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Industrial and Embedded Products

  • KS AL

    DFI KSM-KH Series 15″ – 22″ Modular Rugged Industrial Panel PC Series

    • Product Name: DFI KSM-KH Series
    • Screen Size: 15″ – 22″
    • CPU: Intel Core Processor with Fanless Design
    • RAM: Two 260-pin SODIMM up to 32GB (CM238 supports ECC) Dual Channel DDR4 2400MHz
    • Expansion: Not specified
    • Other features: Support Adaptive Display Platform, Supports 9~36V Power Input, Multiple Panel Sizes with Resistive/P-Capacitive Touch Screen, IP65 Front Panel Protection, 15-Year CPU Life Cycle Support Until Q1′ 32 (Based on Intel IOTG Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • PCSF51 1

    DFI PCSF51-R2312 1.8″ AMD Ryzen SBC – Industrial Pi – Dev Kit

    • Product Name: DFI PCSF51-R2312
    • Motherboard Form Factor: 1.8″ SBC
    • CPU: AMD Ryzen Embedded R2000 Series – Picasso
    • RAM: Single Channel DDR4 Memory Down up to 4GB/8GB
    • Expansion: Small form factor 1.8″ SBC for space-limited applications
    • Other features: HDMI 1.4 resolution supports up to 4096 x 2160 @ 24Hz, Storage up to 128GB: eMMC 32GB/ 64GB/ 128GB, 10-Year CPU Life Cycle Support Until Q2′ 32 (Based on AMD Roadmap)
  • PCSF51 1

    DFI PCSF51-R2314 1.8″ AMD Ryzen SBC – Industrial Pi – Dev Kit

    • Product Name: DFI PCSF51-R2314
    • Motherboard Form Factor: 1.8″ SBC
    • CPU: AMD Ryzen Embedded R2000 Series – Picasso
    • RAM: Single Channel DDR4 Memory Down up to 4GB/8GB
    • Expansion: Small form factor 1.8″ SBC for space-limited applications
    • Other features: HDMI 1.4 resolution supports up to 4096 x 2160 @ 24Hz, Storage up to 128GB: eMMC 32GB/ 64GB/ 128GB, 10-Year CPU Life Cycle Support Until Q2′ 32 (Based on AMD Roadmap)
  • PCSF51 1

    DFI PCSF51-R2514 1.8″ AMD Ryzen SBC – Industrial Pi – Dev Kit

    • Product Name: DFI PCSF51-R2514
    • Motherboard Form Factor: 1.8″ SBC
    • CPU: AMD Ryzen Embedded R2000 Series – Picasso
    • RAM: Single Channel DDR4 Memory Down up to 4GB/8GB
    • Expansion: Small form factor 1.8″ SBC for space-limited applications
    • Other features: HDMI 1.4 resolution supports up to 4096 x 2160 @ 24Hz, Storage up to 128GB: eMMC 32GB/ 64GB/ 128GB, 10-Year CPU Life Cycle Support Until Q2′ 32 (Based on AMD Roadmap)
  • ADP253 1

    DFI ADP253 12th Gen Alder Lake-P 4″ EPIC SBC

    • Product Name: DFI ADP253
    • Motherboard Form Factor: 4″ SBC
    • CPU: 12th Gen Intel Core Processors
    • RAM: On board memory and 1 DDR4 SO-DIMM
    • Expansion: Multiple Expansion: 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
    • Other features: Multiple Displays: 1 HDMI, 1 VGA/DP, 2 Type-C Alt. Mode, Supports 4K/2K resolution, Rich I/O: 1 Intel 2.5GbE, 2 Intel GbE, 6 COM, 4 USB 3.2, 2 USB 2.0, 1 SATA 3
    This product has multiple variants. The options may be chosen on the product page
  • IDP070 MS

    DFI IDP070-MS 7″ Long Distance HDBaseT Industrial Touch Monitor

    • Product Name: DFI IDP070-MS
    • Screen Size: 7″
    • Resolution: 800 x 480
    • Features: Projected Capacitive Multi-touch or Resistive Touch, IP Rating: IP65 Front Panel, Support 3 Signal Interfaces: VGA/DVI/HDMI, Support Modular Extended Display: 1 x HDBaseT / 2 x HDBaseT / Wifi Display, Various Mounting Type: VESA Mount 75 / Panel Mount, Advanced Voltage: Support USB Type C (Optional)
  • IDP156 MS

    DFI IDP156-MS 15.6″ Long Distance HDBaseT Industrial Touch Monitor

    • Product Name: DFI IDP156-MS
    • Screen Size: 15.6″
    • Resolution: 1366 x 768
    • Features: Projected Capacitive Multi-touch or Resistive Touch, IP Rating: IP65 Front Panel, Support 3 Signal Interfaces: VGA/DVI/HDMI, Support Modular Extended Display: 1 x HDBaseT / 2 x HDBaseT / Wifi Display, Various Mounting Type: VESA Mount 75 / Panel Mount, Advanced Voltage: Support USB Type C
  • M8MP553 1

    DFI M8MP553 NXP i.MX 8M 3.5″ SBC

    • Product Name: DFI M8MP553
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: NXP i.MX8M plus Processors
    • RAM: 2GB/4GB LPDDR4
    • Expansion: M.2 2230/3052: 1 M.2 B key for PCIe
    • Other features: 2 GbE LAN for automation application, CANbus for automation equipment integration, 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on NXP Roadmap)
  • VC900 M8M 1 1

    DFI VC900-M8M NXP i.MX 8M In-Vehicle PC

    • Product Name: DFI VC900-M8M
    • System Type: In-Vehicle PC
    • CPU: NXP i.MX8 series
    • RAM: 16GB/64GB eMMC and micro SD card slot
    • Expansion: Rich I/O: 1 GbE, 2 COM, 1 CANBus, 2 USB 3.0, 1 Micro USB (OTG)
    • Other features: Wide voltage: 936V vehicle power input with ACC/IGN function, Wide temperature: -20°C65°C operation without active fan
  • EC500 ADS 1

    DFI EC500-ADS 12th Gen Alder Lake 5G Fanless Embedded System

    • Product Name: DFI EC500-ADS
    • System Type: Fanless Embedded System
    • CPU: 12th Generation Intel Core with Intel H610E/Q670E/R680E
    • RAM: Supports DDR4 SODIMM up to 64GB
    • Expansion: Three M.2 slots
    • Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Rich I/O connectivity: 2 GbE, 6 COM, 4 USB 3.1, 2 USB 2.0, Support 5G Communication, Operating Temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q4′ 36 (Based on Intel IOTG Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • VP070 M8M 1

    DFI VP070-M8M NXP i.MX 8M In-Vehicle Panel PC

    • Product Name: DFI VP070-M8M
    • Screen Size: In-Vehicle Panel PC
    • CPU: NXP i.MX 8M Dual/Quad Cortex
    • RAM: On board Memory 2GB/4GB (Default 2GB)
    • Expansion: Not specified
    • Other features: IP65 Front Panel Protection, Rich I/O: 1 GbE, 2 COM, 1 CAN Bus, 2 USB 3.1 Gen1, 1 HDMI, Application Focus: In-Vehicle Driver HMI, Smart Power Ignition Control: Power delay and protection time setting
  • EHL700

    DFI EHL700 Intel Elkhart Lake Celeron / Atom Qseven

    • Product Name: DFI EHL700
    • Module Form Factor: Intel Elkhart Lake Celeron / Atom Qseven
    • CPU: Intel Elkhart Lake Celeron / Atom
    • RAM: 4GB/8GB LPDDR4 Single Channel Memory Down
    • Expansion: Multiple expansions: 4 PCIe x1
    • Other features: 1 DDI*, 1 LVDS*/eDP, DP++ resolution supports up to 4096×2160 @ 60Hz, Rich I/O: 1 Intel GbE, 3 USB 3.1, 8 USB 2.0, 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on Intel IOTG Roadmap)
  • TGH960

    DFI TGH960 Intel Tiger Lake iCore / Xeon Com Express Basic Module

    • Product Name: DFI TGH960
    • Module Form Factor: Intel Tiger Lake iCore / Xeon Com Express Basic Module
    • CPU: 11th Generation Intel Processor COM Express Basic
    • RAM: DDR4 3200MHz SODIMM up to 128GB
    • Expansion: Multiple expansion: 1 PCIe x16, 8 PCIe x1, 1 LPC, 1 I2C, 1 SMBus
    • Other features: VGA + LVDS*/eDP + 3 DDI, DP++ supports 4K resolution, Rich I/O: 1 Intel 2.5GbE, 4 USB 3.2 Gen2, 8 USB 2.0, 15-Year CPU Life Cycle Support Until Q2′ 36 (Based on Intel IOTG Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • ADS101 ADS103 1

    DFI ADS101/ADS103 12th Gen Alder Lake-S Mini-ITX SBC

    • Product Name: DFI ADS101/ADS103
    • Motherboard Form Factor: Mini-ITX
    • CPU: 12th Generation Intel Core Processors
    • RAM: 2 DDR4 3200MHz SODIMM up to 64GB
    • Expansion: Multiple expansion: 1 PCIe x16 gen 5, 1 M.2 E Key (USB/PCIe), 1 M.2 M Key (PCIe/SATA), 1 M.2 B Key (PCIe/SATA/USB)
    • Other features: Quad Displays: 1 DP++, 1 DP++/HDMI, 1 LVDS/eDP, 1 DFI display extension port (DP/HDMI/VGA available), Supports up to 4K/2K resolution, Rich I/O: 1 Intel 2.5GbE, 2 Intel GbE, 2 COM, up to 6 USB 3.2 Gen2, 2 USB 3.2 Gen1, 4 USB 2.0, 2 SATA 3.0, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • ADS310 R680E Q670E Micro ATX 1

    DFI ADS310-R680E/Q670E 12th Gen Alder Lake-S Micro-ATX Motherboard

    • Product Name: DFI ADS310-R680E/Q670E
    • Motherboard Form Factor: Micro-ATX
    • CPU: 12th Gen Intel Core with Intel R680E/Q670E chipset
    • RAM: 4 DDR4 UDIMM up to 128GB
    • Expansion: Multiple expansion: 1 PCIe x16 gen 5, 3 PCIe x4, 1 M.2 E key, 2 M.2 M key, 4 SATA 3.0
    • Other features: Supports 4 independent displays: VGA, 2 DP++, HDMI 2.0a, Supports 8K/4K resolution, Rich I/O: 2 Intel 10GbE, 2 Intel 2.5GbE, 2 COM, 6 USB 3.2 Gen 2, 4 USB 3.2 Gen 1, 4 USB 2.0
    This product has multiple variants. The options may be chosen on the product page
  • RPS310 1

    DFI RPS310-R680E/Q670E 12th Gen Alder Lake-S Micro-ATX Motherboard

    • Product Name: DFI RPS310-R680E/Q670E
    • Motherboard Form Factor: Micro-ATX
    • CPU: 14th/13th/12th Gen Intel Core with Intel R680E/Q670E chipset
    • RAM: 4 DDR5 UDIMM up to 128GB
    • Expansion: 1 PCIe x16, 3 PCIe x4, 1 M.2 E key, 2 M.2 M key, 4 SATA 3.0
    • Other features: 4 independent displays: VGA, 2 DP++, HDMI 2.0a, Supports 8K/4K resolution, Rich I/O: 2 Intel 10GbE, 2 Intel 2.5GbE, 2 COM, 6 USB 3.2 Gen 2, 4 USB 3.2 Gen 1, 4 USB 2.0
  • ADS630 R680E Q670E ATX 1

    DFI ADS630-R680E/Q670E 12th Gen Alder Lake-S ATX Motherboard

    • Product Name: DFI ADS630-R680E/Q670E
    • Motherboard Form Factor: ATX
    • CPU: 12th Gen Intel Core Processors
    • RAM: 4 DDR4 UDIMM up to 128GB
    • Expansion: Multiple Expansion: 1 PCIe x16(Gen 5), 4 PCIe x4(Gen 4), 2 PCI, 2 M.2 M key, 1 M.2 E Key
    • Other features: Quad Displays: VGA + 2 x DP++ + HDMI, Supports 4K resolution, Rich I/O: 2 Intel 10GbE, 2 Intel 2.5GbE, 6 USB 3.2 Gen2, 4 USB 3.2 Gen1, 3 USB 2.0
    This product has multiple variants. The options may be chosen on the product page
  • KS070 M8M 1

    DFI KS070-M8M NXP i.MX 8M 7″ IP65 Panel PC

    • Product Name: DFI KS070-M8M
    • Screen Size: 7″ IP65 Panel PC
    • CPU: NXP i.MX8M Platform
    • RAM: 2GB/4GB SDRAM Memory
    • Expansion: Multiple Expansion: M.2 2230/3042 support
    • Other features: 7″ 1024×600 TFT LCD Panel with capacitive touch screen, IP65 front panel protection
  • M8M KIT Series 1

    DFI M8M_KIT_Series NXP i.MX 8M Panel PC Kit

    • Product Name: DFI M8M_KIT_Series
    • Screen Size: Open Frame Designed Panel PC
    • CPU: NXP i.MX 8M Processor
    • RAM: LPDDR4-3200 2GB plus 16GB eMMC on board
    • Expansion: Multiple Expansion: M.2 2230 E Key and 3042/2242 B Key
    • Other features: Touch Screen: P-Capacitive Touch supports 10 points, Easy Integration: Easy installation and maintenance, ARM-Based System: Support Android 9.0 and Linux
    This product has multiple variants. The options may be chosen on the product page
  • ADN553 1

    DFI ADN553 Alder Lake-N 3.5″ SBC

    • Product Name: DFI ADN553
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: Intel Atom Alder Lake-N Processors
    • RAM: 1 DDR5 SO-DIMM
    • Expansion: 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
    • Other Features: Supports 4K/2K resolution, triple display (HDMI, Type-C DP Alt Mode, LVDS/eDP), 3x 2.5GbE LAN, 4x USB 3.2, 2x USB 2.0, 1x SATA, 10-year CPU lifecycle until Q1 2033 with optional 5-year extended support
    This product has multiple variants. The options may be chosen on the product page
  • ASL553 1

    DFI ASL553 Amston Lake ATOM 3.5″ SBC

    • Product Name: DFI ASL553
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: Intel Atom Amston Lake Processors
    • RAM: 1 DDR5 SO-DIMM
    • Expansion: 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
    • Other Features: Supports 4K/2K resolution, triple display (HDMI, Type-C DP Alt Mode, LVDS/eDP optional), 3x 2.5GbE LAN, 4x USB 3.2, 2x USB 2.0, 1x SATA, wide temperature support (-40 to 85°C)
    This product has multiple variants. The options may be chosen on the product page
  • IRN556 1

    DFI IRN556 Twin Lake / Amston Lake ATOM X Series 3.5″ SBC

    • Product Name: DFI IRN556
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: Intel Atom Processor X Series / N Series (Twin Lake / Amston Lake)
    • RAM: 1 × DDR5-4800 SODIMM slot
    • Expansion: 1 × M.2 M Key, 1 × M.2 B Key, 1 × M.2 E Key
    • Other Features: Dual display support (HDMI and LVDS), dual Intel Gigabit Ethernet, 4 × COM ports, 4 × USB 3.2, and 2 × USB 2.0
    This product has multiple variants. The options may be chosen on the product page
  • MTH556 1

    DFI MTH556 Meteor Lake / Arrow Lake Core Ultra 3.5″ SBC

    • Product Name: DFI MTH556
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: Intel Core Ultra processor (Meteor and Arrow Lake)
    • RAM: 2 × DDR5-5600 SODIMM slots supporting up to 96GB
    • Expansion: 1 × M.2 M Key, 1 × M.2 B Key, 1 × M.2 E Key
    • Other Features: Triple independent display support (HDMI, LVDS, USB-C DP Alt Mode), dual 2.5GbE LAN, 4 × COM ports, 4 × USB 3.2, 1 × USB-C
    This product has multiple variants. The options may be chosen on the product page
  • EHL556 1

    DFI EHL556 Elkhart Lake Atom X Series 3.5″ SBC

    • Product Name: DFI EHL556
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: Intel Atom X Series Processor
    • RAM: 1 DDR4-3200 SODIMM up to 32GB
    • Expansion: Multiple Expansion: 1 M.2 E Key, 1 Mini- PCIe/M.2 B Key, 1 I2C
    • Other features: 4K High Resolution, Triple Independent Displays (1 VGA, 1 DP++, 1 LVDS/eDP), Rich I/O (2 LAN, 2 USB 3.1 Gen2, 2 USB 2.0, 2 COM, 1 SATA 3.0), 15-Year CPU Life Cycle Support Until Q4′ 35 (Based on Intel IOTG Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • ED700 EHL side

    DFI ED700-EHL Elkhart Lake 5G Fanless Embedded System

    • Product Name: DFI ED700-EHL
    • System Type: Elkhart Lake 5G Fanless Embedded System
    • CPU: Intel Atom Processors X Series
    • RAM: One 260 pin DDR4 SODIMM up to 3200MHz
    • Expansion: Support 5G Sub-6 module, Support WiFi 6 module, Support Isolated COM & DIO
    • Other features: 4 LAN: Support 1 x 2.5GbE TSN, 3 x GbE LAN, Wide Operating Temperature: Support up to -40 ~ 70°C, 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on Intel IOTG Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • EHL173F201125 R1 w600

    DFI EHL171/EHL173 Intel Elkhart Lake Wide Temp Mini-ITX

    • Product Name: DFI EHL171/EHL173
    • Motherboard Form Factor: Mini-ITX
    • CPU: Intel Atom Processor x6000 Series
    • RAM: 2 DDR4 SODIMM up to 32GB
    • Expansion: 1 M.2 B Key, 1 M.2 E Key, 1 PCIe x4 (x2 signal)
    • Other features: 3 Independent Displays: 1 DP++/VGA, 1 HDMI/DP++, 1 eDP/LVDS; Rich I/O: 2 x 2.5GbE, 2 USB 3.1 Gen2, 2 USB 3.1 Gen1, 6 COM, up to 4 USB 2.0; 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on Intel IOTG Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • ADN9A2 1

    DFI ADN9A2 Intel Alder Lake N COM Express Mini

    • Product Name: DFI ADN9A2
    • Module Form Factor: COM Express Mini
    • CPU: Intel Atom Processor Alder Lake-N Series
    • RAM: Dual Channel LPDDR5 4800MHz, up to 16GB
    • Expansion: 4 PCIe x1, 1 SMBus, 1 I2C, 1 eMMC
    • Other Features: Supports dual displays (DDI + LVDS/eDP), 2 USB 3.2, 8 USB 2.0, 2.5GbE Ethernet
    This product has multiple variants. The options may be chosen on the product page
  • ASL9A2 1

    DFI ASL9A2 Intel Amston Lake COM Express Mini

    • Product Name: DFI ASL9A2
    • Module Form Factor: COM Express Mini
    • CPU: Intel Atom Processor Amston Lake Series
    • RAM: Dual Channel LPDDR5 4800MHz, up to 16GB
    • Expansion: 4 PCIe x1, 1 SMBus, 1 I2C, 1 eMMC
    • Other Features: Dual display support (DDI + LVDS/eDP), 2 USB 3.1, 8 USB 2.0, 100M/1000M/2.5Gbps Ethernet
  • EHL9A2 Top w600

    DFI EHL9A2 Intel Elkhart Lake COM Express Mini

    • Product Name: DFI EHL9A2
    • Module Form Factor: COM Express Mini – COM Express Type 10
    • CPU: Intel Atom Processor Elkhart Lake Series
    • RAM: Dual Channel LPDDR4X 3200MHz/4267MHz up to 16GB
    • Expansion: Multiple expansions: 4 PCIe x1
    • Other features: 1 LVDS/eDP, 1 DDI (HDMI/DP++); Supports dual displays: DDI + LVDS/eDP, Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0, 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on Intel IOTG Roadmap).
  • CMS101 103 W480F210831 R1 w600

    DFI CMS101/CMS103 10th Gen Intel iCore Wide Temp Mini-ITX

    • Product Name: DFI CMS101/CMS103
    • Motherboard Form Factor: Mini-ITX
    • CPU: 10th Generation Intel Core Processors
    • RAM: 2 DDR4 2933MHz SODIMM up to 64GB
    • Expansion: 1 PCIe x16, 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
    • Other features: Multiple Displays: 2 x DP++, 1 LVDS/eDP; Supports up to 4K/2K resolution; Rich I/O: 1 Intel 2.5GbE, 2 Intel GbE, 4 COM, 4 USB 3.2 Gen2, 4 USB 2.0; 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
  • EC70A TGU 5

    DFI EC70A-TGU Tiger Lake Fanless Embedded System

    • Product Name: DFI EC70A-TGU
    • System Type: Tiger Lake Fanless Embedded System
    • CPU: 11th Gen Intel Core i7/i5/i3 Processors
    • RAM: On board memory 8GB and 1 SO-DIMM DDR4
    • Expansion: Support M.2 B key 3042/3052 5G-NR module
    • Other features: Triple Displays: 2 HDMI (4K@30Hz) + 1 VGA (2K@60Hz), Up to 4 LAN or 6 USB, 15-Year CPU Life Cycle Support Until Q3′ 35 (Based on Intel IOTG Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • GH171F070621 R1w600

    DFI GH171 AMD Ryzen V1000/R1000 Mini-ITX

    • Product Name: DFI GH171
    • Motherboard Form Factor: Mini-ITX
    • CPU: AMD Ryzen V1000/R1000
    • RAM: 2 DDR4 3200MHz SODIMM up to 32GB
    • Expansion: 1 PCIe x16, 1 M.2 M Key
    • Other features: Four independent displays: DP++ + DP++ + DP++ + DP++; Rich I/O: 2 GbE, 6 COM, 3 USB 3.0, 6 USB 2.0; 10-Year CPU Life Cycle Support Until Q1′ 28 (Based on AMD Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • RNO171F210506 w600

    DFI RNO171 AMD Ryzen V2000 Mini-ITX

    • Product Name: DFI RNO171
    • Motherboard Form Factor: Mini-ITX
    • CPU: AMD Ryzen V2000
    • RAM: 2 DDR4 3200MHz SODIMM up to 64GB
    • Expansion: 1 PCIe x16, 1 M.2 M Key
    • Other features: Four independent displays: DP++ + DP++ + DP++ + DP++; Rich I/O: 2 GbE, 6 COM, 2 USB 3.1 Gen2, 7 USB 2.0, SATA 3.0; 10-Year CPU Life Cycle Support Until Q4′ 30 (Based on AMD Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • DT200 CS side w600

    DFI DT200-CS High Performance MXM Embedded System

    • Product Name: DFI DT200-CS
    • System Type: High Performance MXM Embedded System
    • CPU: 8th/9th Generation Intel Core Processors
    • RAM: DDR4 2400/2666MHz up to 64GB
    • Expansion: Support M.2 B key 3052 5G cellular module
    • Other features: Multiple displays: 4 DP (from MXM), 1 DP++/HDMI (auto-detection), AI accelerated: up to 110W GPU MXM module supported, Rich I/O connectivity: 4 LAN, 4 USB 3.1, 6 USB 2.0, 2 COM, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
  • MD711 SU

    DFI MD711 i7 Medical Embedded System

    • Product Name: DFI MD711-SU2061-100G
    • System Type: Medical Embedded System
    • CPU: 6th Generation Intel Core
    • RAM: 2 DDR4 SODIMM up to 32GB
    • Expansion: Supports 1 PCIe 16, 1 Mini PCIe, 1 M.2 slot
    • Other features: 2 x 2.5″ SATA 3.0 drive bay, 4KV Isolated I/O ports: 2 Intel GbE, 2 COM, 2 USB 2.0, 15-Year CPU Life Cycle Support
  • MD711 SU

    DFI MD711 i5 Medical Embedded System

    • Product Name: DFI MD711-SU2061-000G
    • System Type: Medical Embedded System
    • CPU: 6th Generation Intel Core
    • RAM: 2 DDR4 SODIMM up to 32GB
    • Expansion: Supports 1 PCIe 16, 1 Mini PCIe, 1 M.2 slot
    • Other features: 2 x 2.5″ SATA 3.0 drive bay, 4KV Isolated I/O ports: 2 Intel GbE, 2 COM, 2 USB 2.0, 15-Year CPU Life Cycle Support
  • ES220 CSSide200612 w600

    DFI ES220-CS High Performance 9th/8th Gen iCore Embedded System

    • Product Name: DFI ES220-CS
    • System Type: High Performance 9th/8th Gen iCore Embedded System
    • CPU: 8th/9th Gen Intel Core Processors with Intel C246/Q370/H310 Chipset
    • RAM: 2 DDR4 SODIMM up to 64GB
    • Expansion: Single/Triple storage: 1 M.2 SSD + 2 2.5″ SSD (option) (with RAID supported)
    • Other features: Rich I/O connectivity: 2 Intel GbE, 4 USB 3.1, 2 USB 2.0, 2 COM, 2 HDMI 2.0 Support resolution 4K@60Hz, Acoustic level support full load 36dB @operating temperature 45° C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • FS053

    DFI FS053 NXP i.MX6 2.5″ Fanless Pico-ITX SBC

    • Product Name: DFI FS053
    • Motherboard Form Factor: 2.5″ Pico-ITX
    • CPU: NXP i.MX6 Processor
    • RAM: DDR3L SDRAM memory down, up to 4GB
    • Expansion: 1 Mini PCIe, 1 SD
    • Other features: Dual independent displays: HDMI + LVDS, Rich I/O: 2 GbE, 2 COM, 4 USB 2.0, 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on NXP Roadmap)
  • EC102 XNX 1 1

    DFI EC102-XNX NVIDIA Jetson Xavier NX Embedded System

    • Product Name: DFI EC102-XNX
    • System Type: NVIDIA Jetson Industrial PC
    • CPU: NVIDIA Jetson Xavier NX
    • RAM: 8Gb
    • Expansion: 20 pins with 1 x UART, 2 x I2C, 9 x GPIOs
    • Other features: 91.4mm (W) x 70mm (H) x 76.6mm (D), Fanless chassis technology, 1 x HDMI 2.0a/b Type-A supports 4K@60Hz
  • FS051

    DFI FS051 NXP i.MX6 2.5″ Fanless Pico-ITX SBC

    • Product Name: DFI FS051
    • Motherboard Form Factor: 2.5″ Pico-ITX
    • CPU: NXP i.MX6 Processor
    • RAM: DDR3L SDRAM memory down, up to 4GB
    • Expansion: 1 Mini PCIe, 1 SD, 1 SIM (Optional)
    • Other features: Dual independent displays: HDMI + LVDS, Rich I/O: 1 GbE, 3 COM, 5 USB 2.0, 1 CANBus, 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on NXP Roadmap)
  • M8M051

    DFI M8M051 NXP i.MX 8M 2.5″ Pico-ITX SBC

    • Product Name: DFI M8M051
    • Motherboard Form Factor: 2.5″ Pico-ITX
    • CPU: NXP i.MX 8M Processors
    • RAM: Single Channel LPDDR4 up to 3200 MHz
    • Expansion: Multiple Expansion: 1 M.2 B Key, 1 M.2 E Key
    • Other features: Single Display: HDMI/LVDS (HDMI: resolution up to 4096×2160 @60Hz / LVDS: resolution up to 1920×1080 @60Hz), Rich I/O: 1 Intel GbE, 3 COM, 2 USB 3.1 Gen1, 3 USB 2.0, 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on NXP Roadmap)
  • CH961 front

    DFI CH961 8th/9th Gen Intel iCore Xeon COM Express Basic

    • Product Name: DFI CH961
    • Module Form Factor: COM Express Basic
    • CPU: 8th/9th Gen Intel iCore Xeon Celeron
    • RAM: Dual channel DDR4 2666MHz SODIMM up to 96GB
    • Expansion: Multiple expansion: 1 PCIe x16, 8 PCIe x1
    • Other features: Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI Supports three independent displays; DP++ resolution supports up to 4096×2304 @ 60Hz; Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
    This product has multiple variants. The options may be chosen on the product page
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    DFI GH9A3 AMD Ryzen R1000 Series COM Express Mini

    • Product Name: DFI GH9A3
    • Module Form Factor: COM Express Mini
    • CPU: AMD Ryzen R1000 Series Processor
    • RAM: Single Channel LPDDR4 2400MHz; Memory Down up to 8GB
    • Expansion: Multiple expansions: 3 PCIe x1
    • Other features: 1 LVDS/eDP, 1 DDI (HDMI/DP); Supports dual displays: DDI + LVDS/eDP; Rich I/O: 1 Intel GbE, 2 USB 3.1, 8 USB 2.0; 10-Year CPU Life Cycle Support Until Q1′ 28 (Based on AMD Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • CS181 Front062420 R1 w600

    DFI CS181-H310 8th/9th Gen Intel iCore MXM Mini-ITX Motherboard

    • Product Name: DFI CS181-H310
    • Motherboard Form Factor: Mini-ITX
    • CPU: 8th/9th Generation Intel Core Processors
    • RAM: 2 DDR4 2400/2666MHz SODIMM up to 32GB
    • Expansion: Multiple Displays: 1 LVDS/eDP, 1 DP++/HDMI (autodetection), 4 DP; Multiple Expansions: 1 MXM Type-A/B, 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
    • Other features: Storage: 2 SATA 3.0; Rich I/O: 6 Intel GbE, 2 COM, 4 USB 3.1 Gen1, 6 USB 2.0; 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on Intel IOTG Roadmap)
  • CS181 Front062420 R1 w600

    DFI CS181-Q370 8th/9th Gen Intel iCore MXM Mini-ITX Motherboard

    • Product Name: DFI CS181-Q370
    • Motherboard Form Factor: Mini-ITX
    • CPU: 8th/9th Generation Intel Core Processors
    • RAM: 2 DDR4 2400/2666MHz SODIMM up to 32GB
    • Expansion: Multiple Displays: 1 LVDS/eDP, 1 DP++/HDMI (autodetection), 4 DP; Multiple Expansions: 1 MXM Type-A/B, 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
    • Other features: Storage: 2 SATA 3.0; Rich I/O: 6 Intel GbE, 2 COM, 4 USB 3.1 Gen2, 6 USB 2.0; 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on Intel IOTG Roadmap)
  • GHF51B190606w600

    DFI GHF51 1.8″ AMD Ryzen SBC – Industrial Pi – Dev Kit

    • Product Name: DFI GHF51-R1102G
    • Motherboard Form Factor: 1.8″ SBC
    • CPU: AMD Ryzen Embedded R1000 Series
    • RAM: Single Channel DDR4 Memory Down up to 4GB/8GB
    • Expansion: Expansion and Storage: 1 Mini PCIe, 1 SMBus
    • Other features: Small form factor for space-limited applications, HDMI 1.4 resolution supports up to 4096×2160 @ 24Hz, Rich I/O: 1 Intel GbE, 1 USB 3.1 Gen 2, 2 Micro HDMI, 10-Year CPU Life Cycle Support Until Q1’30 (Based on AMD Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • EC51X CSSide210310R1 w600

    DFI EC510-CS/EC511-CS 8th/9th Gen 5G Fanless Industrial Computer

    • Product Name: DFI EC510-CS/EC511-CS
    • System Type: Fanless Embedded System
    • CPU: 8th/9th Gen Intel Core
    • RAM: Supports DDR4 SODIMM up to 64GB
    • Expansion: 1 PCIe and 3 M.2 slots support NVMe
    • Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Support 4 PoE (EC51x-CS6G86E-Q), Support 5G Communication, Operating Temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
  • EC543 CSSide210324 w600

    DFI EC543-CS 8th/9th Gen 5G Fanless Industrial Computer

    • Product Name: DFI EC543-CS
    • System Type: Fanless Embedded System
    • CPU: 8th/9th Gen Intel Core
    • RAM: Supports DDR4 SODIMM up to 64GB
    • Expansion: 3 PCIe, 1 PCI, and 3 M.2 slots support NVMe
    • Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Support 4 PoE (EC543-CS6G86E-Q configuration), Support 5G communication, Operating temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)