MXM Solutions: Leveraging AI for Deep Learning Applications

MXM Solutions
Leveraging AI for Deep Learning Applications

DFI MXM solutions provide high-speed computing performance through a discrete GPU, whilst reducing footprint size

Mini-ITX Motherboards

The Mini-ITX motherboard is still the most popular form factor for numerous industrial applications;  with it’s the small form factor (170mm x 170mm) the Mini-ITX forma can provide features such as PCIe x16 or MXM slots for GPU card expansion for high end graphics handling. With a rich array of I/O ports and interfaces to meet a diversity of applications required by a wide range of industries, the Mini-ITX format strikes a perfect balance for both functionality and performance.

So, why choose DFI’s Mini-ITX motherboard solutions?

DFI’s embedded Mini-ITX motherboards are designed with a variety of I/O interface connections and flexibility around power input for DC and ATX. For low power solutions, passive cooling is available to provide applications an extended device lifespan. DFI’s compact Mini-ITX solutions deliver flexible  connectivity solutions, making them scalable – and are consequently regarded as ideal solutions for meeting applications in a range of areas such as AGV/AMR, Kiosk, Digital Signage and Gaming.

CS181-H310 / Q370

8th/9th Gen Intel iCore MXM Compatible Mini-ITX Motherboard

The CS181-H310 / Q370, Mini-ITX with 8th/9th Gen Intel i3/i5/i7 or Pentium/Celeron, designed to provide integration of MXM 3.1 modules  – make both variants of the CS181 deal solutions for areas such as road traffic flow analysis, AOI (Automated Optical Inspection), machine vision, vision guided robotics and medical imaging.

Features

  • 8th/9th Generation Intel Core Processors
  • 2 DDR4 2400/2666MHz SODIMM up to 32GB
  • Multiple Displays: 1 LVDS/eDP, 1 DP++/HDMI (autodetection), 4 DP
  • Supports up to 4K/2K resolution
  • Multiple Expansions: 1 MXM Type-A/B, 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
  • Storage: 2 SATA 3.0
  • Rich I/O: 6 Intel GbE, 2 COM, 4 USB 3.1 Gen1, 6 USB 2.0
  • 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on Intel IOTG Roadmap)
MXM Solutions - DFI Mini-ITX

MXM Modules

What are Mobile PCI Express Modules “MXM modules”?

A Mobile PCI Express Module (MXM) is an interconnect standard for GPUs in laptops and embedded computers using PCI Express. The original goal was to create a non-proprietary, industry standard socket, so users could easily upgrade the graphics processor in a laptop, without having to buy a whole new system or relying on proprietary vendor upgrades.

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Carrier Board

Carrier boards (also known as ‘base boards’) provide the foundation for the needed engineering development to house COM Express Type 10, Type 7, Type 6, Type 2, and Qseven COM/SOM solutions. Adopting a COM/SOM solution can provide advantages around the minimisation of time in bringing products market where future development time and associated costs are concerned, particularly around needed certifications  (Military/Medical/Transportation)

Q7A-551

Qseven Modules, 1 Mini PCIe, 1 Lan, 2 USB, 1 mSATA, 3 COM, 1 LVDS, 1 HDMI

The Q7A-551 Qseven solution; with a carrier board designed to provide CAN-bus connectivity and handle 9~36V wide-voltage DC-jack input – makes the Q7A-551 an ideal solution in the meeting of automotive, mail order & e commerce and automated packaging machine applications.

Features

  • Qseven R1.2
  • Supports Qseven modules
  • Multiple displays: 1 LVDS, 1 HDMI
  • Rich I/O: 1 GbE, 2 USB 2.0, 3 COM
  • 190 x 102mm (7.48″ x 4.02″)
Q7a-551 Carrier Board with MXM

High Performance Embedded Systems

DFI’s high-performance PC system series are based on the latest core series processor platforms available from Intel – and provide capable, advanced graphics handling capabilities. These powerful embedded systems are available with a versatile expandability and extensive I/O  (LAN/PoE/USB). Their modular design provides flexibility to meet various applications – and consequently deliver high levels of computing ability for a  wide range of industrial environments.

DT200-CS

DT200-CS MXM System

DT200-CS is the 5G and MXM-module support industrial pc powered by 8th/9th Intel Processors. It is designed for AI Vision applications such as automated optical inspection (AOI) and vision-guided robotics in factory, high-res diagnostic imaging in medical, traffic flow analysis in transportation, and more. DT200-CS support 8th/9th Gen Intel Core, DDR4, 3 M.2, 1 HDMI, 4 DP

Features

  • 8th/9th Generation Intel Core Processors
  • Multiple displays: 4 DP (from MXM), 1 DP++/HDMI
  • AI accelerated: up to 110W GPU MXM module supported
  • Support M.2 B key 3052 5G cellar module
  • Rich I/O connectivity: 4 LAN, 4 USB 3.1, 6 USB 2.0, 2 COM
  • 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)

EC-300-CS

VC300-CS MXM System

EC300-CS is the 5G/MXM-module and PoE support Fanless System powered by 8th/9th Intel Processors. It designed for AI Vision application such as automated optical inspection (AOI) and vision guided robotics in factory, high-res diagnostic imaging in medical, traffic flow analysis in transportation, and more. EC300-CS support 8th/9th Gen Intel Core, DDR4, 3 Mini PCIe, 2 M.2, 1 HDMI, 1 VGA, 1 DP++.

Features

  • 8th/9th Generation Intel Core Processors
  • 4 x RJ45 type PoE ports at 15W
  • AI accelerated: up to 115W GPU MXM module supported
  • Multiple expansion slots for 5G cellular supported
  • Extended operating temperature: -25°C to 70°C
  • 15-Year CPU Life Cycle Support Until Q1′ 34 (Based on Intel IOTG Roadmap)

In-Vehicle / Railway Embedded Systems

DFI’s in-vehicle computing designs centralise on reliability, MIL-STD anti-vibration and ‘Swap’ — small, lightweight and low power consumption. The systems are E-Mark (E-13) certified to guarantee conformance to European legislation around electromagnetic emissions . Provision of real-time data analysis is aided by on board via mini-PCIe and M.2 expansion – to enable connectivity via 3G/4G, Wi-Fi, GNSS, and CAN-Bus interfacing. Designed to handle wide-temperature variation, wide-voltage input and provide in-vehicle power management, ensures stability and endurance for harsh environment applications during use.

VC300-CS

VC300-CS MXM PC

DFI’s VC300-CS is the PoE/MXM-module support In-Vehicle/Railway System powered by 8th/9th Intel Processors. It designed for Electric interurban bus, Autonomous, MaaS, Fleet management, Robotaxi, AI Railway surveillance, Driver-less, Autopilot, track monitoring, and more. DFI VC300-CS support 8th/9th Gen Intel Core, DDR4, 3 Mini PCIe, 2 M.2, 1 HDMI, 1 VGA, 1 DP++.

Features

  • 8th/9th Generation Intel Core Processors
  • 4 x 802.3af PoE ports
  • AI accelerated: up to 150W GPU MXM module supported
  • Multiple expansion slots for 4G/LTE/5G cellular
  • 7 x SMA Type antenna hole for WLAN/ BT MIMO, 5G
  • Extended operating temperature: -25°C to 70°C
  • 4 x Swappable 2.5” 7mm SSD storage bays
  • 15-Year CPU Life Cycle Support Until Q1′ 34 (Based on Intel IOTG Roadmap)

RC300-CS

RC300-CS MXM PC

DFI’s RC300-CS is the PoE/MXM-module/5G-NR support In-railway system powered by 8th/9th Intel Processors. It designed for Electric interurban bus, Autonomous, MaaS, Fleet management, Robotaxi, AI Railway surveillance, Driver-less, Autopilot, track monitoring, and more. DFI RC300-CS support 8th/9th Gen Intel Core, DDR4, 3 Mini PCIe, 2 M.2, 1 HDMI, 1 VGA, 1 DP++.

Features

  • 8th/9th Generation Intel Core Processors
  • 4 x M12 X-coded PoE ports at 15.4W
  • AI accelerated: up to 115W GPU MXM module supported
  • Multiple expansion slots for 4G/LTE/5G cellular
  • Extended operating temperature: up to -25°C ~ 70°C
  • Support M.2 B key 3042/3052 5G-NR module
  • 4 x Swappable 2.5” 7mm SSD storage bays
  • 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)

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