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Industrial and Embedded Products

  • EC500 CSSide200824 w600

    DFI EC500-CS 8th/9th Gen 5G Fanless Embedded System

    • Product Name: DFI EC500-CS
    • System Type: Fanless Embedded System
    • CPU: 8th/9th Gen Intel Core
    • RAM: Supports DDR4 SODIMM up to 64GB
    • Expansion: 3 M.2 slots support NVMe
    • Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Rich I/O connectivity: 2 GbE, 4 COM, 4 USB 3.1, 2 USB 2.0 (Q370 only), Support 5G Communication, Operating Temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
  • EC90ASide210324 w600

    DFI EC90A-GH AMD Ryzen Ultra Compact Fanless Embedded System

    • Product Name: DFI EC90A-GH
    • System Type: Ultra Small Mini PC Fanless Embedded System
    • CPU: AMD Ryzen Embedded R1000 Series
    • RAM: DDR4 2400 MHz SODIMM down up to 4GB/8GB (memory onboard)
    • Expansion: 1 x Mini-PCIe (PCIe signal)
    • Other features: Ultra Small Size: 110 x 80mm x 60mm (W x H x D), User-friendly design for installing SIM card, I/O: 1 Intel GbE, 1 USB 3.1 Gen 2, 2 Micro HDMI, 10-Year CPU Life Cycle Support Until Q1’30 (Based on AMD Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • ECX700 ADP 1

    DFI ECX700-ADP 12th Gen Outdoor Ruggedized IPC67 Mini PC

    • Product Name: DFI ECX700-ADP
    • System Type: Outdoor Ruggedized IPC67 Box PC
    • CPU: Intel Alder Lake-P Processor i5-1245UE / i7-1265UE
    • RAM: Supports DDR4 memory
    • Expansion: Multiple I/O interfaces for versatile connectivity
    • Other Features: IP67-rated waterproof and dustproof design, extreme ruggedization to IEC 60068-2-64, wide operating temperature range (-20 to 70°C)
    This product has multiple variants. The options may be chosen on the product page
  • ECX700 ALSide201126R2 W600

    DFI ECX700-AL Outdoor Ruggedized IPC67 Grade Box PC

    • Product Name: DFI ECX700-AL
    • System Type: Ruggedized Outdoor IoT IP67 Fanless Embedded System
    • CPU: Intel Atom Processor E3900 Series
    • RAM: 4GB DDR3 onboard, 64G eMMC
    • Expansion: 1 x Full-size Mini PCIe for 4G LTE module, 1 x Full-size Mini PCIe for Canbus, 1 x M.2 2230 (USB2.0/PCIe) for WiFi module
    • Other features: Ruggedized IPC67 Grade Box PC, Outdoor IoT Gateway Application, Operating temperature: -40° to 70° C, 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • EC100 XNX side w600

    DFI EC100-XNX NVIDIA Jetson Xavier NX PoE Embedded System

    • Product Name: DFI EC100-XNX
    • System Type: Industrial PC
    • CPU: NVIDIA Jetson Xavier NX
    • RAM: 8Gb
    • Expansion: 20 pins with 1 x UART, 2 x I2C, 9 x GPIOs
    • Other features: Fully supports NVIDIA Jetson Xavier NX, 8 x 10/100 MbE with PoE, Fanless chassis technology, 1 x HDMI 2.0a/b Type-A supports 4K@60Hz
  • AL553F190326 RAw600

    DFI AL553 Intel Atom E3900 3.5″ SBC

    • Product Name: DFI AL553
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: Intel Atom E3900
    • RAM: 1 DDR3L SODIMM up to 8GB
    • Expansion: Three independent displays: VGA + LVDS + HDMI; Multiple expansion: 1 M.2 B Key, 1 M.2 E Key, Mini PCIe
    • Other features: Rich I/O: 2 Intel GbE, 1 COM, 2 USB 3.1 Gen1, 4 USB 2.0; 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • AL551 F 070824RAw600

    DFI AL551 Intel Atom E3900 3.5″ SBC

    • Product Name: DFI AL551
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: Intel Atom E3900
    • RAM: 1 DDR3L SODIMM up to 8GB
    • Expansion: Three independent displays: VGA + LVDS + DP++; Wireless communication: mini PCIe
    • Other features: Rich I/O: 2 Intel GbE, 2 COM, 2 USB 3.0, 4 USB 2.0; 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap)
  • AL700 Back Website

    DFI AL700 Intel Atom E3900 Qseven

    • Product Name: DFI AL700
    • Module Form Factor: Intel Atom E3900 Qseven
    • CPU: Intel Atom E3900 Series
    • RAM: 4GB/8GB DDR3L Dual Channel Memory Down
    • Expansion: Multiple expansions: 4 PCIe x1
    • Other features: Rich I/O: 1 Intel GbE, 1 USB 3.0, 8 USB 2.0; 1 DDI*, 1 LVDS*/(eDP + DDI) Supports triple displays: eDP+2DDI; 15-Year CPU Life Cycle Support Until Q1′ 31 (Based on Intel IOTG Roadmap)
  • AL701F090426 W600

    DFI AL701 Intel Atom E3900 Qseven

    • Product Name: DFI AL701
    • Module Form Factor: Intel Atom E3900 Qseven
    • CPU: Intel Atom E3900
    • RAM: 4GB/8GB LPDDR4 Dual Channel Memory
    • Expansion: Multiple expansions: 4 PCIe x1
    • Other features: 1 DDI*, 1 LVDS*/(eDP + DDI)；Supports triple displays: eDP+2DDI; DP++ resolution supports up to 4096×2160 @ 60Hz; Rich I/O: 1 Intel GbE, 1 USB 3.0, 8 USB 2.0; 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on Intel IOTG Roadmap)
  • AL968 Front Website

    DFI AL968 Intel Atom E3900 COM Express Compact

    • Product Name: DFI AL968
    • Module Form Factor: COM Express Compact
    • CPU: Intel Atom E3900 Series
    • RAM: Dual channel DDR3L 1600MHz SODIMM up to 8GB
    • Expansion: Multiple expansion: 4 PCIe x1, 1 LPC, 1 I2C, 1 SMBus, eMMC
    • Other features: Three independent displays: VGA*/DDI + LVDS*/eDP + DDI; Rich I/O: 1 Intel GbE, 4 USB 3.0, 8 USB 2.0, 2 SATA 3.0; 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on Intel IOTG Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • photo front AL9A8 RA

    DFI AL9A8 Intel Atom E3900 COM Express Mini

    • Product Name: DFI AL9A8
    • Module Form Factor: COM Express Mini
    • CPU: Intel Atom E3900 Processor Series
    • RAM: Dual Channel LPDDR4-2400MHz Memory Down up to 8GB
    • Expansion: Multiple expansions: 4 PCIe x1
    • Other features: Rich I/O: 1 Intel GbE, 2 USB 3.0, 8 USB 2.0; 1 LVDS/eDP, 1 DDI (HDMI/DP++) Supports dual displays: DDI + LVDS/eDP; 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on Intel IOTG Roadmap)
  • GH551F200130R1 W600

    DFI GH551 AMD Ryzen V1000/R1000 Series 3.5″ SBC

    • Product Name: DFI GH551
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: AMD Ryzen V1000/R1000 Series
    • RAM: 1 DDR4 2400MHz SODIMM up to 16GB
    • Expansion: Multiple displays: max. 4 DP++/3 DP++ + LVDS; Multiple Expansion: 1 M.2 M Key, 1 Mini PCIe
    • Other features: Rich I/O: 3 GbE, 2 USB 3.1 Gen2, 1 USB 2.0; 10-Year CPU Life Cycle Support Until Q1′ 31 (Based on AMD Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • ALF51F080111RAw600

    DFI ALF51 1.8″ Intel Atom X5 or Celeron Industrial Pi SBC

    • Product Name: DFI ALF51
    • Motherboard Form Factor: 1.8″ SBC
    • CPU: Intel Atom Processor E3900 Series or Celeron CPU
    • RAM: 2GB/4GB LPDDR4 Memory Down
    • Expansion: 1 Mini DP++
    • Other features: Rich I/O: 2 Intel GbE, 1 COM, 2 USB 3.1 Gen 1, 1 USB 2.0, 15-Year CPU Life Cycle Support Until Q4’31 (Based on Intel IOTG Roadmap), Operating: 0 to 60°C
    This product has multiple variants. The options may be chosen on the product page
  • TWLF51 1

    DFI TWLF51 1.8″ Intel N Series Industrial Pi SBC

    • DFI TWLF51: Compact 1.8″ SBC
    • Form Factor: Ultra-small 1.8″ SBC ideal for embedded and edge deployments
    • CPU:Intel Atom X Series and Intel N Series processors (Amston Lake / Twin Lake)
    • RAM: Onboard single-channel LPDDR5 memory with up to 8GB capacity
    • Expansion: 1 x M.2 E Key slot with optional I2C/SMBus support
    • Other Features: HDMI 2.0 supporting up to 4K @ 60Hz, 1 x Intel GbE LAN, 1 x COM, 2 x USB 3.2 Gen 2, 2 x USB 2.0, Micro HDMI, and DIO support
    This product has multiple variants. The options may be chosen on the product page
  • RC300 CS SideIO200729R2 w600

    DFI VC300-CS AI-Enabled 5G MXM In-Vehicle PC

    • Product Name: DFI VC300-CS
    • System Type: AI-Enabled 5G MXM In-Vehicle PC
    • CPU: 8th/9th Generation Intel Core Processors
    • RAM: Dual Channel DDR4 2666/2400 MHz by SODIMMs up to 64GB
    • Expansion: 4 x 802.3af POE Ports, Multiple Expansion Slots for 3G/LTE/5G Cellular Support
    • Other features: AI Accelerated: Up to 110W GPU MXM Module Supported, Extended Operating Temperature: -25°C to 70°C, Support 5G Communication, 15-Year CPU Life Cycle Support Until Q1′ 34 (Based on Intel IOTG Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • ALF51F080111RAw600

    DFI ALF51-ET 1.8″ Intel Atom X5 or Celeron Industrial Pi SBC – Extended Temp

    • Product Name: DFI ALF51-ET
    • Motherboard Form Factor: 1.8″ SBC
    • CPU: Intel Atom Processor E3900 Series or Celeron
    • RAM: 2GB/4GB LPDDR4 Memory Down
    • Expansion: 1 Mini DP++
    • Other features: Rich I/O: 2 Intel GbE, 1 COM, 2 USB 3.1 Gen 1, 1 USB 2.0, 15-Year CPU Life Cycle Support Until Q4’31 (Based on Intel IOTG Roadmap), Operating: -40 to 85°C
    This product has multiple variants. The options may be chosen on the product page
  • ALF51F080111RAw600

    DFI ALF51-WT Intel Atom X5 or Celeron Industrial Pi SBC – Wide Temp

    • Product Name: DFI ALF51-WT
    • Motherboard Form Factor: 1.8″ SBC
    • CPU: Intel Atom Processor E3900 Series or Celeron
    • RAM: 2GB/4GB LPDDR4 Memory Down
    • Expansion: 1 Mini DP++
    • Other features: Rich I/O: 2 Intel GbE, 1 COM, 2 USB 3.1 Gen 1, 1 USB 2.0, 15-Year CPU Life Cycle Support Until Q4’31 (Based on Intel IOTG Roadmap), Operating: -20 to 70°C
    This product has multiple variants. The options may be chosen on the product page
  • KU968 Front Website

    DFI KU968 Kaby Lake 7th Gen Intel iCore COM Express Compact

    • Product Name: DFI KU968
    • Module Form Factor: COM Express Compact
    • CPU: 7th Gen Intel Core
    • RAM: Dual channel DDR4 2133MHz memory down up to 16GB
    • Expansion: Multiple expansion: 8 PCIe x1, 1 LPC, 1 I2C, 1 SMBus
    • Other features: Rich I/O: 1 Intel GbE, 4 USB 3.0, 8 USB 2.0; Three independent displays: VGA*/DDI + LVDS*/eDP + DDI; 15-Year CPU Life Cycle Support Until Q1′ 32 (Based on Intel IOTG Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • COM101 BAT Front Website

    DFI COM101-BAT Mini-ITX – COMe Basic/Compact Carrier Board

    • Product Name: DFI COM101-BAT
    • Motherboard Form Factor: Mini-ITX
    • CPU: Supports COMe Basic/Compact modules
    • RAM: Supports Compact/Basic modules
    • Expansion: Multiple displays (1 DP, 1 LVDS, 1 VGA)
    • Other features: Rich I/O (1 GbE, 6 USB)
  • COM332 B Front Website

    DFI COM332-B(R.A) Micro-ATX – COMe Basic/Compact Carrier Board

    • Product Name: DFI COM332-B
    • Motherboard Form Factor: Micro-ATX
    • CPU: Supports COMe Basic/Compact modules
    • RAM: Supports Compact and Basic modules
    • Expansion: Multiple displays (VGA, LVDS, DP, eDP)
    • Other features: Rich I/O (1 GbE, 4 USB 3.0, 4 USB 2.0)
  • COM332 BF070801w600

    DFI COM332-B(R.B1) Micro-ATX – COMe Basic/Compact Carrier Board

    • Product Name: DFI COM332-B
    • Motherboard Form Factor: Micro-ATX
    • CPU: Supports COMe Basic/Compact modules
    • RAM: Supports Compact and Basic modules
    • Expansion: Multiple displays (VGA, LVDS, DP, eDP)
    • Other features: Rich I/O (1 GbE, 4 USB 3.1, 4 USB 2.0)
  • COM333 Front Website

    DFI COM333-I Micro-ATX – COMe Basic/Compact Carrier Board

    • Product Name: DFI COM333-I
    • Motherboard Form Factor: Micro-ATX
    • CPU: Supports COMe Basic/Compact modules
    • RAM: Supports Compact and Basic modules
    • Expansion: Multiple expansion (8 PCIe x4 or 4 PCIe x8, 2 SATA 3.0)
    • Other features: Rich I/O (2 GbE, 4 10Gbase-KR, 4 USB 3.0/2.0, 1 COM)
  • RC300 CS Front200721 w600

    DFI RC-300-CS AI-Enabled 5G MXM Railway System

    • Product Name: DFI RC-300-CS
    • System Type: Railway System
    • CPU: 8th/9th Generation Intel Core Processors
    • RAM: Dual Channel DDR4 2666/2400 MHz by SODIMMs up to 64GB
    • Expansion: Multiple Expansion Slots for 3G/LTE/5G Cellular Support
    • Other features: AI-Enabled, 4 x M12 X-coded PoE Ports at 15W, AI Accelerated: Up to 110W GPU MXM Module Supported, Extended Operating Temperature: -25°C to 70°C Operation without Active Fan, Support 5G Communication, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • CS551B191017R1w600

    DFI CS551 Intel 8th/9th Gen Coffee Lake iCore 3.5″ SBC

    • Product Name: DFI CS551 3.5″ SBC
    • Motherboard Form Factor: 3.5″
    • CPU: 9th/8th Gen Intel Core with Intel C246
    • RAM: 1 DDR4 SODIMM up to 32GB
    • Expansion: Three independent displays: LVDS + DP++ + DP++; Multiple expansion: 1 M.2 M Key, 1 Mini PCIe
    • Other features: DP++ resolution up to 4096×2304 @ 60Hz; Rich I/O: 2 Intel GbE, 4 USB 3.1, 2 USB 2.0; 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on Intel IOTG Roadmap)
  • VC230 ALSide190313 w600

    DFI VC230-AL Intel Atom E3900 Series In-Vehicle PC

    • Product Name: DFI VC230-AL
    • System Type: Anti-vibration In-Vehicle PC
    • CPU: Intel Atom E3900 Series
    • RAM: 1 SODIMM Memory Support up to 8GB Single Channel DDR3L 1600/1866MHz
    • Expansion: 1 mSATA, eMMC (optional), 1 x Full-size Mini PCIe (PCIe/USB/Daul micro SIM), 1 x Full-size Mini PCIe (PCIe/USB/micro SIM), 1 x Half-size mSATA
    • Other features: Supports ignition delay on/off function, GPS Onboard, 3 SIM Slots Onboard, Supports Wi-Fi, 3G, and GPRS application, 15-Year CPU Life Cycle Support Until Q1′ 31 (Based on Intel IOTG Roadmap)
  • F8700F191031 W600

    DFI F8700 NXP i.MX8X Qseven

    • Product Name: DFI F8700
    • Module Form Factor: NXP i.MX8X Qseven
    • CPU: NXP i.MX8X
    • RAM: 4GB LPDDR4 Memory Down
    • Expansion: Multiple expansions: 1 PCIe x1, 1 SDIO x4 bit
    • Other features: Supports dual displays: 1 HDMI, 1 LVDS; Rich I/O: 1 GbE, 3 USB 3.0, 1 USB 2.0 OTG; 15-Year CPU Life Cycle Support Until Q1′ 29 (Based on NXP Roadmap)
  • RC300 CS SideIO200729R2 w600

    DFI EC300-CS AI-Enabled 5G MXM PoE High Performance System

    • Product Name: DFI EC300-CS
    • System Type: AI-Enabled 5G MXM PoE High Performance System
    • CPU: 8th/9th Generation Intel Core Processors
    • RAM: Dual Channel DDR4 2666/2400 MHz by SODIMMs up to 64GB
    • Expansion: Multiple Expansion Slots for 3G/LTE/5G Cellular Support
    • Other features: 4 x RJ45 type PoE ports at 15W, AI Accelerated: Up to 110W GPU MXM Module Supported, Extended Operating Temperature: -25°C to 70°C, Support 5G Communication, 15-Year CPU Life Cycle Support Until Q1′ 34 (Based on Intel IOTG Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • Q7X 151 Front Website

    DFI Q7X-151(R.A) Mini-ITX – Qseven Carrier Board

    • Product Name: DFI Q7X-151
    • Motherboard Form Factor: Mini-ITX
    • CPU: Supports Qseven modules
    • RAM: Supports Qseven modules
    • Expansion: Multiple displays (1 DP, 1 LVDS)
    • Other features: Rich I/O (1 GbE, 1 USB 3.0, 6 USB 2.0, 2 COM)
  • Q7X 151F190621 W600

    DFI Q7X-151(R.D1) Mini-ITX – Qseven Carrier Board

    • Product Name: DFI Q7X-151
    • Motherboard Form Factor: Mini-ITX
    • CPU: Supports Qseven modules
    • RAM: Supports Qseven modules
    • Expansion: Multiple displays (2 DP, 1 LVDS, 1 eDP)
    • Other features: Rich I/O (1 GbE, 3 USB 3.0, 8 USB 2.0, 2 COM)
  • SDML WLF191025R1 w600

    DFI SDML-WL 8th Gen Intel iCore Smart Display Module

    • Product Name: DFI SDML-WL
    • Module Form Factor: Smart Display Module
    • CPU: 8th Gen Intel iCore
    • RAM: 2 DDR4 2400MHz SODIMM up to 32GB
    • Expansion: 1 M.2 E Key, 1 M.2 M Key, 1 M.2 B Key
    • Other features: HDMI resolution up to 4096 x 2160 @ 60Hz, DisplayPort resolution up to 4096 x 2304 @ 60Hz, Rich I/O: 1 Intel GbE, 4 USB3.1, 1 USB3.1 Type C, 15-Year CPU Life Cycle Support Until Q3′ 34 (Based on Intel IOTG Roadmap)
  • WL551 Front060520 R1 w600

    DFI WL551 Intel 8th Gen Whiskey Lake iCore 3.5″ SBC

    • Product Name: DFI WL551
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: 8th Gen Intel Core Processor
    • RAM: Not specified
    • Expansion: Dual independent displays: DP + HDMI, 1 LVDS or eDP (opt.); Multiple Expansion: 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
    • Other features: 4K High Resolution: Supports 4K/2K resolution; Rich I/O 1: 3 Intel GbE, 1 COM, 4 USB 3.1 Gen2, 2 USB 2.0; 15-Year CPU Life Cycle Support Until Q2′ 35 (Based on Intel IOTG Roadmap)
  • WL968 Front200506 R1 w600

    DFI WL968 Whiskey Lake 8th Gen Intel iCore COM Express Compact

    • Product Name: DFI WL968
    • Module Form Factor: COM Express Compact
    • CPU: 8th Generation Intel Core Processor
    • RAM: DDR4 2400/2133MHz SODIMM up to 64GB
    • Expansion: Multiple expansion: 8 PCIe x1, 1 LPC, 1 I2C, 1 SMBus
    • Other features: VGA/DDI + LVDS/eDP + DDI; DP++ supports 4K x 2K resolution; Rich I/O: 1 Intel GbE, 4 USB 3.0, 8 USB 2.0; 15-Year CPU Life Cycle Support Until Q2′ 35 (Based on Intel IOTG Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • AL053M080213RAw600

    DFI AL053 Intel Atom Processor E3900 Pico-ITX

    • Product Name: DFI AL053
    • Motherboard Form Factor: Pico-ITX SBC
    • CPU: Intel Atom X5-E3930 / X5-E3940 / 7-E3950 / N3350
    • RAM: 1 DDR3L SODIMM up to 8GB
    • Expansion: 1 Mini PCIe, 1 M.2, 1 SMBus
    • Other features: Two independent displays: LVDS + Mini DP++, Rich I/O: 1 Intel GbE, 1 COM, 2 USB 3.1 Gen1, 2 USB 2.0, 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap)
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    This product has multiple variants. The options may be chosen on the product page
  • tgu968 top web

    DFI TGU968 Tiger Lake 11th Gen Intel iCore COM Express Compact

    • Product Name: DFI TGU968
    • Module Form Factor: COM Express Compact
    • CPU: 11th Generation Intel Processor
    • RAM: DDR4 3200MHz SODIMM up to 64GB
    • Expansion: Multiple expansion: 8 PCIe x1, 1 I2C, 1 SMBus
    • Other features: VGA/DDI + LVDS/eDP + DDI; DP++ supports 4K x 2K resolution; Rich I/O: 1 Intel 2.5GbE, 4 USB 3.1, 8 USB 2.0; 15-Year CPU Life Cycle Support Until Q2′ 35 (Based on Intel IOTG Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • EC700 AL 1

    DFI EC700-AL Fanless Wide Temp Embedded Ultra Compact PC

    • Product Name: DFI EC700-AL
    • System Type: Fanless Wide Temp Embedded Ultra Compact PC
    • CPU: Intel Atom Processor E3900 Series, BGA 1296
    • RAM: DDR3L-1866 memory onboard + 1 SODIMM up to 8GB
    • Expansion: Supports 2 Mini PCIe and 1 M.2 slots
    • Other features: Displays: 1 DP/HDMI combo + 1 DP/VGA, Rich I/O ports: up to 4 Intel GbE, 4 COM, 4 USB, Extended operating temperature: -40 to 70°C, 15-Year CPU Life Cycle Support Until Q1’31 (Based on Intel IOTG Roadmap)
  • TGU9A2 Front

    DFI TGU9A2 Tiger Lake 11th Gen Intel COM Express Mini

    • Product Name: DFI TGU9A2
    • Module Form Factor: COM Express Mini
    • CPU: 11th Generation Intel Processor
    • RAM: Dual Channel LPDDR4X 4266MHz
    • Expansion: Multiple expansion: 1 PCIe x4, 2 I2C, 1 SMBus
    • Other features: 1 LVDS/eDP, 1 DDI (HDMI/DVI/DP++), Dual Display: DDI + LVDS/eDP; DP++ supports 4K x 2K resolution; Rich I/O: 1 Intel GbE, 2 USB 3.2, 8 USB 2.0; 15-Year CPU Life Cycle Support Until Q2′ 35 (Based on Intel IOTG Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • WL051F200317R1 w600

    DFI WL051 8th Gen Intel CoreTM Processor 2.5″ Pico-ITX

    • Product Name: DFI WL051
    • Motherboard Form Factor: Pico-ITX SBC
    • CPU: 8th Gen Intel Core i7-8665UE / i5-8365UE / i3-8145UE / Celeron 4305UE
    • RAM: Not specified
    • Expansion: 1 M.2 E key, 2 M.2 B key
    • Other features: Fanless, 0 to 60°C operating temperature, Triple independent displays: DP++ + HDMI + eDP, Rich I/O: 2 Intel GbE, 1 COM, 2 USB 3.1 Gen 2, 2 USB 2.0
    This product has multiple variants. The options may be chosen on the product page
  • AL051F070706RAw420

    DFI AL051 Intel Atom / Pentium / Celeron Processor E3900 Pico-ITX

    • Product Name: DFI AL051
    • Motherboard Form Factor: Pico-ITX SBC
    • CPU: Intel Atom X5-E3930 / X5-E3940 / 7-E3950 / N3350
    • RAM: 1 DDR3L SODIMM up to 8GB
    • Expansion: 1 Mini PCIe, 1 M.2, 1 SMBus
    • Other features: Fanless design, operating temperature -40 to 85°C, Triple independent displays: VGA + Mini DP++ + LVDS, Rich I/O: 2 Intel GbE, 1 COM, 2 USB 3.1 Gen 1, 2 USB 2.0, 15-Year CPU Life Cycle Support Until Q1′ 31 (Based on Intel IOTG Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • ALO5PF071009w600

    DFI AL05P Intel Celeron / Atom Processor Pico-ITX + PoE

    • Product Name: DFI AL05P
    • Motherboard Form Factor: Pico-ITX SBC
    • CPU: Intel Atom X5-E3930 / X5-E3940 / N3350 / X5-E3930
    • RAM: Support LPDDR4 memory down up to 4GB
    • Expansion: 1 Mini PCIe, 1 SMBus, 1 eMMC
    • Other features: Fanless design, operating temperature 0 to 60°C, Rich I/O: 1 LAN, 1 COM, 2 USB 3.0, 2 USB 2.0, PoE single board solution support PoE PD 48VDC, 15-Year CPU Life Cycle Support Until Q1′ 31 (Based on Intel IOTG Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • GM341 GHF

    DFI GM341-GHF V1000/R1000 Gaming Embedded System

    • Product Name: DFI GM341-GHF
    • System Type: Gaming Embedded System
    • CPU: AMD Ryzen Embedded V1000/R1000 processors
    • RAM: Two 260-pin SODIMM up to 32GB
    • Expansion: 5 COM, 6 USB, 2 LAN, M.2 support
    • Other features: High performance Radeon VEGA series graphics, 4 DP++ 4K monitor support (V1000), Comprehensive gaming features, 12V DC single input, 10-Year CPU Life Cycle Support
    This product has multiple variants. The options may be chosen on the product page
  • EC700 BTV

    DFI VC230-BT E3845 Fanless In-Vehicle PC System

    • Product Name: DFI VC230-BT
    • System Type: Fanless In-Vehicle Computer
    • CPU: Intel Atom Processor E3800 Series, BGA 1170
    • RAM: 1333MHz DDR3
    • Expansion: 1 mSATA, eMMC (optional), microSD (optional)
    • Other features: Supports ignition delay on/off function, Supports Wi-Fi, 3G, and GPRS application, 15-Year CPU Life Cycle Support
  • VP101 BT

    DFI VP101-BT 10.1″ Atom E3825 In-vehicle Touch Panel PC

    • Product Name: DFI VP101-BT-252I
    • Screen Size: 10.1″
    • CPU: Intel Atom Processor E3800 Series
    • RAM: 2GB/4GB ECC Memory Single Channel DDR3L 1333MHz
    • Expansion: 1 x Full-size Mini PCIe (PCIe/USB), 1 x Full-size Mini PCIe (mSATA), 1 x Half-size Mini PCIe (PCIe/USB/LPC)
    • Other features: Supports Ignition Control and Delay On/Off Function, IP65 Front Panel Protection, VESA/Panel Mount, Rich I/O: 2 LAN, 5 COM, 1 USB 3.0, 3 USB 2.0, 15-Year CPU Life Cycle Support Until Q1′ 28 (Based on Intel IOTG Roadmap), 10.1″ 1280×800 TFT LCD Panel with Touch Screen, 2.5″ SATA 2.0 Drive Bay, micro SD (available upon request)
  • VP101 BT

    DFI VP101-BT 10.1″ Atom E3845 In-vehicle Touch Panel PC

    • Product Name: DFI VP101-BT-454
    • Screen Size: 10.1″
    • CPU: Intel Atom Processor E3800 Series
    • RAM: 2GB/4GB ECC Memory Single Channel DDR3L 1333MHz
    • Expansion: 1 x Full-size Mini PCIe (PCIe/USB), 1 x Full-size Mini PCIe (mSATA), 1 x Half-size Mini PCIe (PCIe/USB/LPC)
    • Other features: Supports Ignition Control and Delay On/Off Function, IP65 Front Panel Protection, VESA/Panel Mount, Rich I/O: 2 LAN, 5 COM, 1 USB 3.0, 3 USB 2.0, 15-Year CPU Life Cycle Support Until Q1′ 28 (Based on Intel IOTG Roadmap)
  • CH960 w600

    DFI HM370 8th Gen Com Express Basic Module

    • Product Name: DFI HM370
    • Module Form Factor: Com Express Module
    • CPU: 8th Generation Intel Core
    • RAM: Dual channel DDR4 2666MHz SODIMM up to 32GB
    • Expansion: Multiple expansion: 1 PCIe x16, 8 PCIe x1
    • Other features: Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI; Supports three independent displays; eDP resolution supports up to 4096×2304 @ 60Hz; Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0; 15-Year CPU Life Cycle Support Until Q1′ 32 (Based on Intel IOTG Roadmap)
  • EC70B SU

    DFI EC70B Fanless Embedded BOX PC 6th Gen i3 / i5 / i7

    • Product Name: DFI EC70B-SU6864E-668
    • System Type: Fanless Embedded System
    • CPU: 6th Generation Intel Core
    • RAM: 4GB/8GB DDR4 memory onboard
    • Expansion: 1x 2.5″ SATA 3.0 drive bay, Supports 2 Mini PCIe for wireless application
    • Other features: Rich I/O ports: 2 Intel GbE, 4 COM, 4 USB 3.0, 15-Year CPU Life Cycle Support
    This product has multiple variants. The options may be chosen on the product page
  • EC800 AL

    DFI EC800 Atom E3930 Embedded BOX PC

    • Product Name: DFI EC800-AL552THV-E3930-2
    • System Type: Embedded BOX PC
    • CPU: Intel Atom Processor E3900
    • RAM: 2GB/4GB/8GB LPDDR4-2400 memory onboard
    • Expansion: Supports 1 Mini PCIe and 2 M.2 slots
    • Other features: Triple independent displays: 1 VGA/DVI-D + 2 DP/HDMI, Rich I/O ports: 2 Intel GbE, 2 COM, 4 USB, 15-Year CPU Life Cycle Support
  • EC700 BTV

    DFI VC230-BT E3825 Fanless In-Vehicle System

    • Product Name: DFI VC230-BT
    • System Type: Fanless In-Vehicle System
    • CPU: Intel Atom Processor E3800 Series, BGA 1170
    • RAM: 4GB/2GB ECC Memory Onboard
    • Expansion: 1 mSATA, eMMC (optional), microSD (optional)
    • Other features: Anti-vibration and fanless design, Supports ignition delay on/off function, Supports Wi-Fi, 3G, and GPRS application, 15-Year CPU Life Cycle Support
  • GM330 BFF 1

    DFI GM330 AMD Ryzen G-Series GX-217GI Embedded Gaming System

    • Product Name: DFI GM330-BFF-217GI
    • System Type: Embedded Gaming System
    • CPU: AMD Embedded G-Series Processor Dual Core 1.7GHz GX-217GI
    • RAM: 260-pin SODIMM up to 32GB Dual Channel DDR4 3200MHz
    • Expansion: 2 DP++, 5 COM, 7 USB, 2 LAN, M.2 support
    • Other features: 12V DC single input, Stereo audio amp output