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Industrial and Embedded Products

Showing 65–96 of 114 results

  • ADN9A2 1

    DFI ADN9A2 Intel Alder Lake N COM Express Mini

    • Product Name: DFI ADN9A2
    • Module Form Factor: COM Express Mini
    • CPU: Intel Atom Processor Alder Lake-N Series
    • RAM: Dual Channel LPDDR5 4800MHz, up to 16GB
    • Expansion: 4 PCIe x1, 1 SMBus, 1 I2C, 1 eMMC
    • Other Features: Supports dual displays (DDI + LVDS/eDP), 2 USB 3.2, 8 USB 2.0, 2.5GbE Ethernet
    This product has multiple variants. The options may be chosen on the product page
  • ASL9A2 1

    DFI ASL9A2 Intel Amston Lake COM Express Mini

    • Product Name: DFI ASL9A2
    • Module Form Factor: COM Express Mini
    • CPU: Intel Atom Processor Amston Lake Series
    • RAM: Dual Channel LPDDR5 4800MHz, up to 16GB
    • Expansion: 4 PCIe x1, 1 SMBus, 1 I2C, 1 eMMC
    • Other Features: Dual display support (DDI + LVDS/eDP), 2 USB 3.1, 8 USB 2.0, 100M/1000M/2.5Gbps Ethernet
  • EHL9A2 Top w600

    DFI EHL9A2 Intel Elkhart Lake COM Express Mini

    • Product Name: DFI EHL9A2
    • Module Form Factor: COM Express Mini – COM Express Type 10
    • CPU: Intel Atom Processor Elkhart Lake Series
    • RAM: Dual Channel LPDDR4X 3200MHz/4267MHz up to 16GB
    • Expansion: Multiple expansions: 4 PCIe x1
    • Other features: 1 LVDS/eDP, 1 DDI (HDMI/DP++); Supports dual displays: DDI + LVDS/eDP, Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0, 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on Intel IOTG Roadmap).
  • CMS101 103 W480F210831 R1 w600

    DFI CMS101/CMS103 10th Gen Intel iCore Wide Temp Mini-ITX

    • Product Name: DFI CMS101/CMS103
    • Motherboard Form Factor: Mini-ITX
    • CPU: 10th Generation Intel Core Processors
    • RAM: 2 DDR4 2933MHz SODIMM up to 64GB
    • Expansion: 1 PCIe x16, 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
    • Other features: Multiple Displays: 2 x DP++, 1 LVDS/eDP; Supports up to 4K/2K resolution; Rich I/O: 1 Intel 2.5GbE, 2 Intel GbE, 4 COM, 4 USB 3.2 Gen2, 4 USB 2.0; 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
  • EC70A TGU 5

    DFI EC70A-TGU Tiger Lake Fanless Embedded System

    • Product Name: DFI EC70A-TGU
    • System Type: Tiger Lake Fanless Embedded System
    • CPU: 11th Gen Intel Core i7/i5/i3 Processors
    • RAM: On board memory 8GB and 1 SO-DIMM DDR4
    • Expansion: Support M.2 B key 3042/3052 5G-NR module
    • Other features: Triple Displays: 2 HDMI (4K@30Hz) + 1 VGA (2K@60Hz), Up to 4 LAN or 6 USB, 15-Year CPU Life Cycle Support Until Q3′ 35 (Based on Intel IOTG Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • GH171F070621 R1w600

    DFI GH171 AMD Ryzen V1000/R1000 Mini-ITX

    • Product Name: DFI GH171
    • Motherboard Form Factor: Mini-ITX
    • CPU: AMD Ryzen V1000/R1000
    • RAM: 2 DDR4 3200MHz SODIMM up to 32GB
    • Expansion: 1 PCIe x16, 1 M.2 M Key
    • Other features: Four independent displays: DP++ + DP++ + DP++ + DP++; Rich I/O: 2 GbE, 6 COM, 3 USB 3.0, 6 USB 2.0; 10-Year CPU Life Cycle Support Until Q1′ 28 (Based on AMD Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • RNO171F210506 w600

    DFI RNO171 AMD Ryzen V2000 Mini-ITX

    • Product Name: DFI RNO171
    • Motherboard Form Factor: Mini-ITX
    • CPU: AMD Ryzen V2000
    • RAM: 2 DDR4 3200MHz SODIMM up to 64GB
    • Expansion: 1 PCIe x16, 1 M.2 M Key
    • Other features: Four independent displays: DP++ + DP++ + DP++ + DP++; Rich I/O: 2 GbE, 6 COM, 2 USB 3.1 Gen2, 7 USB 2.0, SATA 3.0; 10-Year CPU Life Cycle Support Until Q4′ 30 (Based on AMD Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • DT200 CS side w600

    DFI DT200-CS High Performance MXM Embedded System

    • Product Name: DFI DT200-CS
    • System Type: High Performance MXM Embedded System
    • CPU: 8th/9th Generation Intel Core Processors
    • RAM: DDR4 2400/2666MHz up to 64GB
    • Expansion: Support M.2 B key 3052 5G cellular module
    • Other features: Multiple displays: 4 DP (from MXM), 1 DP++/HDMI (auto-detection), AI accelerated: up to 110W GPU MXM module supported, Rich I/O connectivity: 4 LAN, 4 USB 3.1, 6 USB 2.0, 2 COM, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
  • MD711 SU

    DFI MD711 i7 Medical Embedded System

    • Product Name: DFI MD711-SU2061-100G
    • System Type: Medical Embedded System
    • CPU: 6th Generation Intel Core
    • RAM: 2 DDR4 SODIMM up to 32GB
    • Expansion: Supports 1 PCIe 16, 1 Mini PCIe, 1 M.2 slot
    • Other features: 2 x 2.5″ SATA 3.0 drive bay, 4KV Isolated I/O ports: 2 Intel GbE, 2 COM, 2 USB 2.0, 15-Year CPU Life Cycle Support
  • MD711 SU

    DFI MD711 i5 Medical Embedded System

    • Product Name: DFI MD711-SU2061-000G
    • System Type: Medical Embedded System
    • CPU: 6th Generation Intel Core
    • RAM: 2 DDR4 SODIMM up to 32GB
    • Expansion: Supports 1 PCIe 16, 1 Mini PCIe, 1 M.2 slot
    • Other features: 2 x 2.5″ SATA 3.0 drive bay, 4KV Isolated I/O ports: 2 Intel GbE, 2 COM, 2 USB 2.0, 15-Year CPU Life Cycle Support
  • ES220 CSSide200612 w600

    DFI ES220-CS High Performance 9th/8th Gen iCore Embedded System

    • Product Name: DFI ES220-CS
    • System Type: High Performance 9th/8th Gen iCore Embedded System
    • CPU: 8th/9th Gen Intel Core Processors with Intel C246/Q370/H310 Chipset
    • RAM: 2 DDR4 SODIMM up to 64GB
    • Expansion: Single/Triple storage: 1 M.2 SSD + 2 2.5″ SSD (option) (with RAID supported)
    • Other features: Rich I/O connectivity: 2 Intel GbE, 4 USB 3.1, 2 USB 2.0, 2 COM, 2 HDMI 2.0 Support resolution 4K@60Hz, Acoustic level support full load 36dB @operating temperature 45° C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • EC102 XNX 1 1

    DFI EC102-XNX NVIDIA Jetson Xavier NX Embedded System

    • Product Name: DFI EC102-XNX
    • System Type: NVIDIA Jetson Industrial PC
    • CPU: NVIDIA Jetson Xavier NX
    • RAM: 8Gb
    • Expansion: 20 pins with 1 x UART, 2 x I2C, 9 x GPIOs
    • Other features: 91.4mm (W) x 70mm (H) x 76.6mm (D), Fanless chassis technology, 1 x HDMI 2.0a/b Type-A supports 4K@60Hz
  • CH961 front

    DFI CH961 8th/9th Gen Intel iCore Xeon COM Express Basic

    • Product Name: DFI CH961
    • Module Form Factor: COM Express Basic
    • CPU: 8th/9th Gen Intel iCore Xeon Celeron
    • RAM: Dual channel DDR4 2666MHz SODIMM up to 96GB
    • Expansion: Multiple expansion: 1 PCIe x16, 8 PCIe x1
    • Other features: Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI Supports three independent displays; DP++ resolution supports up to 4096×2304 @ 60Hz; Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
    This product has multiple variants. The options may be chosen on the product page
  • photo front GH9A3 R011 web

    DFI GH9A3 AMD Ryzen R1000 Series COM Express Mini

    • Product Name: DFI GH9A3
    • Module Form Factor: COM Express Mini
    • CPU: AMD Ryzen R1000 Series Processor
    • RAM: Single Channel LPDDR4 2400MHz; Memory Down up to 8GB
    • Expansion: Multiple expansions: 3 PCIe x1
    • Other features: 1 LVDS/eDP, 1 DDI (HDMI/DP); Supports dual displays: DDI + LVDS/eDP; Rich I/O: 1 Intel GbE, 2 USB 3.1, 8 USB 2.0; 10-Year CPU Life Cycle Support Until Q1′ 28 (Based on AMD Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • CS181 Front062420 R1 w600

    DFI CS181-H310 8th/9th Gen Intel iCore MXM Mini-ITX Motherboard

    • Product Name: DFI CS181-H310
    • Motherboard Form Factor: Mini-ITX
    • CPU: 8th/9th Generation Intel Core Processors
    • RAM: 2 DDR4 2400/2666MHz SODIMM up to 32GB
    • Expansion: Multiple Displays: 1 LVDS/eDP, 1 DP++/HDMI (autodetection), 4 DP; Multiple Expansions: 1 MXM Type-A/B, 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
    • Other features: Storage: 2 SATA 3.0; Rich I/O: 6 Intel GbE, 2 COM, 4 USB 3.1 Gen1, 6 USB 2.0; 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on Intel IOTG Roadmap)
  • CS181 Front062420 R1 w600

    DFI CS181-Q370 8th/9th Gen Intel iCore MXM Mini-ITX Motherboard

    • Product Name: DFI CS181-Q370
    • Motherboard Form Factor: Mini-ITX
    • CPU: 8th/9th Generation Intel Core Processors
    • RAM: 2 DDR4 2400/2666MHz SODIMM up to 32GB
    • Expansion: Multiple Displays: 1 LVDS/eDP, 1 DP++/HDMI (autodetection), 4 DP; Multiple Expansions: 1 MXM Type-A/B, 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
    • Other features: Storage: 2 SATA 3.0; Rich I/O: 6 Intel GbE, 2 COM, 4 USB 3.1 Gen2, 6 USB 2.0; 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on Intel IOTG Roadmap)
  • GHF51B190606w600

    DFI GHF51 1.8″ AMD Ryzen SBC – Industrial Pi – Dev Kit

    • Product Name: DFI GHF51-R1102G
    • Motherboard Form Factor: 1.8″ SBC
    • CPU: AMD Ryzen Embedded R1000 Series
    • RAM: Single Channel DDR4 Memory Down up to 4GB/8GB
    • Expansion: Expansion and Storage: 1 Mini PCIe, 1 SMBus
    • Other features: Small form factor for space-limited applications, HDMI 1.4 resolution supports up to 4096×2160 @ 24Hz, Rich I/O: 1 Intel GbE, 1 USB 3.1 Gen 2, 2 Micro HDMI, 10-Year CPU Life Cycle Support Until Q1’30 (Based on AMD Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • EC51X CSSide210310R1 w600

    DFI EC510-CS/EC511-CS 8th/9th Gen 5G Fanless Industrial Computer

    • Product Name: DFI EC510-CS/EC511-CS
    • System Type: Fanless Embedded System
    • CPU: 8th/9th Gen Intel Core
    • RAM: Supports DDR4 SODIMM up to 64GB
    • Expansion: 1 PCIe and 3 M.2 slots support NVMe
    • Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Support 4 PoE (EC51x-CS6G86E-Q), Support 5G Communication, Operating Temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
  • EC543 CSSide210324 w600

    DFI EC543-CS 8th/9th Gen 5G Fanless Industrial Computer

    • Product Name: DFI EC543-CS
    • System Type: Fanless Embedded System
    • CPU: 8th/9th Gen Intel Core
    • RAM: Supports DDR4 SODIMM up to 64GB
    • Expansion: 3 PCIe, 1 PCI, and 3 M.2 slots support NVMe
    • Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Support 4 PoE (EC543-CS6G86E-Q configuration), Support 5G communication, Operating temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
  • EC500 CSSide200824 w600

    DFI EC500-CS 8th/9th Gen 5G Fanless Embedded System

    • Product Name: DFI EC500-CS
    • System Type: Fanless Embedded System
    • CPU: 8th/9th Gen Intel Core
    • RAM: Supports DDR4 SODIMM up to 64GB
    • Expansion: 3 M.2 slots support NVMe
    • Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Rich I/O connectivity: 2 GbE, 4 COM, 4 USB 3.1, 2 USB 2.0 (Q370 only), Support 5G Communication, Operating Temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
  • EC90ASide210324 w600

    DFI EC90A-GH AMD Ryzen Ultra Compact Fanless Embedded System

    • Product Name: DFI EC90A-GH
    • System Type: Ultra Small Mini PC Fanless Embedded System
    • CPU: AMD Ryzen Embedded R1000 Series
    • RAM: DDR4 2400 MHz SODIMM down up to 4GB/8GB (memory onboard)
    • Expansion: 1 x Mini-PCIe (PCIe signal)
    • Other features: Ultra Small Size: 110 x 80mm x 60mm (W x H x D), User-friendly design for installing SIM card, I/O: 1 Intel GbE, 1 USB 3.1 Gen 2, 2 Micro HDMI, 10-Year CPU Life Cycle Support Until Q1’30 (Based on AMD Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • ECX700 ADP 1

    DFI ECX700-ADP 12th Gen Outdoor Ruggedized IPC67 Mini PC

    • Product Name: DFI ECX700-ADP
    • System Type: Outdoor Ruggedized IPC67 Box PC
    • CPU: Intel Alder Lake-P Processor i5-1245UE / i7-1265UE
    • RAM: Supports DDR4 memory
    • Expansion: Multiple I/O interfaces for versatile connectivity
    • Other Features: IP67-rated waterproof and dustproof design, extreme ruggedization to IEC 60068-2-64, wide operating temperature range (-20 to 70°C)
    This product has multiple variants. The options may be chosen on the product page
  • EC100 XNX side w600

    DFI EC100-XNX NVIDIA Jetson Xavier NX PoE Embedded System

    • Product Name: DFI EC100-XNX
    • System Type: Industrial PC
    • CPU: NVIDIA Jetson Xavier NX
    • RAM: 8Gb
    • Expansion: 20 pins with 1 x UART, 2 x I2C, 9 x GPIOs
    • Other features: Fully supports NVIDIA Jetson Xavier NX, 8 x 10/100 MbE with PoE, Fanless chassis technology, 1 x HDMI 2.0a/b Type-A supports 4K@60Hz
  • GH551F200130R1 W600

    DFI GH551 AMD Ryzen V1000/R1000 Series 3.5″ SBC

    • Product Name: DFI GH551
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: AMD Ryzen V1000/R1000 Series
    • RAM: 1 DDR4 2400MHz SODIMM up to 16GB
    • Expansion: Multiple displays: max. 4 DP++/3 DP++ + LVDS; Multiple Expansion: 1 M.2 M Key, 1 Mini PCIe
    • Other features: Rich I/O: 3 GbE, 2 USB 3.1 Gen2, 1 USB 2.0; 10-Year CPU Life Cycle Support Until Q1′ 31 (Based on AMD Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • TWLF51 1

    DFI TWLF51 1.8″ Intel N Series Industrial Pi SBC

    • DFI TWLF51: Compact 1.8″ SBC
    • Form Factor: Ultra-small 1.8″ SBC ideal for embedded and edge deployments
    • CPU:Intel Atom X Series and Intel N Series processors (Amston Lake / Twin Lake)
    • RAM: Onboard single-channel LPDDR5 memory with up to 8GB capacity
    • Expansion: 1 x M.2 E Key slot with optional I2C/SMBus support
    • Other Features: HDMI 2.0 supporting up to 4K @ 60Hz, 1 x Intel GbE LAN, 1 x COM, 2 x USB 3.2 Gen 2, 2 x USB 2.0, Micro HDMI, and DIO support
    This product has multiple variants. The options may be chosen on the product page
  • RC300 CS SideIO200729R2 w600

    DFI VC300-CS AI-Enabled 5G MXM In-Vehicle PC

    • Product Name: DFI VC300-CS
    • System Type: AI-Enabled 5G MXM In-Vehicle PC
    • CPU: 8th/9th Generation Intel Core Processors
    • RAM: Dual Channel DDR4 2666/2400 MHz by SODIMMs up to 64GB
    • Expansion: 4 x 802.3af POE Ports, Multiple Expansion Slots for 3G/LTE/5G Cellular Support
    • Other features: AI Accelerated: Up to 110W GPU MXM Module Supported, Extended Operating Temperature: -25°C to 70°C, Support 5G Communication, 15-Year CPU Life Cycle Support Until Q1′ 34 (Based on Intel IOTG Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • COM101 BAT Front Website

    DFI COM101-BAT Mini-ITX – COMe Basic/Compact Carrier Board

    • Product Name: DFI COM101-BAT
    • Motherboard Form Factor: Mini-ITX
    • CPU: Supports COMe Basic/Compact modules
    • RAM: Supports Compact/Basic modules
    • Expansion: Multiple displays (1 DP, 1 LVDS, 1 VGA)
    • Other features: Rich I/O (1 GbE, 6 USB)
  • COM332 B Front Website

    DFI COM332-B(R.A) Micro-ATX – COMe Basic/Compact Carrier Board

    • Product Name: DFI COM332-B
    • Motherboard Form Factor: Micro-ATX
    • CPU: Supports COMe Basic/Compact modules
    • RAM: Supports Compact and Basic modules
    • Expansion: Multiple displays (VGA, LVDS, DP, eDP)
    • Other features: Rich I/O (1 GbE, 4 USB 3.0, 4 USB 2.0)
  • COM332 BF070801w600

    DFI COM332-B(R.B1) Micro-ATX – COMe Basic/Compact Carrier Board

    • Product Name: DFI COM332-B
    • Motherboard Form Factor: Micro-ATX
    • CPU: Supports COMe Basic/Compact modules
    • RAM: Supports Compact and Basic modules
    • Expansion: Multiple displays (VGA, LVDS, DP, eDP)
    • Other features: Rich I/O (1 GbE, 4 USB 3.1, 4 USB 2.0)
  • COM333 Front Website

    DFI COM333-I Micro-ATX – COMe Basic/Compact Carrier Board

    • Product Name: DFI COM333-I
    • Motherboard Form Factor: Micro-ATX
    • CPU: Supports COMe Basic/Compact modules
    • RAM: Supports Compact and Basic modules
    • Expansion: Multiple expansion (8 PCIe x4 or 4 PCIe x8, 2 SATA 3.0)
    • Other features: Rich I/O (2 GbE, 4 10Gbase-KR, 4 USB 3.0/2.0, 1 COM)
  • RC300 CS Front200721 w600

    DFI RC-300-CS AI-Enabled 5G MXM Railway System

    • Product Name: DFI RC-300-CS
    • System Type: Railway System
    • CPU: 8th/9th Generation Intel Core Processors
    • RAM: Dual Channel DDR4 2666/2400 MHz by SODIMMs up to 64GB
    • Expansion: Multiple Expansion Slots for 3G/LTE/5G Cellular Support
    • Other features: AI-Enabled, 4 x M12 X-coded PoE Ports at 15W, AI Accelerated: Up to 110W GPU MXM Module Supported, Extended Operating Temperature: -25°C to 70°C Operation without Active Fan, Support 5G Communication, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • CS551B191017R1w600

    DFI CS551 Intel 8th/9th Gen Coffee Lake iCore 3.5″ SBC

    • Product Name: DFI CS551 3.5″ SBC
    • Motherboard Form Factor: 3.5″
    • CPU: 9th/8th Gen Intel Core with Intel C246
    • RAM: 1 DDR4 SODIMM up to 32GB
    • Expansion: Three independent displays: LVDS + DP++ + DP++; Multiple expansion: 1 M.2 M Key, 1 Mini PCIe
    • Other features: DP++ resolution up to 4096×2304 @ 60Hz; Rich I/O: 2 Intel GbE, 4 USB 3.1, 2 USB 2.0; 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on Intel IOTG Roadmap)