DFI CS551 Intel 8th/9th Gen Coffee Lake iCore 3.5″ SBC

3.5″ SBC, 9th/8th Gen Intel® Core™, 1 DDR4, 1 M.2 M key, 1 Mini PCIe, 1 LVDS, 2 DP++

Compare

Description

  • 9th/8th Gen Intel® Core™ with Intel® C246
  • 1 DDR4 SODIMM up to 32GB
  • Three independent displays: LVDS + DP++ + DP++
  • DP++ resolution up to 4096×2304 @ 60Hz
  • Multiple expansion: 1 M.2 M Key, 1 Mini PCIe
  • Rich I/O: 2 Intel GbE, 4 USB 3.1, 2 USB 2.0
  • 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on Intel IOTG Roadmap)

Specification

System
Processor
8th Gen Intel® Core™ Processors, LGA 1151 Socket
Intel® Core™ i7-8700T Processor (6C/12T; Max speed 4.0 GHz; TDP 35W)
Intel® Core™ i5-8500T Processor (6C/6T; Max speed 3.5GHz; TDP 35W)
Intel® Core™ i3-8100T Processor (4C/4T; Max speed 3.1GHz; TDP 35W)
Intel® Pentium® G5400T Processor (2C/4T; Max speed 3.1GHz; TDP 35W)
Intel® Celeron® G4900T Processor (2C/2T; Max speed 2.9GHz; TDP 35W)
9th Gen Intel® Core™ Processors, LGA 1151 Socket
Intel® Core™ i7-9700TE Processor (8C/8T; Max speed 3.6GHz; TDP 35W)
Intel® Core™ i5-9500TE Processor (6C/6T; Max speed 3.6GHz; TDP 35W)
Intel® Core™ i3-9100TE Processor (4C/4T; Max speed 3.2GHz; TDP 35W)
Memory
One 260-pin SODIMM up to 32GB
Single Channel DDR4 2666MHz
C246 with ECC Support: Intel® Core i3-8100T/9100TE/Pentium G5400T/Pentium G4900T
BIOS
Insyde SPI 128Mbit
Graphics
Controller
Intel® UHD 630 Graphics GT Series
Feature
OpenGL 4.6, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2 (H.262), VC1, JPEG/MJPEG, HEVC/H.265, VP8, VP9, VP10
HW Encode: AVC/H.264, MPEG2 (H.262), JPEG/MJPEG, HEVC/H.265, VP8, VP9
Display
1 x LVDS
2 x DP++
LVDS: dual channel 48-bit, resolution up to 1920×1200 @ 60Hz
DP++: resolution up to 4096×2304
Triple Displays
LVDS + DP++ + DP++
Expansion
Interface
1 x Full-size Mini PCIe (PCIe x1 up to Gen3/USB 2.0) (C246/Q370 opt.: USB 3.1 Gen1/USB 2.0)
1 x M.2 2280 M key (C246/Q370: NVMe PCIe x4/SATA 3.0 or H310: NVMe PCIe x1, SATA 3.0)
1 x SIM slot (optional for 3G/4G module)
Audio
Audio Codec
Realtek ALC262
Ethernet
Controller
Intel® I211AT PCIe (10/100/1000Mbps) or Intel® I210IT PCIe (10/100/1000Mbps)
Rear I/O
Ethernet
2 x GbE (RJ-45)
USB
4 x USB 3.1 Gen2 (C246/Q370) or Gen1 (H310)
Display
2 x DP++
Internal I/O
Serial
1 x RS-232/422/485 (2.0mm pitch)
USB
2 x USB 2.0 (2.0mm pitch)
Display
1 x LVDS LCD Panel Connector
1 x LVDS Backlight
Audio
1 x Audio (Line-out/Mic-in)
SATA
1 x SATA 3.0 (up to 6Gb/s)
1 x SATA Power
DIO
1 x 8-bit DIO
SMBus
1 x SMBus
Heater
1 x 12V header (wide temp. only)
Watchdog Timer
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
Security
TPM
fTPM 2.0
Power
Type
12VDC
Connector
Vertical Type Connector (4-pin) (default)
DC Jack (available upon request)
Consumption
TBD
RTC Battery
CR2032 Coin Cell
OS Support
Microsoft
Windows 10 IoT Enterprise 64-bit RS1/RS5
Linux
Environment
Temperature
Operating:
-5 to 65°C for 35W/100C CPU (fanless); 35W 100C, 82C CPU (fan)
-30 to 80°C for 15W TDP down/100C CPU (fanless); 35W/100C CPU (fan)
Note: -30°C can add heater/polyfilm for mother board warm up.
Storage: -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
TBD
Mechanism
Dimensions
3.5″ SBC Form Factor
146mm (5.75″) x 102mm (4.02″)
Height
PCB: 1.6mm
Top Side: 16.3mm, Bottom Side: 4.0 mm
Packing List
Packing List
1 CS551 board
1 COM port cable (Length: 250mm, 1 x COM port) 332-753040-000G
1 Serial ATA data cable (Length: 500mm) 332-553001-005G
1 Serial ATA power cable (Length: 250mm) A81-004041-016G
1 Heat sink (Height: 43mm) A71-001302-010G
Country of Origin
Country of Origin
Taiwan

Ordering Information

Model Name Part Number Description
CS551-C246-BCA 770-CS5511-000G 1 SODIMM, 2 LAN, 1 COM, 4 USB 3.1 Gen2, 2 USB 2.0, 12V, -5 to 65°C
CS551-H310-BCA 770-CS5511-100G 1 SODIMM, 2 LAN, 1 COM, 4 USB 3.1 Gen1, 2 USB 2.0, 12V, -5 to 65°C
CS551-Q370-BCA 770-CS5511-200G 1 SODIMM, 2 LAN, 1 COM, 4 USB 3.1 Gen2, 2 USB 2.0, 12V, -5 to 65°C
CS551-C246-ECA 770-CS5511-300G 1 SODIMM, 2 LAN, 1 COM, 4 USB 3.1 Gen2, 2 USB 2.0, 12V, -30 to 80°C
CS551-H310-ECA 770-CS5511-400G 1 SODIMM, 2 LAN, 1 COM, 4 USB 3.1 Gen1, 2 USB 2.0, 12V, -30 to 80°C
CS551-Q370-ECA 770-CS5511-500G 1 SODIMM, 2 LAN, 1 COM, 4 USB 3.1 Gen2, 2 USB 2.0, 12V, -30 to 80°C

Datasheet

Download

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can design a new product from start to finish.

 

Design | Develop | Test | Manufacture

Here’s a selection of our design, manufacturing

& associated services: –

 

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a brand-new product from scratch or working with an existing prototype.DesignToOrder

Build to Order: Embedded Computer Design and Customisation Services​

Take an existing system and we can:BuildToOrder

  • Custom specification (CPU, Ram, I/O, Storage)
  • Chassis customisation and branding
  • Custom BIOS
  • Software – Custom OS Image
  • Custom Packaging and branding
  • Integrating newly designed or existing hardware into a larger system

Build to order Racks and Towers, Peli Case PCs and Mini-ITX PCs

Embedded Software Services : Configuration, Integration and Deployment

Porting, Integration & DeploymentEmbeddedSoftware

  • Windows image capture from customers HDD
  • Linux image capture from customers HDD
  • Windows / Linux Deployment from customers image
  • Custom Windows images, create and deploy
  • Update management
  • Custom Linux and Android images?
  • Custom BIOS

Manufacturer : DFI

Motherboard

  • Form Factor : 3.5 SBC

CPU

  • Powered By : Intel
  • CPU Family : iCore
  • CPU Generation : Coffee Lake
  • CPU Model : G4900T, G5400T, i3-8100T, i3-9100TE, i5-8500T, i5-9500TE, i7-8700T, i7-9700TE
  • CPU Speed : 2.9Ghz, 3.2Ghz, 3.5Ghz, 3.6Ghz, 4.0Ghz
  • CPU Cores :

Memory

  • Memory Installed :
  • Memory Slots : 1
  • Memory Type : 2666Mhz DDR4

I/O and Expansion

  • Expansion Slots : M.2, Mini PCIe, SATA
  • LAN Ports : 2
  • Serial Ports :
  • USB 2 Ports : 2
  • USB 3 Ports :
  • USB 3.1 Ports : 4
  • Video Output : DP++, LVDS
  • Multi Display : Triple Display
  • Wireless Connectivity :

Operating System

  • OS : Linux, Windows

Certifications

  • Certifications :

Industry

  • Industry : Industrial Automation and Control, Medical, Military, Transport - Air, Transport - Road, Transport and Smart City

Features

  • 24/7 Use :
  • 4G-GPS :
  • Artificial Intelligence Use : Artificial Intelligence, Machine Learning, Machine Vision
  • ATEX :
  • High Performance :
  • Industrial :
  • In-Vehicle :
  • IoT : Yes
  • IP Rating :
  • Low Powered :
  • Mini-ITX :
  • Multi Displays : Triple
  • NUC :
  • Other Features : GPIO
  • PoE :
  • Rugged : Yes
  • Ryzen :
  • System Type : SBC
  • Touchscreen :
  • Whiskey Lake : Yes
  • Wide Temp : Yes

Categories :