Neousys POC-400 Elkhart Lake x6425E Ultra-compact Fanless Embedded Computer

Neousys POC-400 Elkhart Lake x6425E Ultra-compact Fanless Embedded Computer

Product Name: Neousys POC-400
System Type: Ultra-compact Fanless Embedded Computer
CPU: Intel Elkhart Lake Atom x6425E quad-core 2.0GHz/3.0GHz 12W processor
RAM: Up to 32 GB DDR4-3200 SDRAM by one SODIMM socket
Expansion: M.2 2280 M key SATA interface, MezIO® compatible
Other features: Rugged -25 °C to 70 °C fanless operation, 2x 2.5GbE PoE+ ports and 1x 2.5GbE port with screw-lock, 2x USB 3.1 Gen1 and 2x USB 2.0 ports with screw-lock, Dual DP display outputs supporting 4096 x 2160 resolution, Front I/O access DIN-mounting design

Description

The POC-400 from Neousys Technology is an ultra-compact fanless embedded computer for industrial applications. It utilises the latest Intel® Elkhart Lake platform Atom® x6425E 4-core CPU, delivering up to 1.8x CPU and 2x GPU performance improvements compared to previous generations of Atom solutions.

In addition to the performance boost, the POC-400 features an ultra-compact design with an external footprint of just 56 x 108 x 153 mm, making it a solution that can easily fit into the most restricted of spaces.

The system comes with a DIN-rail mounting chassis and an abundance of front-access I/O interfaces. Featuring three 2.5GBASE-T Ethernet ports with IEEE 802.3 PoE+ capability, the POC-400 provides higher data bandwidth for devices such as NBASE-T cameras and is backward-compatible with 1000/100/10 Mbps Ethernet. The PC also has 2 x 4K Display Ports, 2x USB3.1 Gen1, 2x USB 2.0 and COM ports to meet general industrial applications.

Supporting Neousys’ proprietary MezIO® interface for function expansion, a user can add functionality such as isolated DIO, RS-232/422/485, ignition control and 4G/ 5G by installing a MezIO® module. Additionally, the POC-400 comes with an internal M.2 E key socket for a Google TPU or an Intel® Movidius VPU module to transform it into a lightweight AI inference platform at the Edge.

Combining the new 10nm Atom® CPU, 2.5G Ethernet ports, PoE+ and ultra-compact enclosure with functional expansion capabilities, the Neousys’ POC-400 is a compact and versatile embedded controller that can fuel a variety of industrial applications.

Key Features

Intel® Elkhart Lake Atom® x6425E quad-core 2.0GHz/ 3.0GHz 12W processor
Rugged -25 °C to 70 °C fanless operation
2x 2.5GbE PoE+ ports and 1x 2.5GbE port with screw-lock
2x USB 3.1 Gen1 and 2x USB 2.0 ports with screw-lock
M.2 2280 M key SATA interface
Dual DP display outputs supporting 4096 x 2160 resolution
Front I/O access DIN-mounting design
MezIO® compatible

Specification

System Core
Processor	Intel® Elkhart Lake Atom® x6425E quad-core 2.0GHz/3.0GHz 12W processor
Graphics	Integrated Intel® UHD Graphics
Memory	Up to 32 GB DDR4-3200 SDRAM by one SODIMM socket
TPM	Supports fTPM 2.0
Panel I/O Interface
Ethernet	3x 2.5GBASE-T Ethernet ports by Intel® I225 GbE controllers
POE	Optional IEEE 802.3at PoE+ on port #2 and #3
Video Port	2x DisplayPort connector, supporting 4096 x 2160 resolution @ 60Hz
USB	2x USB 3.1 Gen1 (5 Gbps) ports 2x USB 2.0 ports
Serial Port	1x software-programmable RS-232/422/485 ports (COM1) 3x 3-wire RS-232 ports (COM2/3/4) or 1x RS-422/485 port (COM2)
Audio	Optional 1x 3.5 mm jack for mic-in and speaker-out
Internal Expansion Bus
M.2 E key	1x M.2 2230 E key socket for WiFi, Google TPU or Movidius VPU module
Expandable I/O	1x MezIO® expansion port for Neousys MezIO® modules

Storage Interface
M.2 M key	1x M.2 2280 SATA interface
Power Supply
DC Input	1x 3-pin pluggable terminal block for 8-35V DC input
Mechanical
Dimension	56 mm (W) x 108 mm (D) x 153 mm (H)
Weight	0.96kg
Mounting	DIN-rail mount (standard) or Wall-mount (optional)
Environmental
Operating Temperature	-25°C ~ 70°C/*
Storage Temperature	-40°C ~85°C
Humidity	10%~90% , non-condensing
Vibration	Operating, MIL-STD-810G, Method 514.7, Category 4
Shock	Operating, MIL-STD-810G, Method 516.7, Procedure I
EMC	CE/FCC Class A, according to EN 55032 & EN 55035

* The 100% CPU/GPU loading for high temperature test is applied using Passmark® BurnInTest™ v8.0. For detail testing criteria, please contact Neousys Technology

** For sub-zero operating temperature, a wide temperature HDD drive or Solid State Disk (SSD) is required.

Power Backup Modules:

PB-9250J-SA – 9250 w.s Standalone Intelligent SuperCAP Power Backup Module

PB-4600J-SA – 4600 w.s Standalone Intelligent SuperCAP Power Backup Module

PB-2580J-SA – 2580 w.s Standalone Intelligent SuperCAP Power Backup Module

Ordering Information

POC-400

Intel® Elkhart Lake Atom® x6425E ultra-compact DIN-rail fanless rugged computer with 1x 2.5GbE, 2x 2.5G PoE+ and 2x USB 3.1 Gen1

POC-410

Intel® Elkhart Lake Atom® x6425E ultra-compact DIN-rail fanless rugged computer with 3x 2.5GbE and 2x USB 3.1 Gen1

Optional 1x 3.5 mm jack for mic-in and speaker-out

Supported MezIO® Modules

Neousys MezIO® module offers computer signals, power rails and control signals via a high-speed connector. It transforms Neousys embedded systems into application-specific systems with application-oriented I/Os such as RS-232/422/485, isolated DIO and ignition power control.

Optional Accessories

PA-60W-OW

60W AC/DC power adapter with 12V, 5A DC output, cord end terminals for terminal block. Operating temperature : -30 to 60 °C

Wmkit-V-POC400

Wall-mount assembly for POC-400 series, vertical type

Wmkit-H-POC400

Wall-mount assembly for POC-400 series, horizontal type

Cbl-DB9F-3DB9M-15CM

1x DB9 (Female) to 3x DB9 (Male), length: 15CM

Datasheet

Download

BVM Customisation Service

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish.

If you’re unable to find an off-the-shelf product that meets your specific requirements, don’t hesitate to contact our in-house design team. They possess the expertise to customise an existing product to your exact specifications or embark on a fresh design journey to create a customized solution tailored to your requirements.

Our design professionals are dedicated to delivering exceptional results, ensuring that the final product not only meets but exceeds your expectations. When you collaborate with our team, you open the door to a world of possibilities, where innovation and creativity converge to bring your vision to life.

Whether it’s modifying an existing product or crafting an entirely new one, our design experts are committed to providing you with a comprehensive, end-to-end solution that perfectly suits your needs. Your satisfaction is our top priority, and we’re here to turn your ideas into reality.

Design | Develop | Test | Manufacture

With over three decades of experience in designing custom industrial and embedded computer and display solutions across a wide array of industries, we’re here to turn your ideas into reality

Here’s a selection of our design, manufacturing & associated services: –

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a brand-new product from scratch or working with an existing prototype.

FREE Pre-design / Pre-sales advise
Prototyping
- Custom PC Design
- Custom Panel PC
- Custom Racks and Towers
- Custom Peli Case PCs
Prototyping pre checks (chargeable one-time fee for existing prototype)
- Hardware compatibility
- Thermal testing
- Software compatibility
Custom PCB / Board Design
- COM Express, Qseven, SMARC
  Jetson, Raspberry Pi
Custom Chassis Design
- Metal
- Plastic
Custom Cables
Custom Back Panels and Faceplates
Custom Cooling
Custom Metal Work (internal brackets, mounting brackets)
Touchscreen Integration and Display Enhancements
- Custom LCD Displays
- Integration of touch technologies
- Optical Bonding
- Anti-reflective and anti-glare coatings
All products are Designed for Manufacture
Software – Custom OS Image

Build to Order: Embedded Computer Design and Customisation Services

Take an existing system and we can:

Custom specification (CPU, RAM, I/O, Industrial Storage, RAID)
Chassis customisation and branding
Custom BIOS
Long Term Availability
Software – Custom OS Image
Custom Packaging and branding
Integrating newly designed or existing hardware into a larger system

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

Embedded Software Services : Configuration, Integration and Deployment

Porting, Integration & Deployment

Windows image capture from customers HDD
Linux image capture from customers HDD
Android image capture from customers HDD
Windows / Linux Deployment from customers image
Custom Windows images, create and deploy
Update management
Custom Linux and Android images
Custom BIOS

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing	Materials Management	Logistics and Tracking	External Manufacturing
• Burn in Test • Temp / Thermal Testing • Environmental Testing • Safety Testing • Software Compatibility Test	• Vendor Selection and Component Procurement • Product Traceability • Obsolescence, End of Life and Last Time Procurement Management • Simple to use on-line RMA System	• Traceability of Shipments • Product Labelling • OEM/Branded Packaging • System Branding • Custom Labels	• Surface Mount: – High Speed Placement • Conventional Through Hole Insertion & Assembly • Automated Optical Inspection • Bespoke PCB Test