DFI COM332-B(R.B1) Micro-ATX – COMe Basic/Compact Module Carrier Board

microATX, COMe Basic/Compact Modules, 1 Lan, 8 USB, 4 SATA 3.0, 1 VGA, 1 LVDS, 3 DP, 1 eDP

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Description

  • COM Express® R2.1, Pin-out Type 6
  • Supports Compact and Basic modules
  • Multiple displays: VGA, LVDS, DP, eDP
  • Rich I/O: 1 GbE, 4 USB 3.1, 4 USB 2.0
  • microATX form factor

Specification

Graphics
Display
1 x VGA
1 x LVDS/eDP (eDP available upon request)
3 x DP
1 x eDP/LVDS (LVDS available upon request)
Expansion
Interface
1 x PCIe x16
4 x PCIe x1
1 x M.2 M Key 2280
1 x SDIO
Audio
Audio Codec
Realtek ALC888S-VD2-GR
Rear I/O
Ethernet
1 x GbE (RJ-45)
USB
4 x USB 3.1 (Gen2)
4 x USB 2.0
Display
3 x DP
Audio
1 x Line-in
1 x Line-out
1 x Mic-in
Internal I/O
Serial
2 x Serial Interface Connector (TX/RX)
Display
1 x VGA (2.54mm)
1 x LVDS LCD Panel Connector
1 x LCD/Inverter Power
1 x eDP LCD Panel Connector
Audio
1 x Audio (Line-out/Mic-in)
1 x S/PDIF
SATA
4 x SATA 3.0 (up to 6Gb/s)
DIO
1 x 8-bit DIO
LPC
1 x LPC
SMBus
1 x SMBus
Power
Type
12V, 5VSB, VCC_RTC (ATX mode)
12V, VCC_RTC (AT mode)
Connector
4-pin ATX 12V power
24-pin ATX power
RTC Battery
CR2032 Coin Cell
Environment
Temperature
Operating: 0 to 60°C
Storage: -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
488,117 hrs @ 25°C; 253,684 hrs @ 45°C; 136,621 hrs @ 60°C
Calculation Model: Telcordia Issue 2, Method Case 3
Environment: GB, GC – Ground Benign, Controlled
Mechanism
Dimensions
microATX Form Factor
244mm (9.6″) x 244mm (9.6″)
Compliance
PICMG COM Express® R2.1, Type 6
Basic, Compact Modules
Standards and Certifications
Certifications
CE, FCC, RoHS
Packing List
Packing List
1 COM332-B(R.B1) board
1 Serial ATA data cable (Length: 500mm): 332-553001-005G
1 VGA cable: A81-012000-000G
Country of Origin
Country of Origin
Taiwan

Datasheet

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