DFI CS551 Intel 8th/9th Gen Coffee Lake iCore 3.5″ SBC
- Product Name: DFI CS551 3.5″ SBC
- Motherboard Form Factor: 3.5″
- CPU: 9th/8th Gen Intel Core with Intel C246
- RAM: 1 DDR4 SODIMM up to 32GB
- Expansion: Three independent displays: LVDS + DP++ + DP++; Multiple expansion: 1 M.2 M Key, 1 Mini PCIe
- Other features: DP++ resolution up to 4096×2304 @ 60Hz; Rich I/O: 2 Intel GbE, 4 USB 3.1, 2 USB 2.0; 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on Intel IOTG Roadmap)
Description
The World’s First! 3.5” SBC Desktop Platform with Auto Warm-up
The CS551 is the world’s first compact-sized AI motherboard with auto warm-up function for the processor to withstand the extreme cold weather at -30°C. The 3.5″ SBC is powered by robust 8th Gen Intel Core i processors that support dynamic performance adjustment of CPU and GPU, high-speed image analysis and transmission, while obtaining all the expansion interfaces required for edge AI computing. The CS551 will bring a brand-new experience with smart edge computing and make your solution a pioneer as well!
Features
- 9th/8th Gen Intel® Core™ with Intel® C246
- 1 DDR4 SODIMM up to 32GB
- Three independent displays: LVDS + DP++ + DP++
- DP++ resolution up to 4096×2304 @ 60Hz
- Multiple expansion: 1 M.2 M Key, 1 Mini PCIe
- Rich I/O: 2 Intel GbE, 4 USB 3.1, 2 USB 2.0
- 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on Intel IOTG Roadmap)
Specification
System
Processor
8th Gen Intel® Core™ Processors, LGA 1151 Socket
Intel® Core™ i7-8700T Processor (6C/12T; Max speed 4.0 GHz; TDP 35W)
Intel® Core™ i5-8500T Processor (6C/6T; Max speed 3.5GHz; TDP 35W)
Intel® Core™ i3-8100T Processor (4C/4T; Max speed 3.1GHz; TDP 35W)
Intel® Pentium® G5400T Processor (2C/4T; Max speed 3.1GHz; TDP 35W)
Intel® Celeron® G4900T Processor (2C/2T; Max speed 2.9GHz; TDP 35W)
9th Gen Intel® Core™ Processors, LGA 1151 Socket
Intel® Core™ i7-9700TE Processor (8C/8T; Max speed 3.6GHz; TDP 35W)
Intel® Core™ i5-9500TE Processor (6C/6T; Max speed 3.6GHz; TDP 35W)
Intel® Core™ i3-9100TE Processor (4C/4T; Max speed 3.2GHz; TDP 35W)
Intel® Core™ i7-8700T Processor (6C/12T; Max speed 4.0 GHz; TDP 35W)
Intel® Core™ i5-8500T Processor (6C/6T; Max speed 3.5GHz; TDP 35W)
Intel® Core™ i3-8100T Processor (4C/4T; Max speed 3.1GHz; TDP 35W)
Intel® Pentium® G5400T Processor (2C/4T; Max speed 3.1GHz; TDP 35W)
Intel® Celeron® G4900T Processor (2C/2T; Max speed 2.9GHz; TDP 35W)
9th Gen Intel® Core™ Processors, LGA 1151 Socket
Intel® Core™ i7-9700TE Processor (8C/8T; Max speed 3.6GHz; TDP 35W)
Intel® Core™ i5-9500TE Processor (6C/6T; Max speed 3.6GHz; TDP 35W)
Intel® Core™ i3-9100TE Processor (4C/4T; Max speed 3.2GHz; TDP 35W)
Memory
One 260-pin SODIMM up to 32GB
Single Channel DDR4 2666MHz
C246 with ECC Support: Intel® Core i3-8100T/9100TE/Pentium G5400T/Pentium G4900T
Single Channel DDR4 2666MHz
C246 with ECC Support: Intel® Core i3-8100T/9100TE/Pentium G5400T/Pentium G4900T
BIOS
Insyde SPI 128Mbit
Graphics
Controller
Intel® UHD 630 Graphics GT Series
Feature
OpenGL 4.6, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2 (H.262), VC1, JPEG/MJPEG, HEVC/H.265, VP8, VP9, VP10
HW Encode: AVC/H.264, MPEG2 (H.262), JPEG/MJPEG, HEVC/H.265, VP8, VP9
HW Decode: AVC/H.264, MPEG2 (H.262), VC1, JPEG/MJPEG, HEVC/H.265, VP8, VP9, VP10
HW Encode: AVC/H.264, MPEG2 (H.262), JPEG/MJPEG, HEVC/H.265, VP8, VP9
Display
1 x LVDS
2 x DP++
LVDS: dual channel 48-bit, resolution up to 1920×1200 @ 60Hz
DP++: resolution up to 4096×2304
2 x DP++
LVDS: dual channel 48-bit, resolution up to 1920×1200 @ 60Hz
DP++: resolution up to 4096×2304
Triple Displays
LVDS + DP++ + DP++
Expansion
Interface
1 x Full-size Mini PCIe (PCIe x1 up to Gen3/USB 2.0) (C246/Q370 opt.: USB 3.1 Gen1/USB 2.0)
1 x M.2 2280 M key (C246/Q370: NVMe PCIe x4/SATA 3.0 or H310: NVMe PCIe x1, SATA 3.0)
1 x SIM slot (optional for 3G/4G module)
1 x M.2 2280 M key (C246/Q370: NVMe PCIe x4/SATA 3.0 or H310: NVMe PCIe x1, SATA 3.0)
1 x SIM slot (optional for 3G/4G module)
Audio
Audio Codec
Realtek ALC262
Ethernet
Controller
Intel® I211AT PCIe (10/100/1000Mbps) or Intel® I210IT PCIe (10/100/1000Mbps)
Rear I/O
Ethernet
2 x GbE (RJ-45)
USB
4 x USB 3.1 Gen2 (C246/Q370) or Gen1 (H310)
Display
2 x DP++
Internal I/O
Serial
1 x RS-232/422/485 (2.0mm pitch)
USB
2 x USB 2.0 (2.0mm pitch)
Display
1 x LVDS LCD Panel Connector
1 x LVDS Backlight
1 x LVDS Backlight
Audio
1 x Audio (Line-out/Mic-in)
SATA
1 x SATA 3.0 (up to 6Gb/s)
1 x SATA Power
1 x SATA Power
DIO
1 x 8-bit DIO
SMBus
1 x SMBus
Heater
1 x 12V header (wide temp. only)
Watchdog Timer
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
Security
TPM
fTPM 2.0
Power
Type
12VDC
Connector
Vertical Type Connector (4-pin) (default)
DC Jack (available upon request)
DC Jack (available upon request)
Consumption
TBD
RTC Battery
CR2032 Coin Cell
OS Support
Microsoft
Windows 10 IoT Enterprise 64-bit RS1/RS5
Linux
Environment
Temperature
Operating:
-5 to 65°C for 35W/100C CPU (fanless); 35W 100C, 82C CPU (fan)
-30 to 80°C for 15W TDP down/100C CPU (fanless); 35W/100C CPU (fan)
Note: -30°C can add heater/polyfilm for mother board warm up.
Storage: -40 to 85°C
-5 to 65°C for 35W/100C CPU (fanless); 35W 100C, 82C CPU (fan)
-30 to 80°C for 15W TDP down/100C CPU (fanless); 35W/100C CPU (fan)
Note: -30°C can add heater/polyfilm for mother board warm up.
Storage: -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
TBD
Mechanism
Dimensions
3.5″ SBC Form Factor
146mm (5.75″) x 102mm (4.02″)
146mm (5.75″) x 102mm (4.02″)
Height
PCB: 1.6mm
Top Side: 16.3mm, Bottom Side: 4.0 mm
Top Side: 16.3mm, Bottom Side: 4.0 mm
Packing List
Packing List
1 CS551 board
1 COM port cable (Length: 250mm, 1 x COM port) 332-753040-000G
1 Serial ATA data cable (Length: 500mm) 332-553001-005G
1 Serial ATA power cable (Length: 250mm) A81-004041-016G
1 Heat sink (Height: 43mm) A71-001302-010G
1 COM port cable (Length: 250mm, 1 x COM port) 332-753040-000G
1 Serial ATA data cable (Length: 500mm) 332-553001-005G
1 Serial ATA power cable (Length: 250mm) A81-004041-016G
1 Heat sink (Height: 43mm) A71-001302-010G
Country of Origin
Country of Origin
Taiwan
Ordering Information
| Model Name | Part Number | Description |
| CS551-C246-BCA | 770-CS5511-000G | 1 SODIMM, 2 LAN, 1 COM, 4 USB 3.1 Gen2, 2 USB 2.0, 12V, -5 to 65°C |
| CS551-H310-BCA | 770-CS5511-100G | 1 SODIMM, 2 LAN, 1 COM, 4 USB 3.1 Gen1, 2 USB 2.0, 12V, -5 to 65°C |
| CS551-Q370-BCA | 770-CS5511-200G | 1 SODIMM, 2 LAN, 1 COM, 4 USB 3.1 Gen2, 2 USB 2.0, 12V, -5 to 65°C |
| CS551-C246-ECA | 770-CS5511-300G | 1 SODIMM, 2 LAN, 1 COM, 4 USB 3.1 Gen2, 2 USB 2.0, 12V, -30 to 80°C |
| CS551-H310-ECA | 770-CS5511-400G | 1 SODIMM, 2 LAN, 1 COM, 4 USB 3.1 Gen1, 2 USB 2.0, 12V, -30 to 80°C |
| CS551-Q370-ECA | 770-CS5511-500G | 1 SODIMM, 2 LAN, 1 COM, 4 USB 3.1 Gen2, 2 USB 2.0, 12V, -30 to 80°C |
DFI 8th/9th Gen Coffee Lake
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- DFI EC500-CS 8th/9th Gen 5G Fanless Embedded System
- DFI EC510-CS/EC511-CS 8th/9th Gen 5G Fanless Embedded System
- DFI EC543-CS 8th/9th Gen 5G Fanless Embedded System
BVM Customisation Service
If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish.
If you’re unable to find an off-the-shelf product that meets your specific requirements, don’t hesitate to contact our in-house design team. They possess the expertise to customise an existing product to your exact specifications or embark on a fresh design journey to create a customized solution tailored to your requirements. Our design professionals are dedicated to delivering exceptional results, ensuring that the final product not only meets but exceeds your expectations. When you collaborate with our team, you open the door to a world of possibilities, where innovation and creativity converge to bring your vision to life.
Whether it’s modifying an existing product or crafting an entirely new one, our design experts are committed to providing you with a comprehensive, end-to-end solution that perfectly suits your needs. Your satisfaction is our top priority, and we’re here to turn your ideas into reality.
Design | Develop | Test | Manufacture
With over three decades of experience in designing custom industrial and embedded computer and display solutions across a wide array of industries, we’re here to turn your ideas into reality
Here’s a selection of our design, manufacturing & associated services: –
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ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:
 Testing |
 Materials Management |
 Logistics and Tracking |
 External Manufacturing |
| • Burn in Test • Temp / Thermal Testing • Environmental Testing • Safety Testing • Software Compatibility Test |
• Vendor Selection and Component Procurement • Product Traceability • Obsolescence, End of Life and Last Time Procurement Management • Simple to use on-line RMA System |
• Traceability of Shipments • Product Labelling • OEM/Branded Packaging • System Branding • Custom Labels |
• Surface Mount: – High Speed Placement • Conventional Through Hole Insertion & Assembly • Automated Optical Inspection • Bespoke PCB Test |
Click here to find out more.
Manufacturer : DFI
Motherboard
- Form Factor : 3.5 SBC
CPU
- Powered By : Intel
- CPU Family : iCore
- CPU Generation : Coffee Lake
- CPU Model : G4900T, G5400T, i3-8100T, i3-9100TE, i5-8500T, i5-9500TE, i7-8700T, i7-9700TE
Memory
- Memory Installed :
- Memory Slots : 1
- Memory Type : 2666Mhz DDR4
I/O and Expansion
- Expansion Slots : M.2, Mini PCIe, SATA
- LAN Ports : 2
- Serial Ports :
- USB 2 Ports : 2
- USB 3 Ports :
- USB 3.X / USB C / USB 4.0 Ports : 4
- Video Output : DP++, LVDS
- Multi Display : Triple Display
Certifications
- Certifications :
Features
- IP Rating :
- Rugged : Yes
- System Type : SBC
- Wide Temp : Yes
Categories : 3.5" Single Board Computers
