DFI VC300-CS AI-Enabled 5G MXM In-Vehicle System
DFI VC-300-CS AI-Enabled In-Vehicle Embedded System, 8th/9th Gen Intel® Core, DDR4, 3 Mini PCIe, 2 M.2, 1 HDMI, 1 VGA, 1 DP++
SKU: VC300-CS
Categories: Industrial GPU Computing, In Vehicle PCs, All Embedded Box PCs, Artificial Intelligence - AI Ready Solutions, AI Ready Solutions
Tags: 24/7 Use, 4G/GPS, 5G, Artificial Intelligence, Box PC, Fanless, Harsh Environments, In Vehicle, Intel, Machine Learning, Machine Vision, Rugged, Transport - Rail, Transport - Road, Transport and Smart City, Wide Temp, Windows
Description
- 8th/9th Generation Intel® Core™ Processors
- 4 x 802.3af POE Ports
- AI Accelerated: Up to 110W GPU MXM Module Supported
- Multiple Expansion Slots for 3G/LTE/5G Cellular Support
- Extended Operating Temperature: -25°C to 70°C
- Support 5G Communication
- 15-Year CPU Life Cycle Support Until Q1′ 34 (Based on Intel IOTG Roadmap)
Specification
System |
Processor |
8th/9th Generation Intel® CoreTM Processors, LGA 1151 |
– Xeon E-2278GE 8C/16CT 3.3GHz 16MB Cache, TDP 80W, with ECC with C246 PCH |
– Xeon E-2278GEL 8C/16CT 2.0GHz 16MB Cache, TDP 35W, with ECC with C246 PCH |
– Intel® Core™ i7-9700TE 8C/8T 1.8GHz 12MB cache, TDP 35W with Q370PCH |
– Intel® Core™ i7-8700T 6C/12T 2.4GHz 12MB cache, TDP 35W with Q370PCH |
– Intel® Core™ i7-9700E 8C/8T 2.6GHz 12MB cache, TDP 65W with Q370PCH |
– Intel® Core™ i5-9500TE 6C/6T 2.2GHz 9MB cache, TDP 35W with Q370PCH |
– Intel® Core™ i3-9100TE 4C/4T 2.2GHz 6MB cache, TDP 35W with ECC with C246PCH |
Chipset |
Intel® C246/Q370 Chipset |
Memory |
Dual Channel DDR4 2666/2400 MHz by SODIMMs up to 64GB |
BIOS |
Insyde SPI 128Mbit |
Graphics |
Controller |
Intel® HD Graphics |
Display |
1 x VGA (display out by DB15 connector) |
1 x HDMI (with screw lock) |
1 x DP++ (Standard Display Port Connector DIP |
type with screw lock) support NIVIDIA Optimus |
technology |
VGA: resolution up to 1920×1200 @ 60Hz |
HDMI: resolution up to 4096×2160 @ 24Hz |
DP++: resolution up to 4096×2304 @ 60Hz |
GPU |
Support MXM 3.1 Type A &B: T3000, GTX 1050ti, GTX1060, GTX1070 GPU modules |
Maximum Package power 120W, inrush current 150W |
PCIe x16 |
Storage |
External |
4 x Swappable 2.5” Storage Bay with Lock. |
Supports 7mm SSD devices |
Expansion |
Interface |
1 x Half-size Mini PCIe for WiFi/BT Modules, with PCIe x1 & USB signal |
2 x Full-size Mini PCIe support PCIe x1 & USB 2.0 signal with SIM of each (All SIM Cards can be external accessible with cover against vibration) |
1 x M.2 B key support PCIe x1, USB2.0, USB3.0 signal with SIM slot (SIM card can be external accessible with cover) |
1 x M.2 2280 M key supports 2242, 2260 & 2280 devices (PCIe x4 & SATA signal, support boot up function) |
Ethernet |
Controller |
5 x Intel® I210IT NIC (10/100/1000Mbps) |
1 x Intel® I219LM PHY (10/100/1000Mbps) |
LED |
Indicators |
1 x Power LED (Green) |
5 x Storage LED (Red) |
4 x POE LED |
Front I/O |
Ethernet |
2 x GbE (RJ-45) support Wake on Lan |
Serial |
2 x High speed full RS-232/422/485 by 2x DB-9 |
USB |
4 x USB 3.0 (type A) |
Display |
1 x VGA display out by DB15 connector |
DIO |
2 x Isolated 8bits DIO port by 2x DB-15 female connectors |
Supports 8 DI & 8 DO |
2KV isolation |
Antenna |
7 x SMA type antenna hole for GNSS, WWAN/LTE MIMO, WLAN/ BT MIMO, 5G |
Power-in |
1 x 6Pins 5.0mm Terminal Block |
PoE |
4 x RJ45 802.3af POE by XCT7-4POE |
Support 802.11af, max 15.4W (PSE side) |
NOT support wake on Lan |
Rear I/O |
USB |
2 x USB 2.0 (type A) |
Display |
1 x HDMI |
1 x DP++ |
Audio |
1 x Mic-in |
1 x Line-out |
by 3.5mm 3P Phone Jack |
Buttons |
1 x Power Button |
1 x Reset Button |
SIM |
3 x SIM sockets (external accessible with cover) |
Watchdog Timer |
Output & Interval |
System Reset, Programmable via Software from 1 to 255 Seconds |
Security |
TPM |
TPM 2.0 |
Power |
Type |
+12VDC (9~36V), +24VDC(14.4~33.6) |
+12V and +24V compliant to eMark with power ignition function |
Reverse polarity protection |
Connector |
6 pin 5.0mm Terminal Block |
OS Support |
OS Support |
Windows 10 IoT Enterprise 64 Bit |
Ubuntu 18.04 |
Environment |
Operating Temperature |
-25°C to 70°C with when CPU+GPU<100W, up to +85°C for 10min |
-25°C to 55°C with when CPU+GPU<160W, up to +70°C for 10min |
CPU throttling at high temperature is acceptable |
Storage Temperature |
-40 to 85°C |
Relative Humidity |
10% to 90% (non-condensing) |
Mechanism |
Construction |
Metal + Aluminum |
Mounting |
Wall Mount |
Dimensions (W x H x D) |
340.5(W) x 223(D) x 132(H) mm (3U height, excluding rubber foot) |
Weight |
9.85 kg |
Standards and Certifications |
Shock |
EN61373: 2010, Category 1 Class A & Class B |
Vibration |
EN61373: 2010, Category 1 Class B |
Certifications |
CE, FCC Class B (Tested with Adapter) |
E-Mark |
Safety: EN50153, EN50124-1 |
Fire Proof: EN45545 |
IP Rating |
IP40 |
Related
Datasheet
DownloadIf you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can design a new product from start to finish.
Design | Develop | Test | Manufacture
Here’s a selection of our design, manufacturing
& associated services: –
Design to Order: OEM/ODM Embedded Product Design Services
For customers designing a brand-new product from scratch or working with an existing prototype.
- FREE Pre-design / Pre-sales advise
- Prototyping – Custom PC Design, Custom Panel PC, Custom Racks or Custom Peli Case PC
- Prototyping pre checks (chargeable one-time fee for existing prototype)
- Hardware compatibility
- Thermal testing
- Software compatibility
- Custom PCB / Board Design
- Custom Chassis Design
- Custom Cables
- Custom Back Panels and Faceplates
- Custom Cooling
- Custom Metal Work (internal brackets, mounting brackets)
- Touchscreen Integration and Display Enhancements
- Software – Custom OS Image
Build to Order: Embedded Computer Design and Customisation Services
Take an existing system and we can:
- Custom specification (CPU, Ram, I/O, Storage)
- Chassis customisation and branding
- Custom BIOS
- Software – Custom OS Image
- Custom Packaging and branding
- Integrating newly designed or existing hardware into a larger system
Build to order Racks and Towers, Peli Case PCs and Mini-ITX PCs
Embedded Software Services : Configuration, Integration and Deployment
Porting, Integration & Deployment
- Windows image capture from customers HDD
- Linux image capture from customers HDD
- Windows / Linux Deployment from customers image
- Custom Windows images, create and deploy
- Update management
- Custom Linux and Android images?
- Custom BIOS
Related
Manufacturer : DFI
CPU
- Powered By : Intel
- CPU Family : iCore, Xeon
- CPU Generation : 8th Gen Intel, 9th Gen Intel
- CPU Model : E-2278GE, E-2278GEL, i3-9100TE, i5-9500TE, i7-8700T, i7-9700E, i7-9700TE
- CPU Speed : 1.8Ghz, 2.0Ghz, 2.2Ghz, 2.4Ghz, 2.6Ghz, 3.3Ghz
- CPU Cores : 6 Cores, 8 Cores, Quad Core
Memory
- Memory Installed :
- Memory Slots : 2
- Memory Type : 2400Mhz DDR4, 2666Mhz DDR4
I/O and Expansion
- Expansion Slots : M.2, Mini PCIe, MXM
- LAN Ports : 6
- Serial Ports : 2
- USB 2 Ports : 2
- USB 3 Ports : 4
- USB 3.1 Ports :
- Video Output : DisplayPort, HDMI, VGA
- Multi Display : Triple Display
- Wireless Connectivity :
Operating System
- OS : Linux, Windows
Certifications
- Certifications : EN45545, EN50124-1, EN50153, EN61373 Shock, EN61373 Vibration
Industry
- Industry : Transport - Road, Transport and Smart City
Features
- 24/7 Use : Yes
- 4G-GPS : Yes
- Artificial Intelligence Use : Artificial Intelligence, Edge Computing, Machine Learning, Machine Vision
- ATEX :
- High Performance :
- Industrial :
- In-Vehicle : Yes
- IoT :
- IP Rating : IP40
- Low Powered :
- Mini-ITX :
- Multi Displays : Triple
- NUC :
- Other Features : 5G Support, GPIO, MXM
- PoE : Yes
- Rugged : Yes
- Ryzen :
- System Type : Box PC
- Touchscreen :
- Whiskey Lake :
- Wide Temp : Yes
Categories : Industrial GPU Computing, In Vehicle PCs, All Embedded Box PCs, Artificial Intelligence - AI Ready Solutions, AI Ready Solutions