DFI RC-300-CS AI-Enabled 5G MXM Railway System
DFI’s RC300-CS AI-Enabled Railway, driver-less, bus, train, track monitoring, security, surveillance embedded system, 8th/9th Gen Intel® Core, DDR4, 3 Mini PCIe, 2 M.2, 1 HDMI, 1 VGA, 1 DP++
Description
- 8th/9th Generation Intel® Core™ Processors
- 4 x M12 X-coded PoE Ports at 15W
- AI Accelerated: Up to 110W GPU MXM Module Supported
- Multiple Expansion Slots for 3G/LTE/5G Cellular Support
- Extended Operating Temperature: -25°C to 70°C Operation without Active Fan
- Support 5G Communication
- 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
Specification
System |
Processor |
8th/9th Generation Intel® Core™ Processors, LGA 1151 |
Intel® Xeon® Processor E-2278GEL 8C/16CT, 16MB Cache, 2.0GHz, TDP 35W |
Intel® Core™ i7-9700TE Processor, 8C/8T, 12MB Cache, 1.8GHz, TDP 35W |
Intel® Core™ i7-8700T Processor, 6C/12T, 12MB Cache, 2.4GHz, TDP 35W |
Intel® Core™ i5-9500TE Processor, 6C/6T, 9MB Cache, 2.2GHz, TDP 35W |
Intel® Core™ i3-9100TE Processor, 4C/4T, 6MB Cache, 2.2GHz, TDP 35W |
Chipset |
Intel® C246/Q370 Chipset |
Memory |
Dual Channel DDR4 2666/2400 MHz by SODIMMs up to 64GB |
BIOS |
Insyde SPI 128Mbit |
Graphics |
Controller |
Intel® HD Graphics |
Display |
1 x VGA (display out by DB15 connector) |
1 x HDMI (with screw lock) |
1 x DP++ (Standard Display Port Connector DIP |
type with screw lock) support NIVIDIA Optimus |
technology |
VGA: resolution up to 1920×1200 @ 60Hz |
HDMI: resolution up to 4096×2160 @ 24Hz |
DP++: resolution up to 4096×2304 @ 60Hz |
GPU |
Support MXM 3.1 Type A &B: T3000, GTX 1050ti, GTX1060, GTX1070 GPU modules |
Maximum Package power 120W, inrush current 150W |
PCIe x16 |
Storage |
External |
4 x Swappable 2.5” Storage Bay with Lock. |
Supports 7mm SSD devices |
Expansion |
Interface |
1 x Half-size Mini PCIe for WiFi/BT Modules, with PCIe x1 & USB signal |
2 x Full-size Mini PCIe support PCIe x1 & USB 2.0 signal with SIM of each (All SIM Cards can be |
external accessible with cover against vibration) |
1 x M.2 B key support PCIe x1, USB2.0, USB3.0 signal with SIM slot (SIM card can be external |
accessible with cover) |
1 x M.2 2280 M key supports 2242, 2260 & 2280 devices (PCIe x4 & SATA signal, support boot up |
function) |
Ethernet |
Controller |
5 x Intel® I210IT NIC (10/100/1000Mbps) |
1 x Intel® I219LM PHY (10/100/1000Mbps) |
Interface |
2 x RJ45 GbE |
4 x M12 802.3af 15W PoE ports |
LED |
Indicators |
1 x Power LED (Green) |
5 x Storage LED (Red) |
4 x POE LED |
Front I/O |
Ethernet |
2 x GbE (RJ-45) support Wake on Lan |
Serial |
2 x BIOS selection RS-232/422/485 by 2x DB-9 |
USB |
4 x USB 3.0 (type A) |
Display |
1 x VGA display out by DB15 connector |
DIO |
1x 8bit isolated DI port by DB-15 connector |
1x 8bit isolated DO port by DB-15 connector |
2KV isolation |
Power-in |
1 x 6Pins 5.0mm Terminal Block |
PoE |
x4 M12 802.3af POE by XCT7-4POEM12 with LEDs |
Support 802.11af, max 15.4W (PSE side) |
NOT support wake on Lan |
Rear I/O |
USB |
2 x USB 2.0 (type A) |
Display |
1 x HDMI |
1 x DP++ |
Audio |
1 x Mic-in |
1 x Line-out |
by 3.5mm 3P Phone Jack |
Buttons |
1 x Power Button |
1 x Reset Button |
SIM |
3 x SIM sockets (external accessible with cover) |
Watchdog Timer |
Output & Interval |
System Reset, Programmable via Software from 1 to 255 Seconds |
Security |
TPM |
TPM 2.0 |
Power |
Type |
72/96/110VDC nominal power input |
50.4VDC~137.5VDC power range |
Connector |
6 pin 5.0mm Terminal Block |
OS Support |
OS Support |
Windows 10 IoT Enterprise 64 Bit |
Ubuntu 18.04 |
Environment |
Temperature |
-25°C to 70°C with when CPU+GPU<100W, up to +85°C for 10min |
-25°C to 55°C with when CPU+GPU<160W, up to +70°C for 10min |
CPU throttling at high temperature is acceptable |
Storage Temperature |
-40 to 85°C |
Relative Humidity |
10% to 90% (non-condensing) |
Mechanism |
Dimensions |
340.5(W) x 223(D) x 132(H) mm |
(3U height, excluding rubber foot) |
Construction |
Metal + Aluminum |
Mounting |
Wall Mount |
Weight |
9.85 kg |
Standards and Certifications |
Shock |
EN61373: 2010, Category 1 Class A & Class B |
Vibration |
EN61373: 2010, Category 1 Class B |
Certifications |
CE, FCC Class B (Tested with Adapter) |
EMC: EN50121-3-2 |
Safety: EN50153, EN50124-1 |
Fire Proof: EN45545 |
If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can design a new product from start to finish.
Related
Datasheet
DownloadIf you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can design a new product from start to finish.
Design | Develop | Test | Manufacture
Here’s a selection of our design, manufacturing
& associated services: –
Design to Order: OEM/ODM Embedded Product Design Services
For customers designing a brand-new product from scratch or working with an existing prototype.
- FREE Pre-design / Pre-sales advise
- Prototyping – Custom PC Design, Custom Panel PC, Custom Racks or Custom Peli Case PCs
- Prototyping pre checks (chargeable one-time fee for existing prototype)
- Hardware compatibility
- Thermal testing
- Software compatibility
- Custom PCB / Board Design
- Custom Chassis Design
- Custom Cables
- Custom Back Panels and Faceplates
- Custom Cooling
- Custom Metal Work (internal brackets, mounting brackets)
- Touchscreen Integration and Display Enhancements
- Software – Custom OS Image
Build to Order: Embedded Computer Design and Customisation Services
Take an existing system and we can:
- Custom specification (CPU, Ram, I/O, Storage)
- Chassis customisation and branding
- Custom BIOS
- Software – Custom OS Image
- Custom Packaging and branding
- Integrating newly designed or existing hardware into a larger system
Build to order Racks and Towers, Peli Case PCs and Mini-ITX PCs
Embedded Software Services : Configuration, Integration and Deployment
Porting, Integration & Deployment
- Windows image capture from customers HDD
- Linux image capture from customers HDD
- Windows / Linux Deployment from customers image
- Custom Windows images, create and deploy
- Update management
- Custom Linux and Android images?
- Custom BIOS
Related
Manufacturer : DFI
CPU
- Powered By : Intel
- CPU Family : iCore, Xeon
- CPU Generation : 8th Gen Intel, 9th Gen Intel
- CPU Model : E-2278GEL, i3-9100TE, i5-9500TE, i7-8700T, i7-9700TE
- CPU Speed : 1.8Ghz, 2.0Ghz, 2.2Ghz, 2.4Ghz
- CPU Cores : 6 Cores, 8 Cores, Quad Core
Memory
- Memory Installed :
- Memory Slots : 2
- Memory Type : 2400Mhz DDR4, 2666Mhz DDR4
I/O and Expansion
- Expansion Slots : M.2, Mini PCIe, MXM
- LAN Ports : 6
- Serial Ports : 2
- USB 2 Ports : 2
- USB 3 Ports : 4
- USB 3.1 Ports :
- Video Output : DisplayPort, HDMI, VGA
- Multi Display : Triple Display
- Wireless Connectivity :
Operating System
- OS : Linux, Windows
Certifications
- Certifications : EN45545, EN50124-1, EN50153, EN50155, EN61373 Shock, EN61373 Vibration
Industry
- Industry : Transport - Rail, Transport - Road, Transport and Smart City
Features
- 24/7 Use : Yes
- 4G-GPS : Yes
- Artificial Intelligence Use : Artificial Intelligence, Edge Computing, Machine Learning, Machine Vision
- ATEX :
- High Performance :
- Industrial :
- In-Vehicle : Yes
- IoT :
- IP Rating : IP40
- Low Powered :
- Mini-ITX :
- Multi Displays : Triple
- NUC :
- Other Features : 5G Support, GPIO, MXM
- PoE : Yes
- Rugged : Yes
- Ryzen :
- System Type : Box PC
- Touchscreen :
- Whiskey Lake :
- Wide Temp : Yes
Categories : AI Ready Solutions, All Embedded Box PCs, Artificial Intelligence - AI Ready Solutions, In Vehicle PCs, Industrial GPU Computing, Rail PCs