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3.5" Single Board Computers

  • MF04 Full

    Jetway MF04-03 Series J6412 Elkhart Lake 3.5″ SBC

    • Product Name: Jetway MF04-03 Series
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: Intel Elkhart Lake SoC Processor
    • RAM: 2* DDR4 3200MHz SO-DIMM up to 32GB
    • Expansion: 1* M.2 E-key 2230, 1* M.2 B-key 3042 W/SIM card slot, 1* M.2 M-key 2242/2280, 1* SATAIII (6Gb/s); 32GB eMMC (default)
    • Other features: 1* Intel i211AT GbE, 1* Intel i225LM 2.5GbE, 2* HDMI2.0b, 1* eDP (co-layout LVDS), 2* COM, 3* USB3.1 (Gen.2), 5* USB2.0, Support 12~24V DC-in
  • MF04 Full

    Jetway MF04-33 Series N6210 Elkhart Lake 3.5″ SBC

    • Product Name: Jetway MF04-33 Series
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: Intel Elkhart Lake SoC Processor
    • RAM: 2* DDR4 3200MHz SO-DIMM up to 32GB
    • Expansion: 1* M.2 E-key 2230, 1* M.2 B-key 3042 W/SIM card slot, 1* M.2 M-key 2242/2280, 1* SATAIII (6Gb/s); 32GB eMMC (default)
    • Other features: 1* Intel i211AT GbE, 1* Intel i225LM 2.5GbE, 2* HDMI2.0b, 1* eDP (co-layout LVDS), 2* COM, 3* USB3.1 (Gen.2), 5* USB2.0, Support 12~24V DC-in
  • 3I110HW 1

    LEX 3I110HW / 3I110BW 11th Gen Tiger Lake i7/i5/i3 3.5″ Embedded SBC

    • Product Name: Lex 3I110HW / 3I110BW
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: 11th Gen Intel Tiger Lake-UP3, i7 / i5 / i3 / Celeron
    • RAM: 2 x DDR4 SODIMM (Max. 64GB)
    • Expansion: 1 x M.2 B Key, 1 x M.2 M Key, 1 x Mini PCIe, 1 x SIM
    • Other features: Multiple Independent display: VGA, HDMI (or DP), eDP or LVDS, 3 x Intel GbE LAN, 6 x USB 2.0, 4 x COM, 4DI / 4DO, TPM 2.0, Battery Charger Function (3I110BW), OEM Option: DP (Type C), 1 x USB 3.0 (type C)
  • LE 37P 2D8

    Commell LE-37P iCore / Celeron / Xeon Tiger Lake 3.5″ SBC

    • Product Name: Commell LE-37P
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: iCore / Celeron / Xeon Tiger Lake
    • RAM: 1 x 260-pin DDR4 3200 MHz SO-DIMM up to 32GB (Support Non-ECC, unbuffered memory)
    • Expansion: 1 x MiniPCIe socket (support mSATA), 1 x M.2 (Key E 2230) and 2 x M.2 (Key M 2280) for NVMe, 1 x SIM slot
    • Other features: 6 x USB3.2 Gen2, 2 x SATA3, Dual Gigabit Ethernet, 2 x RS232 ports, 2 x RS232/422/485 ports, 2 x USB2.0 ports, Intel High Definition Audio.
  • MF05 Full

    Jetway MF05 Series Tiger Lake 3.5″ SBC

    • Product Name: Jetway MF05 Series
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: Intel Tiger Lake-UP3 SoC Processor (TDP 12~28W)
    • RAM: 2* DDR4-3200MHz SO-DIMM up to 64GB
    • Expansion: 1* M.2 M-key 2242/2280, PCIe 4.0 x4 interface support NVME; 1* M.2 E-key 2230, USB2.0/PCIe x1 interface support CNVi
    • Other features: 1* Intel i219-LM 1.0GbE, 1* Intel i225-LM 2.5GbE; 2* HDMI, 2* DisplayPort, 1* eDP, 1* LVDS; 4* COM (COM1/COM2 support RS232/422/485), 4* USB3.2 (Gen.2), 4* USB2.0; MF05-22: Onboard TPM 2.0 (option)
  • 3I110HW 1

    Lex 3I110HW Embedded 11th Gen Tiger Lake 3.5″ SBC

    • Product Name: Lex 3I110HW
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: 11th Gen Intel Tiger Lake-UP3 – i7 / i5 / i3 / Celeron
    • RAM: 2 x DDR4 SODIMM (Max. 64GB)
    • Expansion: Multiple Independent display: VGA, HDMI, DP, DP (Type C), eDP or LVDS; 3 x Intel GbE LAN, 1 x USB 3.0 (type C), 6 x USB 2.0; 4 x COM, 4DI / 4DO, 1 x Mini PCIe, 1 x SIM; 1 x M.2 B Key, 1 x M.2 M Key
    • Other features: TPM 2.0 (Optional), Battery Charger Function (3I110BW)
  • AL553F190326 RAw600

    DFI AL553 Intel Atom E3900 3.5″ SBC

    • Product Name: DFI AL553
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: Intel Atom E3900
    • RAM: 1 DDR3L SODIMM up to 8GB
    • Expansion: Three independent displays: VGA + LVDS + HDMI; Multiple expansion: 1 M.2 B Key, 1 M.2 E Key, Mini PCIe
    • Other features: Rich I/O: 2 Intel GbE, 1 COM, 2 USB 3.1 Gen1, 4 USB 2.0; 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap)
  • LE 37O 2D8 1

    Commell LE-37O Tiger Lake Celeron 3.5″ SBC

    • Product Name: Commell LE-37O
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: Intel Tiger Lake UP3 Processor in the FCBGA1449 sockets
    • RAM: One DDR4 3200 MHz SO-DIMM up to 32 GB, support Non-ECC, unbuffered memory
    • Expansion: LVDS interface: Onboard 18/24-bit single/dual channel LVDS connector with +3.3V/+5V/+12V supply; Display port interface: Onboard Display port connector; HDMI interface: Onboard HDMI connector; VGA interface: Onboard VGA connector
    • Other features: LAN Interface: 1 x Intel i219-LM Gigabit PHY LAN (Support iAMT 15.0), 1 x Intel i225-LM Gigabit LAN (up to 2.5GbE)
  • LE 37O 2D8 1

    Commell LE-37O 3.5″ Tiger Lake i7 SBC

    • Product Name: Commell LE-37O
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: Intel Tiger Lake UP3 Processor in the FCBGA1449 sockets
    • RAM: One DDR4 3200 MHz SO-DIMM up to 32 GB, support Non-ECC, unbuffered memory
    • Expansion: LVDS interface: Onboard 18/24-bit single/dual channel LVDS connector with +3.3V/+5V/+12V supply; Display port interface: Onboard Display port connector; HDMI interface: Onboard HDMI connector; VGA interface: Onboard VGA connector
    • Other features: LAN Interface: 1 x Intel i219-LM Gigabit PHY LAN(Support iAMT 15.0), 1 x Intel i225-LM Gigabit LAN (up to 2.5GbE)
  • AL551 F 070824RAw600

    DFI AL551 Intel Atom E3900 3.5″ SBC

    • Product Name: DFI AL551
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: Intel Atom E3900
    • RAM: 1 DDR3L SODIMM up to 8GB
    • Expansion: Three independent displays: VGA + LVDS + DP++; Wireless communication: mini PCIe
    • Other features: Rich I/O: 2 Intel GbE, 2 COM, 2 USB 3.0, 4 USB 2.0; 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap)
  • GH551F200130R1 W600

    DFI GH551 AMD Ryzen V1000/R1000 Series 3.5″ SBC

    • Product Name: DFI GH551
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: AMD Ryzen V1000/R1000 Series
    • RAM: 1 DDR4 2400MHz SODIMM up to 16GB
    • Expansion: Multiple displays: max. 4 DP++/3 DP++ + LVDS; Multiple Expansion: 1 M.2 M Key, 1 Mini PCIe
    • Other features: Rich I/O: 3 GbE, 2 USB 3.1 Gen2, 1 USB 2.0; 10-Year CPU Life Cycle Support Until Q1′ 31 (Based on AMD Roadmap)
  • CS551B191017R1w600

    DFI CS551 Intel 8th/9th Gen Coffee Lake iCore 3.5″ SBC

    • Product Name: DFI CS551 3.5″ SBC
    • Motherboard Form Factor: 3.5″
    • CPU: 9th/8th Gen Intel Core with Intel C246
    • RAM: 1 DDR4 SODIMM up to 32GB
    • Expansion: Three independent displays: LVDS + DP++ + DP++; Multiple expansion: 1 M.2 M Key, 1 Mini PCIe
    • Other features: DP++ resolution up to 4096×2304 @ 60Hz; Rich I/O: 2 Intel GbE, 4 USB 3.1, 2 USB 2.0; 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on Intel IOTG Roadmap)
  • WL551 Front060520 R1 w600

    DFI WL551 Intel 8th Gen Whiskey Lake iCore 3.5″ SBC

    • Product Name: DFI WL551
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: 8th Gen Intel Core Processor
    • RAM: Not specified
    • Expansion: Dual independent displays: DP + HDMI, 1 LVDS or eDP (opt.); Multiple Expansion: 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
    • Other features: 4K High Resolution: Supports 4K/2K resolution; Rich I/O 1: 3 Intel GbE, 1 COM, 4 USB 3.1 Gen2, 2 USB 2.0; 15-Year CPU Life Cycle Support Until Q2′ 35 (Based on Intel IOTG Roadmap)
  • 3I370DW H b1

    LEX 3I370DW 8th/9th Gen iCore 5xGbE 3.5″ SBC

    • Product Name: Lex 3I370DW
    • Motherbaord Form Factor: 3.5” SBC
    • CPU: 8th Gen Intel Whiskey Lake-U (i7 / i5 / i3 / Pentium / Celeron)
    • RAM: On board 8GB DDR4 + 1 x DDR4 SODIMM (Max.16GB)
    • Expansion: Multiple Independent display: VGA, HDMI, LVDS; 3 x Intel GbE LAN, 3 x USB 3.0, 4 x USB 2.0; 6 x COM, 16DI / 16DO, 1 x Mini PCIe, 1 x SIM; 1 x M.2 B Key
    • Other features: TPM 2.0 (Optional); Battery Charger Function
  • SBC 230(L1)

    ASRock Industrial SBC-230 Embedded Intel Apollo Lake 3.5″ SBC

    • Product Name: Asrock SBC-230
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: BGA1296 for Intel Apollo Lake SoC
    • RAM: Supports Dual Channel DDR3L 1867MHz, 2 x SO-DIMM, up to 16GB system memory
    • Expansion: 1 x Mini-PCIe, 1 x Mini-PCIe / mSATA Colay
    • Other features: 1 x VGA, 1 x HDMI, 1 x LVDS or eDP (Jumper Switch), 2 x USB 3.0, 4 x USB 2.0, 1 x SATA3, Gigabit LAN: 2 x Intel LAN, 1 x TPM Header, 9V~36V DC-in (4-pin PWR Con)