DFI COM333-I Micro-ATX – COMe Basic/Compact Module Carrier Board

microATX, COMe Basic/Compact Modules, 4 PCIe x8, 4 10GLan, 2 Lan, 4 USB 3.0, 2 SATA 3.0

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Description

  • COM Express® R3.0, Pin-out Type 7
  • Supports Compact and Basic modules
  • Multiple expansion: 8 PCIe x4 or 4 PCIe x8, 2 SATA 3.0
  • Rich I/O: 2 GbE, 4 10Gbase-KR, 4 USB 3.0/2.0, 1 COM
  • microATX form factor

Specification

Expansion
Interface
B1: 2 x PCIe x4 or 1 x PCIe x8 (Gen 3)
B2: 2 x PCIe x4 or 1 x PCIe x8 (Gen 3)
B3: 2 x PCIe x4 or 1 x PCIe x8 (Gen 3)
B4: 2 x PCIe x4 or 1 x PCIe x8 (Gen 3)
Rear I/O
Ethernet
4 x 10GbE LAN (2 x SFP+, 2 x RJ-45) by 10GBASE-KR interface
2 x 1GbE LAN (RJ-45) (one from module; another from BMC for remote management)
Serial
1 x RS-232 (DB-9) (supports by BMC which default is debug port and may switch to normal RS-232)
USB
4 x USB 3.0/2.0
Internal I/O
Serial
2 x Serial Interface Connectors (TX/RX) (2.0mm pitch)
SATA
2 x SATA 3.0 (up to 6Gb/s)
DIO
1 x 8-bit DIO (4 input, 4 output)
1 x SDIO (conditionally available)
LPC
1 x LPC
SMBus
1 x SMBus
I2C
1 x I2C
Power
Connector
4-pin ATX 12V power 24-pin ATX power
Battery
CR2032 Coin Cell
Environment
Temperature
Operating: 0 to 60°C
Storage: -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
TBD
Mechanism
Dimensions
microATX Form Factor 244mm (9.6″) x 244mm (9.6″)
Compliance
PICMG COM Express® R3.0, Type 7 Basic, Compact Modules
Packing List
Packing List
1 COM333-I board
1 Serial ATA data cable (Length: 500mm): 332-553001-005G
Standoff (M2.5*12) (for compact size module): A33-525019-A20G
BMC
Features
1. IPMI 2.0
2. Web Browser Support
3. Web Interface
4. iKVM (keyboard, video, and mouse)
5. Virtual Media
6. 3rd Party Authentication
7. Firmware Update
8. SMASH/CLP
9. WS-MAN
10. Network Service
Processor
AST2500
SDRAM
DDR4-2400 1200MHz 8Gb memory down
Display
Through BMC to convert VGA signal
VGA: resolution up to 1920 x 1200 x 32bpp (share with SOC 16MB memory)
Country of Origin
Country of Origin
Taiwan

Datasheet

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