from -30°C to +50°C, Supports JetPack
Other features: Wide power input range of 9 to 36 VDC (ignition by option), Supports four PoE for GigE cameras and LiDAR connectivity, -30°C to +60°C operating temperature range, Supports device management and optional out-of-band service powered by Allxon, Optional SerDes FPD-LINK III
Expansion: 3 x USB 3.2 Gen2, 2 x USB 2.0, 1 x M.2 Key M, 1 x M.2 Key E (WiFi-6E), 1 x SATA3
Other features: 1 x Realtek 1 Gigabit LAN (support DASH), 1 x Realtek 2.5 Gigabit LAN, Supports Quad display, 1 x HDMI 2.0a, 3 x DP 1.2a (2 from Type C), TPM 2.0 onboard IC, 19V/90W Power Adapter, 110.0 x 117.5 x 47.85mm, Fanned Box PC
Expansion: Dual GbE for GigE cameras and LiDAR connectivity, Dual COM/Dual CANbus/8-CH DI/DO
Other features: Hailo-8 AI processor, up to 26 TOPS, Advanced AI performance, ideal for smart city applications, Supports Wi-Fi/Bluetooth/5G/LTE wireless connection, Wide operating temperature from -20°C to +70°C, Supports Linux operating system
System Type: Fanless Stainless Steel Waterproof Box PC
CPU: Intel Elkhart Lake J6412
RAM: Dual channel support 3200MHz DDR4 SODIMM socket x 2, up to 32GB
Expansion: 2x M12 USB for USB1/2+3/4 ; 2x M12 COM ; 1x M12 LAN
Other features: IP66/69K Full Sealed with Anti-Corrosion Enclosure, IP67 M12 Stainless/Metal Connectors, M12 DC 12-28V with IP68 120W power adapter, 1x M12 DC ; 1x IP65 HDMI ; Power on/off bottom, 100% Waterproof Guarantee, CE, FCC, VCCI Class B Certified
System Type: Fanless Stainless Steel Waterproof Box PC
CPU: Intel Alder Lake Processor
RAM: Dual channel support 3200MHz DDR4 SODIMM socket x 2, up to 32GB
Expansion: 2x M12 USB for USB1/2+3/4 ; 2x M12 COM ; 1x M12 LAN
Other features: IP66/69K Full Sealed with Anti-Corrosion Enclosure, IP67 M12 Stainless/Metal Connectors, M12 DC 12-28V with IP68 120W power adapter, 1x M12 DC ; 1x IP65 HDMI ; Power on/off bottom, 100% Waterproof Guarantee, CE, FCC, VCCI Class B Certified
Expansion: 3 x USB 3.2 Gen2, 2 x USB 2.0, 1 x M.2 Key M, 1 x M.2 Key E (WiFi-6E), 1 x SATA3
Other features: 1 x Realtek 1 Gigabit LAN (support DASH), 1 x Realtek 2.5 Gigabit LAN, Supports Quad display, 1 x HDMI 2.0a, 3 x DP 1.2a (2 from Type C), TPM 2.0 onboard IC, 19V/90W Power Adapter, 110.0 x 117.5 x 47.85mm, Fanned Box PC
Other features: Hailo-8 AI processor, up to 26 TOPS, Palm size with high AI computing performance, Supports Wi-Fi/Bluetooth/5G/LTE wireless connection, Wide operating temperature from -10°C to +60°C, Wide voltage input from 12 to 24 VDC, Supports Windows 10 and Linux, Ideal for edge AI smart city applications
Expansion: 1 x M.2 (Key E 2230), 1 x M.2 (Key M 2280) support PCIe Gen4 for NVMe, 1 x SATA3
Other features: Integrated HDMI, Type-C (DP Alt.Mode), 1 x Intel Gigabit PHY LAN, 1 x Intel 2.5 Gigabit LAN, 2 x USB2.0, 1 x USB3.2 Gen2, 1 x RS232/RS422/RS485, 1 x GPIO, Support Watchdog Timer, Support 4K resolution, DC input 12V ±5%
Module Form Factor: Intel Elkhart Lake Celeron / Atom Qseven
CPU: Intel Elkhart Lake Celeron / Atom
RAM: 4GB/8GB LPDDR4 Single Channel Memory Down
Expansion: Multiple expansions: 4 PCIe x1
Other features: 1 DDI*, 1 LVDS*/eDP, DP++ resolution supports up to 4096×2160 @ 60Hz, Rich I/O: 1 Intel GbE, 3 USB 3.1, 8 USB 2.0, 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on Intel IOTG Roadmap)
BVM Design and Manufacturing Services: The manufacturer behind the solutions you know
When a standard embedded design won’t suffice for what you need, you can always turn to BVM for help and use our custom design and manufacturing services.
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