DFI COM333-I Micro-ATX – COMe Basic/Compact Carrier Board

• DFI COM333-I Micro-ATX – COMe Basic/Compact Carrier Board
• COM Express® R3.0, Pin-out Type 7
• Supports Compact and Basic modules
• Multiple expansion: 8 PCIe x4 or 4 PCIe x8, 2 SATA 3.0
• Rich I/O: 2 GbE, 4 10Gbase-KR, 4 USB 3.0/2.0, 1 COM
• microATX form factor

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Description

  • COM Express® R3.0, Pin-out Type 7
  • Supports Compact and Basic modules
  • Multiple expansion: 8 PCIe x4 or 4 PCIe x8, 2 SATA 3.0
  • Rich I/O: 2 GbE, 4 10Gbase-KR, 4 USB 3.0/2.0, 1 COM
  • microATX form factor

Specification

Expansion
Interface
B1: 2 x PCIe x4 or 1 x PCIe x8 (Gen 3)
B2: 2 x PCIe x4 or 1 x PCIe x8 (Gen 3)
B3: 2 x PCIe x4 or 1 x PCIe x8 (Gen 3)
B4: 2 x PCIe x4 or 1 x PCIe x8 (Gen 3)
Rear I/O
Ethernet
4 x 10GbE LAN (2 x SFP+, 2 x RJ-45) by 10GBASE-KR interface
2 x 1GbE LAN (RJ-45) (one from module; another from BMC for remote management)
Serial
1 x RS-232 (DB-9) (supports by BMC which default is debug port and may switch to normal RS-232)
USB
4 x USB 3.0/2.0
Internal I/O
Serial
2 x Serial Interface Connectors (TX/RX) (2.0mm pitch)
SATA
2 x SATA 3.0 (up to 6Gb/s)
DIO
1 x 8-bit DIO (4 input, 4 output)
1 x SDIO (conditionally available)
LPC
1 x LPC
SMBus
1 x SMBus
I2C
1 x I2C
Power
Connector
4-pin ATX 12V power 24-pin ATX power
Battery
CR2032 Coin Cell
Environment
Temperature
Operating: 0 to 60°C
Storage: -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
TBD
Mechanism
Dimensions
microATX Form Factor 244mm (9.6″) x 244mm (9.6″)
Compliance
PICMG COM Express® R3.0, Type 7 Basic, Compact Modules
Packing List
Packing List
1 COM333-I board
1 Serial ATA data cable (Length: 500mm): 332-553001-005G
Standoff (M2.5*12) (for compact size module): A33-525019-A20G
BMC
Features
1. IPMI 2.0
2. Web Browser Support
3. Web Interface
4. iKVM (keyboard, video, and mouse)
5. Virtual Media
6. 3rd Party Authentication
7. Firmware Update
8. SMASH/CLP
9. WS-MAN
10. Network Service
Processor
AST2500
SDRAM
DDR4-2400 1200MHz 8Gb memory down
Display
Through BMC to convert VGA signal
VGA: resolution up to 1920 x 1200 x 32bpp (share with SOC 16MB memory)
Country of Origin
Country of Origin
Taiwan

Datasheet

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BVM Customisation Service

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish.

 

If you’re unable to find an off-the-shelf product that meets your specific requirements, don’t hesitate to contact our in-house design team. They possess the expertise to customise an existing product to your exact specifications or embark on a fresh design journey to create a customized solution tailored to your requirements.

Our design professionals are dedicated to delivering exceptional results, ensuring that the final product not only meets but exceeds your expectations. When you collaborate with our team, you open the door to a world of possibilities, where innovation and creativity converge to bring your vision to life.

Whether it’s modifying an existing product or crafting an entirely new one, our design experts are committed to providing you with a comprehensive, end-to-end solution that perfectly suits your needs. Your satisfaction is our top priority, and we’re here to turn your ideas into reality.

 

Design | Develop | Test | Manufacture

With over three decades of experience in designing custom industrial and embedded computer and display solutions across a wide array of industries, we’re here to turn your ideas into reality

 

Here’s a selection of our design, manufacturing & associated services: –

Design to Order Banner

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a brand-new product from scratch or working with an existing prototype.

Build to Order Banner

Build to Order: Embedded Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

Embedded Software Banner

Embedded Software Services : Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

Manufacturer : DFI

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