Modular Design
Modular design, or modularity in design, is a design principle that subdivides a system into smaller parts called modules, which can be independently created, modified, replaced, or exchanged with other modules or between different systems.
Showing all 26 results
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IEI DRPC-W-EHL Fanless Elkhart Lake DIN-Rail Embedded System
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IEI DRPC-W-JL Fanless Jasper Lake DIN-Rail Embedded System
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IEI DRPC-W-TGL Fanless Tiger Lake iCore DIN-Rail Embedded System
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DFI KSM-KH Series 15″ – 22″ Modular Rugged Industrial Panel PC Series
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IEI DRPC-240-TGL-U Tiger Lake Fanless DIN-Rail Embedded System
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Jetway HBJC38AZ02 Tiger Lake Rugged Expandable Box PC
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Winmate ITMH100 Intel Tiger Lake i5-1135G7 Modular Box PC
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Winmate ITMH100-EX C1D2 Certified Intel Tiger Lake i5 Box PC
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Winmate R12ITWS-MHM2-EX 12.1″ M Series i5 C1D2 HMI Panel PC
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Winmate R15ITWS-MHB1-EX 15″ M Series i5 C1D2 HMI Panel PC
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Winmate R17ITWS-MHA1-EX 17″ M Series i5 C1D2 HMI Panel PC
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Winmate R19ITWS-MHA3-EX 19″ M Series i5 C1D2 HMI Panel PC
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Winmate W24ITWS-MHA2-EX 23.8″ M Series i5 C1D2 HMI Panel PC
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Winmate W22ITWS-MHB1-EX 21.5″ M Series i5 C1D2 HMI Panel PC
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IEI 22” POCi-W22C 8th Gen Medical Grade Panel PC
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IEI 24” POCi-W24C 8th Gen Medical Grade Panel PC
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IEI DRPC-230-ULT5 iCore Fanless DIN-Rail Embedded System
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Wincomm WLPM-V24 24″ AMD Ryzen Modular Industrial Panel PC
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Wincomm WLPM-V15 15″ AMD Ryzen Modular Industrial Panel PC
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Wincomm WLPM-V22 22″ AMD Ryzen Modular Industrial Panel PC
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Wincomm WLPM 15″ – 24″ Modular Industrial Panel PC Series
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DFI EC510-CS/EC511-CS 8th/9th Gen 5G Fanless Embedded System
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DFI EC543-CS 8th/9th Gen 5G Fanless Embedded System
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DFI EC500-CS 8th/9th Gen 5G Fanless Embedded System
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IEI PPC-FWC-Q370 15″ – 23.8” i3/i5/i7 AI Ready Panel PC Series
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IEI FLEX-BX200AI Xeon FLEX AIoT Developer Kit
