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Industrial and Embedded Products

  • KS070 M8M 1
    DFI KS070-M8M NXP i.MX 8M 7″ IP65 Panel PC
    • Product Name: DFI KS070-M8M
    • Screen Size: 7″ IP65 Panel PC
    • CPU: NXP i.MX8M Platform
    • RAM: 2GB/4GB SDRAM Memory
    • Expansion: Multiple Expansion: M.2 2230/3042 support
    • Other features: 7″ 1024×600 TFT LCD Panel with capacitive touch screen, IP65 front panel protection
  • M8M KIT Series 1
    DFI M8M_KIT_Series NXP i.MX 8M Panel PC Kit
    • Product Name: DFI M8M_KIT_Series
    • Screen Size: Open Frame Designed Panel PC
    • CPU: NXP i.MX 8M Processor
    • RAM: LPDDR4-3200 2GB plus 16GB eMMC on board
    • Expansion: Multiple Expansion: M.2 2230 E Key and 3042/2242 B Key
    • Other features: Touch Screen: P-Capacitive Touch supports 10 points, Easy Integration: Easy installation and maintenance, ARM-Based System: Support Android 9.0 and Linux
  • ADN553 1
    DFI ADN553 Alder Lake-N 3.5″ SBC
    • Product Name: DFI ADN553
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: Intel Atom Alder Lake-N Processors
    • RAM: 1 DDR5 SO-DIMM
    • Expansion: 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
    • Other Features: Supports 4K/2K resolution, triple display (HDMI, Type-C DP Alt Mode, LVDS/eDP), 3x 2.5GbE LAN, 4x USB 3.2, 2x USB 2.0, 1x SATA, 10-year CPU lifecycle until Q1 2033 with optional 5-year extended support
  • ASL553 1
    DFI ASL553 Amston Lake ATOM 3.5″ SBC
    • Product Name: DFI ASL553
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: Intel Atom Amston Lake Processors
    • RAM: 1 DDR5 SO-DIMM
    • Expansion: 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
    • Other Features: Supports 4K/2K resolution, triple display (HDMI, Type-C DP Alt Mode, LVDS/eDP optional), 3x 2.5GbE LAN, 4x USB 3.2, 2x USB 2.0, 1x SATA, wide temperature support (-40 to 85°C)
  • EHL556 1
    DFI EHL556 Elkhart Lake Atom X Series 3.5″ SBC
    • Product Name: DFI EHL556
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: Intel Atom X Series Processor
    • RAM: 1 DDR4-3200 SODIMM up to 32GB
    • Expansion: Multiple Expansion: 1 M.2 E Key, 1 Mini- PCIe/M.2 B Key, 1 I2C
    • Other features: 4K High Resolution, Triple Independent Displays (1 VGA, 1 DP++, 1 LVDS/eDP), Rich I/O (2 LAN, 2 USB 3.1 Gen2, 2 USB 2.0, 2 COM, 1 SATA 3.0), 15-Year CPU Life Cycle Support Until Q4′ 35 (Based on Intel IOTG Roadmap)
  • ED700 EHL side
    DFI ED700-EHL Elkhart Lake 5G Fanless Embedded System
    • Product Name: DFI ED700-EHL
    • System Type: Elkhart Lake 5G Fanless Embedded System
    • CPU: Intel Atom Processors X Series
    • RAM: One 260 pin DDR4 SODIMM up to 3200MHz
    • Expansion: Support 5G Sub-6 module, Support WiFi 6 module, Support Isolated COM & DIO
    • Other features: 4 LAN: Support 1 x 2.5GbE TSN, 3 x GbE LAN, Wide Operating Temperature: Support up to -40 ~ 70°C, 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on Intel IOTG Roadmap)
  • EHL173F201125 R1 w600
    DFI EHL171/EHL173 Intel Elkhart Lake Wide Temp Mini-ITX
    • Product Name: DFI EHL171/EHL173
    • Motherboard Form Factor: Mini-ITX
    • CPU: Intel Atom Processor x6000 Series
    • RAM: 2 DDR4 SODIMM up to 32GB
    • Expansion: 1 M.2 B Key, 1 M.2 E Key, 1 PCIe x4 (x2 signal)
    • Other features: 3 Independent Displays: 1 DP++/VGA, 1 HDMI/DP++, 1 eDP/LVDS; Rich I/O: 2 x 2.5GbE, 2 USB 3.1 Gen2, 2 USB 3.1 Gen1, 6 COM, up to 4 USB 2.0; 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on Intel IOTG Roadmap)
  • ADN9A2 1
    DFI ADN9A2 Intel Alder Lake N COM Express Mini
    • Product Name: DFI ADN9A2
    • Module Form Factor: COM Express Mini
    • CPU: Intel Atom Processor Alder Lake-N Series
    • RAM: Dual Channel LPDDR5 4800MHz, up to 16GB
    • Expansion: 4 PCIe x1, 1 SMBus, 1 I2C, 1 eMMC
    • Other Features: Supports dual displays (DDI + LVDS/eDP), 2 USB 3.2, 8 USB 2.0, 2.5GbE Ethernet
  • ASL9A2 1
    DFI ASL9A2 Intel Amston Lake COM Express Mini
    • Product Name: DFI ASL9A2
    • Module Form Factor: COM Express Mini
    • CPU: Intel Atom Processor Amston Lake Series
    • RAM: Dual Channel LPDDR5 4800MHz, up to 16GB
    • Expansion: 4 PCIe x1, 1 SMBus, 1 I2C, 1 eMMC
    • Other Features: Dual display support (DDI + LVDS/eDP), 2 USB 3.1, 8 USB 2.0, 100M/1000M/2.5Gbps Ethernet
  • EHL9A2 Top w600
    DFI EHL9A2 Intel Elkhart Lake COM Express Mini
    • Product Name: DFI EHL9A2
    • Module Form Factor: COM Express Mini – COM Express Type 10
    • CPU: Intel Atom Processor Elkhart Lake Series
    • RAM: Dual Channel LPDDR4X 3200MHz/4267MHz up to 16GB
    • Expansion: Multiple expansions: 4 PCIe x1
    • Other features: 1 LVDS/eDP, 1 DDI (HDMI/DP++); Supports dual displays: DDI + LVDS/eDP, Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0, 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on Intel IOTG Roadmap).
  • CMS101 103 W480F210831 R1 w600
    DFI CMS101/CMS103 10th Gen Intel iCore Wide Temp Mini-ITX
    • Product Name: DFI CMS101/CMS103
    • Motherboard Form Factor: Mini-ITX
    • CPU: 10th Generation Intel Core Processors
    • RAM: 2 DDR4 2933MHz SODIMM up to 64GB
    • Expansion: 1 PCIe x16, 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
    • Other features: Multiple Displays: 2 x DP++, 1 LVDS/eDP; Supports up to 4K/2K resolution; Rich I/O: 1 Intel 2.5GbE, 2 Intel GbE, 4 COM, 4 USB 3.2 Gen2, 4 USB 2.0; 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
  • EC70A TGU 5
    DFI EC70A-TGU Tiger Lake Fanless Embedded System
    • Product Name: DFI EC70A-TGU
    • System Type: Tiger Lake Fanless Embedded System
    • CPU: 11th Gen Intel Core i7/i5/i3 Processors
    • RAM: On board memory 8GB and 1 SO-DIMM DDR4
    • Expansion: Support M.2 B key 3042/3052 5G-NR module
    • Other features: Triple Displays: 2 HDMI (4K@30Hz) + 1 VGA (2K@60Hz), Up to 4 LAN or 6 USB, 15-Year CPU Life Cycle Support Until Q3′ 35 (Based on Intel IOTG Roadmap)
  • GH171F070621 R1w600
    DFI GH171 AMD Ryzen V1000/R1000 Mini-ITX
    • Product Name: DFI GH171
    • Motherboard Form Factor: Mini-ITX
    • CPU: AMD Ryzen V1000/R1000
    • RAM: 2 DDR4 3200MHz SODIMM up to 32GB
    • Expansion: 1 PCIe x16, 1 M.2 M Key
    • Other features: Four independent displays: DP++ + DP++ + DP++ + DP++; Rich I/O: 2 GbE, 6 COM, 3 USB 3.0, 6 USB 2.0; 10-Year CPU Life Cycle Support Until Q1′ 28 (Based on AMD Roadmap)
  • RNO171F210506 w600
    DFI RNO171 AMD Ryzen V2000 Mini-ITX
    • Product Name: DFI RNO171
    • Motherboard Form Factor: Mini-ITX
    • CPU: AMD Ryzen V2000
    • RAM: 2 DDR4 3200MHz SODIMM up to 64GB
    • Expansion: 1 PCIe x16, 1 M.2 M Key
    • Other features: Four independent displays: DP++ + DP++ + DP++ + DP++; Rich I/O: 2 GbE, 6 COM, 2 USB 3.1 Gen2, 7 USB 2.0, SATA 3.0; 10-Year CPU Life Cycle Support Until Q4′ 30 (Based on AMD Roadmap)
  • DT200 CS side w600
    DFI DT200-CS High Performance MXM Embedded System
    • Product Name: DFI DT200-CS
    • System Type: High Performance MXM Embedded System
    • CPU: 8th/9th Generation Intel Core Processors
    • RAM: DDR4 2400/2666MHz up to 64GB
    • Expansion: Support M.2 B key 3052 5G cellular module
    • Other features: Multiple displays: 4 DP (from MXM), 1 DP++/HDMI (auto-detection), AI accelerated: up to 110W GPU MXM module supported, Rich I/O connectivity: 4 LAN, 4 USB 3.1, 6 USB 2.0, 2 COM, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
  • MD711 SU
    DFI MD711 i7 Medical Embedded System
    • Product Name: DFI MD711-SU2061-100G
    • System Type: Medical Embedded System
    • CPU: 6th Generation Intel Core
    • RAM: 2 DDR4 SODIMM up to 32GB
    • Expansion: Supports 1 PCIe 16, 1 Mini PCIe, 1 M.2 slot
    • Other features: 2 x 2.5″ SATA 3.0 drive bay, 4KV Isolated I/O ports: 2 Intel GbE, 2 COM, 2 USB 2.0, 15-Year CPU Life Cycle Support
  • MD711 SU
    DFI MD711 i5 Medical Embedded System
    • Product Name: DFI MD711-SU2061-000G
    • System Type: Medical Embedded System
    • CPU: 6th Generation Intel Core
    • RAM: 2 DDR4 SODIMM up to 32GB
    • Expansion: Supports 1 PCIe 16, 1 Mini PCIe, 1 M.2 slot
    • Other features: 2 x 2.5″ SATA 3.0 drive bay, 4KV Isolated I/O ports: 2 Intel GbE, 2 COM, 2 USB 2.0, 15-Year CPU Life Cycle Support
  • ES220 CSSide200612 w600
    DFI ES220-CS High Performance 9th/8th Gen iCore Embedded System
    • Product Name: DFI ES220-CS
    • System Type: High Performance 9th/8th Gen iCore Embedded System
    • CPU: 8th/9th Gen Intel Core Processors with Intel C246/Q370/H310 Chipset
    • RAM: 2 DDR4 SODIMM up to 64GB
    • Expansion: Single/Triple storage: 1 M.2 SSD + 2 2.5″ SSD (option) (with RAID supported)
    • Other features: Rich I/O connectivity: 2 Intel GbE, 4 USB 3.1, 2 USB 2.0, 2 COM, 2 HDMI 2.0 Support resolution 4K@60Hz, Acoustic level support full load 36dB @operating temperature 45° C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
  • FS053
    DFI FS053 NXP i.MX6 2.5″ Fanless Pico-ITX SBC
    • Product Name: DFI FS053
    • Motherboard Form Factor: 2.5″ Pico-ITX
    • CPU: NXP i.MX6 Processor
    • RAM: DDR3L SDRAM memory down, up to 4GB
    • Expansion: 1 Mini PCIe, 1 SD
    • Other features: Dual independent displays: HDMI + LVDS, Rich I/O: 2 GbE, 2 COM, 4 USB 2.0, 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on NXP Roadmap)
  • EC102 XNX 1 1
    DFI EC102-XNX NVIDIA Jetson Xavier NX Embedded System
    • Product Name: DFI EC102-XNX
    • System Type: NVIDIA Jetson Industrial PC
    • CPU: NVIDIA Jetson Xavier NX
    • RAM: 8Gb
    • Expansion: 20 pins with 1 x UART, 2 x I2C, 9 x GPIOs
    • Other features: 91.4mm (W) x 70mm (H) x 76.6mm (D), Fanless chassis technology, 1 x HDMI 2.0a/b Type-A supports 4K@60Hz
  • FS051
    DFI FS051 NXP i.MX6 2.5″ Fanless Pico-ITX SBC
    • Product Name: DFI FS051
    • Motherboard Form Factor: 2.5″ Pico-ITX
    • CPU: NXP i.MX6 Processor
    • RAM: DDR3L SDRAM memory down, up to 4GB
    • Expansion: 1 Mini PCIe, 1 SD, 1 SIM (Optional)
    • Other features: Dual independent displays: HDMI + LVDS, Rich I/O: 1 GbE, 3 COM, 5 USB 2.0, 1 CANBus, 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on NXP Roadmap)
  • M8M051
    DFI M8M051 NXP i.MX 8M 2.5″ Pico-ITX SBC
    • Product Name: DFI M8M051
    • Motherboard Form Factor: 2.5″ Pico-ITX
    • CPU: NXP i.MX 8M Processors
    • RAM: Single Channel LPDDR4 up to 3200 MHz
    • Expansion: Multiple Expansion: 1 M.2 B Key, 1 M.2 E Key
    • Other features: Single Display: HDMI/LVDS (HDMI: resolution up to 4096×2160 @60Hz / LVDS: resolution up to 1920×1080 @60Hz), Rich I/O: 1 Intel GbE, 3 COM, 2 USB 3.1 Gen1, 3 USB 2.0, 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on NXP Roadmap)
  • CH961 front
    DFI CH961 8th/9th Gen Intel iCore Xeon COM Express Basic
    • Product Name: DFI CH961
    • Module Form Factor: COM Express Basic
    • CPU: 8th/9th Gen Intel iCore Xeon Celeron
    • RAM: Dual channel DDR4 2666MHz SODIMM up to 96GB
    • Expansion: Multiple expansion: 1 PCIe x16, 8 PCIe x1
    • Other features: Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI Supports three independent displays; DP++ resolution supports up to 4096×2304 @ 60Hz; Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
  • photo front GH9A3 R011 web
    DFI GH9A3 AMD Ryzen R1000 Series COM Express Mini
    • Product Name: DFI GH9A3
    • Module Form Factor: COM Express Mini
    • CPU: AMD Ryzen R1000 Series Processor
    • RAM: Single Channel LPDDR4 2400MHz; Memory Down up to 8GB
    • Expansion: Multiple expansions: 3 PCIe x1
    • Other features: 1 LVDS/eDP, 1 DDI (HDMI/DP); Supports dual displays: DDI + LVDS/eDP; Rich I/O: 1 Intel GbE, 2 USB 3.1, 8 USB 2.0; 10-Year CPU Life Cycle Support Until Q1′ 28 (Based on AMD Roadmap)
  • CS181 Front062420 R1 w600
    DFI CS181-H310 8th/9th Gen Intel iCore MXM Mini-ITX Motherboard
    • Product Name: DFI CS181-H310
    • Motherboard Form Factor: Mini-ITX
    • CPU: 8th/9th Generation Intel Core Processors
    • RAM: 2 DDR4 2400/2666MHz SODIMM up to 32GB
    • Expansion: Multiple Displays: 1 LVDS/eDP, 1 DP++/HDMI (autodetection), 4 DP; Multiple Expansions: 1 MXM Type-A/B, 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
    • Other features: Storage: 2 SATA 3.0; Rich I/O: 6 Intel GbE, 2 COM, 4 USB 3.1 Gen1, 6 USB 2.0; 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on Intel IOTG Roadmap)
  • CS181 Front062420 R1 w600
    DFI CS181-Q370 8th/9th Gen Intel iCore MXM Mini-ITX Motherboard
    • Product Name: DFI CS181-Q370
    • Motherboard Form Factor: Mini-ITX
    • CPU: 8th/9th Generation Intel Core Processors
    • RAM: 2 DDR4 2400/2666MHz SODIMM up to 32GB
    • Expansion: Multiple Displays: 1 LVDS/eDP, 1 DP++/HDMI (autodetection), 4 DP; Multiple Expansions: 1 MXM Type-A/B, 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
    • Other features: Storage: 2 SATA 3.0; Rich I/O: 6 Intel GbE, 2 COM, 4 USB 3.1 Gen2, 6 USB 2.0; 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on Intel IOTG Roadmap)
  • GHF51B190606w600
    DFI GHF51 1.8″ AMD Ryzen SBC – Industrial Pi – Dev Kit
    • Product Name: DFI GHF51-R1102G
    • Motherboard Form Factor: 1.8″ SBC
    • CPU: AMD Ryzen Embedded R1000 Series
    • RAM: Single Channel DDR4 Memory Down up to 4GB/8GB
    • Expansion: Expansion and Storage: 1 Mini PCIe, 1 SMBus
    • Other features: Small form factor for space-limited applications, HDMI 1.4 resolution supports up to 4096×2160 @ 24Hz, Rich I/O: 1 Intel GbE, 1 USB 3.1 Gen 2, 2 Micro HDMI, 10-Year CPU Life Cycle Support Until Q1’30 (Based on AMD Roadmap)
  • EC51X CSSide210310R1 w600
    DFI EC510-CS/EC511-CS 8th/9th Gen 5G Fanless Industrial Computer
    • Product Name: DFI EC510-CS/EC511-CS
    • System Type: Fanless Embedded System
    • CPU: 8th/9th Gen Intel Core
    • RAM: Supports DDR4 SODIMM up to 64GB
    • Expansion: 1 PCIe and 3 M.2 slots support NVMe
    • Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Support 4 PoE (EC51x-CS6G86E-Q), Support 5G Communication, Operating Temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
  • EC543 CSSide210324 w600
    DFI EC543-CS 8th/9th Gen 5G Fanless Industrial Computer
    • Product Name: DFI EC543-CS
    • System Type: Fanless Embedded System
    • CPU: 8th/9th Gen Intel Core
    • RAM: Supports DDR4 SODIMM up to 64GB
    • Expansion: 3 PCIe, 1 PCI, and 3 M.2 slots support NVMe
    • Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Support 4 PoE (EC543-CS6G86E-Q configuration), Support 5G communication, Operating temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
  • EC500 CSSide200824 w600
    DFI EC500-CS 8th/9th Gen 5G Fanless Embedded System
    • Product Name: DFI EC500-CS
    • System Type: Fanless Embedded System
    • CPU: 8th/9th Gen Intel Core
    • RAM: Supports DDR4 SODIMM up to 64GB
    • Expansion: 3 M.2 slots support NVMe
    • Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Rich I/O connectivity: 2 GbE, 4 COM, 4 USB 3.1, 2 USB 2.0 (Q370 only), Support 5G Communication, Operating Temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
  • EC90ASide210324 w600
    DFI EC90A-GH AMD Ryzen Ultra Compact Fanless Embedded System
    • Product Name: DFI EC90A-GH
    • System Type: Ultra Small Mini PC Fanless Embedded System
    • CPU: AMD Ryzen Embedded R1000 Series
    • RAM: DDR4 2400 MHz SODIMM down up to 4GB/8GB (memory onboard)
    • Expansion: 1 x Mini-PCIe (PCIe signal)
    • Other features: Ultra Small Size: 110 x 80mm x 60mm (W x H x D), User-friendly design for installing SIM card, I/O: 1 Intel GbE, 1 USB 3.1 Gen 2, 2 Micro HDMI, 10-Year CPU Life Cycle Support Until Q1’30 (Based on AMD Roadmap)
  • ECX700 ADP 1
    DFI ECX700-ADP 12th Gen Outdoor Ruggedized IPC67 Mini PC
    • Product Name: DFI ECX700-ADP
    • System Type: Outdoor Ruggedized IPC67 Box PC
    • CPU: Intel Alder Lake-P Processor i5-1245UE / i7-1265UE
    • RAM: Supports DDR4 memory
    • Expansion: Multiple I/O interfaces for versatile connectivity
    • Other Features: IP67-rated waterproof and dustproof design, extreme ruggedization to IEC 60068-2-64, wide operating temperature range (-20 to 70°C)
  • ECX700 ALSide201126R2 W600
    DFI ECX700-AL Outdoor Ruggedized IPC67 Grade Box PC
    • Product Name: DFI ECX700-AL
    • System Type: Ruggedized Outdoor IoT IP67 Fanless Embedded System
    • CPU: Intel Atom Processor E3900 Series
    • RAM: 4GB DDR3 onboard, 64G eMMC
    • Expansion: 1 x Full-size Mini PCIe for 4G LTE module, 1 x Full-size Mini PCIe for Canbus, 1 x M.2 2230 (USB2.0/PCIe) for WiFi module
    • Other features: Ruggedized IPC67 Grade Box PC, Outdoor IoT Gateway Application, Operating temperature: -40° to 70° C, 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap)
  • EC100 XNX side w600
    DFI EC100-XNX NVIDIA Jetson Xavier NX PoE Embedded System
    • Product Name: DFI EC100-XNX
    • System Type: Industrial PC
    • CPU: NVIDIA Jetson Xavier NX
    • RAM: 8Gb
    • Expansion: 20 pins with 1 x UART, 2 x I2C, 9 x GPIOs
    • Other features: Fully supports NVIDIA Jetson Xavier NX, 8 x 10/100 MbE with PoE, Fanless chassis technology, 1 x HDMI 2.0a/b Type-A supports 4K@60Hz
  • AL553F190326 RAw600
    DFI AL553 Intel Atom E3900 3.5″ SBC
    • Product Name: DFI AL553
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: Intel Atom E3900
    • RAM: 1 DDR3L SODIMM up to 8GB
    • Expansion: Three independent displays: VGA + LVDS + HDMI; Multiple expansion: 1 M.2 B Key, 1 M.2 E Key, Mini PCIe
    • Other features: Rich I/O: 2 Intel GbE, 1 COM, 2 USB 3.1 Gen1, 4 USB 2.0; 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap)
  • AL551 F 070824RAw600
    DFI AL551 Intel Atom E3900 3.5″ SBC
    • Product Name: DFI AL551
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: Intel Atom E3900
    • RAM: 1 DDR3L SODIMM up to 8GB
    • Expansion: Three independent displays: VGA + LVDS + DP++; Wireless communication: mini PCIe
    • Other features: Rich I/O: 2 Intel GbE, 2 COM, 2 USB 3.0, 4 USB 2.0; 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap)
  • AL700 Back Website
    DFI AL700 Intel Atom E3900 Qseven
    • Product Name: DFI AL700
    • Module Form Factor: Intel Atom E3900 Qseven
    • CPU: Intel Atom E3900 Series
    • RAM: 4GB/8GB DDR3L Dual Channel Memory Down
    • Expansion: Multiple expansions: 4 PCIe x1
    • Other features: Rich I/O: 1 Intel GbE, 1 USB 3.0, 8 USB 2.0; 1 DDI*, 1 LVDS*/(eDP + DDI) Supports triple displays: eDP+2DDI; 15-Year CPU Life Cycle Support Until Q1′ 31 (Based on Intel IOTG Roadmap)
  • AL701F090426 W600
    DFI AL701 Intel Atom E3900 Qseven
    • Product Name: DFI AL701
    • Module Form Factor: Intel Atom E3900 Qseven
    • CPU: Intel Atom E3900
    • RAM: 4GB/8GB LPDDR4 Dual Channel Memory
    • Expansion: Multiple expansions: 4 PCIe x1
    • Other features: 1 DDI*, 1 LVDS*/(eDP + DDI)；Supports triple displays: eDP+2DDI; DP++ resolution supports up to 4096×2160 @ 60Hz; Rich I/O: 1 Intel GbE, 1 USB 3.0, 8 USB 2.0; 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on Intel IOTG Roadmap)
  • AL968 Front Website
    DFI AL968 Intel Atom E3900 COM Express Compact
    • Product Name: DFI AL968
    • Module Form Factor: COM Express Compact
    • CPU: Intel Atom E3900 Series
    • RAM: Dual channel DDR3L 1600MHz SODIMM up to 8GB
    • Expansion: Multiple expansion: 4 PCIe x1, 1 LPC, 1 I2C, 1 SMBus, eMMC
    • Other features: Three independent displays: VGA*/DDI + LVDS*/eDP + DDI; Rich I/O: 1 Intel GbE, 4 USB 3.0, 8 USB 2.0, 2 SATA 3.0; 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on Intel IOTG Roadmap)
  • photo front AL9A8 RA
    DFI AL9A8 Intel Atom E3900 COM Express Mini
    • Product Name: DFI AL9A8
    • Module Form Factor: COM Express Mini
    • CPU: Intel Atom E3900 Processor Series
    • RAM: Dual Channel LPDDR4-2400MHz Memory Down up to 8GB
    • Expansion: Multiple expansions: 4 PCIe x1
    • Other features: Rich I/O: 1 Intel GbE, 2 USB 3.0, 8 USB 2.0; 1 LVDS/eDP, 1 DDI (HDMI/DP++) Supports dual displays: DDI + LVDS/eDP; 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on Intel IOTG Roadmap)
  • GH551F200130R1 W600
    DFI GH551 AMD Ryzen V1000/R1000 Series 3.5″ SBC
    • Product Name: DFI GH551
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: AMD Ryzen V1000/R1000 Series
    • RAM: 1 DDR4 2400MHz SODIMM up to 16GB
    • Expansion: Multiple displays: max. 4 DP++/3 DP++ + LVDS; Multiple Expansion: 1 M.2 M Key, 1 Mini PCIe
    • Other features: Rich I/O: 3 GbE, 2 USB 3.1 Gen2, 1 USB 2.0; 10-Year CPU Life Cycle Support Until Q1′ 31 (Based on AMD Roadmap)
  • ALF51F080111RAw600
    DFI ALF51 1.8″ Intel Atom X5 or Celeron Industrial Pi SBC
    • Product Name: DFI ALF51
    • Motherboard Form Factor: 1.8″ SBC
    • CPU: Intel Atom Processor E3900 Series or Celeron CPU
    • RAM: 2GB/4GB LPDDR4 Memory Down
    • Expansion: 1 Mini DP++
    • Other features: Rich I/O: 2 Intel GbE, 1 COM, 2 USB 3.1 Gen 1, 1 USB 2.0, 15-Year CPU Life Cycle Support Until Q4’31 (Based on Intel IOTG Roadmap), Operating: 0 to 60°C
  • RC300 CS SideIO200729R2 w600
    DFI VC300-CS AI-Enabled 5G MXM In-Vehicle PC
    • Product Name: DFI VC300-CS
    • System Type: AI-Enabled 5G MXM In-Vehicle PC
    • CPU: 8th/9th Generation Intel Core Processors
    • RAM: Dual Channel DDR4 2666/2400 MHz by SODIMMs up to 64GB
    • Expansion: 4 x 802.3af POE Ports, Multiple Expansion Slots for 3G/LTE/5G Cellular Support
    • Other features: AI Accelerated: Up to 110W GPU MXM Module Supported, Extended Operating Temperature: -25°C to 70°C, Support 5G Communication, 15-Year CPU Life Cycle Support Until Q1′ 34 (Based on Intel IOTG Roadmap)
  • ALF51F080111RAw600
    DFI ALF51-ET 1.8″ Intel Atom X5 or Celeron Industrial Pi SBC – Extended Temp
    • Product Name: DFI ALF51-ET
    • Motherboard Form Factor: 1.8″ SBC
    • CPU: Intel Atom Processor E3900 Series or Celeron
    • RAM: 2GB/4GB LPDDR4 Memory Down
    • Expansion: 1 Mini DP++
    • Other features: Rich I/O: 2 Intel GbE, 1 COM, 2 USB 3.1 Gen 1, 1 USB 2.0, 15-Year CPU Life Cycle Support Until Q4’31 (Based on Intel IOTG Roadmap), Operating: -40 to 85°C
  • ALF51F080111RAw600
    DFI ALF51-WT Intel Atom X5 or Celeron Industrial Pi SBC – Wide Temp
    • Product Name: DFI ALF51-WT
    • Motherboard Form Factor: 1.8″ SBC
    • CPU: Intel Atom Processor E3900 Series or Celeron
    • RAM: 2GB/4GB LPDDR4 Memory Down
    • Expansion: 1 Mini DP++
    • Other features: Rich I/O: 2 Intel GbE, 1 COM, 2 USB 3.1 Gen 1, 1 USB 2.0, 15-Year CPU Life Cycle Support Until Q4’31 (Based on Intel IOTG Roadmap), Operating: -20 to 70°C
  • KU968 Front Website
    DFI KU968 Kaby Lake 7th Gen Intel iCore COM Express Compact
    • Product Name: DFI KU968
    • Module Form Factor: COM Express Compact
    • CPU: 7th Gen Intel Core
    • RAM: Dual channel DDR4 2133MHz memory down up to 16GB
    • Expansion: Multiple expansion: 8 PCIe x1, 1 LPC, 1 I2C, 1 SMBus
    • Other features: Rich I/O: 1 Intel GbE, 4 USB 3.0, 8 USB 2.0; Three independent displays: VGA*/DDI + LVDS*/eDP + DDI; 15-Year CPU Life Cycle Support Until Q1′ 32 (Based on Intel IOTG Roadmap)
  • COM101 BAT Front Website
    DFI COM101-BAT Mini-ITX – COMe Basic/Compact Carrier Board
    • Product Name: DFI COM101-BAT
    • Motherboard Form Factor: Mini-ITX
    • CPU: Supports COMe Basic/Compact modules
    • RAM: Supports Compact/Basic modules
    • Expansion: Multiple displays (1 DP, 1 LVDS, 1 VGA)
    • Other features: Rich I/O (1 GbE, 6 USB)
  • COM332 B Front Website
    DFI COM332-B(R.A) Micro-ATX – COMe Basic/Compact Carrier Board
    • Product Name: DFI COM332-B
    • Motherboard Form Factor: Micro-ATX
    • CPU: Supports COMe Basic/Compact modules
    • RAM: Supports Compact and Basic modules
    • Expansion: Multiple displays (VGA, LVDS, DP, eDP)
    • Other features: Rich I/O (1 GbE, 4 USB 3.0, 4 USB 2.0)