DFI M8MP553 NXP i.MX 8M 3.5″ SBC
DFI M8MP553 – 3.5″ SBC, NXP i.MX 8M Plus Series, 1 DDR4, 1 M.2 B key, 1 M.2 E key, 1 Nano SIM slot, 1 uSD slot, 1 HDMI, 1 LVDS, 2 LAN, 3 COM, 1 I2C, 2 CANBus, 1 Camera CSI, 9~36V, Fanless
Description
- NXP i.MX8M plus Processors: 30% performance enhancement
- Wide Voltage Support 9~36VDC
- 2 GbE LAN for automation application
- CANbus for automation equipment integration
- M.2 2230/3052: 1 M.2 B key for PCIe
- 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on NXP Roadmap)
Specification
System |
Processor |
i.MX 8M plus applications processors |
MIMX8ML6DVNLZAB (Commercial), Quad 1.8GHz ,VPU/ISP , 0~90°C |
MIMX8ML3DVNLZAB (Commercial), Dual 1.8GHz ,VPU/ML/ISP/CAN FD , 0~90°C |
MIMX8ML6CVNKZAB (Industrial), Quad 1.6GHz ,VPU/ISP/CAN FD ,-40~105°C (Coming soon) |
MIMX8ML3CVNKZAB (Industrial), Dual 1.6GHz ,VPU/ML/ISP/CAN FD ,-40~105°C (Coming soon) |
Memory |
2GB/4GB LPDDR4 Memory Down |
Graphics |
Controller |
GC7000UL |
Feature |
HW Decode: 1080p60 H.265,H.264, VP9, VP8 |
HW Endcode: 1080p60 H.265,H.264 |
Display |
1 x HDMI, resolution up to 1920×1080 @60Hz |
1 x LVDS, resolution up to 1920×1200 @60Hz |
Dual Displays |
LVDS + HDMI |
Andriod:support single output |
Storage |
eMMC |
1 x eMMC 5.1 with default 16GB (up to 64GB) |
Expansion |
Interface |
1 x M.2 B key 3052/2242 (USB 3.1 Gen2/USB 2.0/PCIe x1) |
1 x M.2 E key 2230 (PCIe x1/USB 2.0) |
1 x Nano SIM slot (opt.) |
Audio |
Audio Codec |
Audio codec SGTL5000 |
Ethernet |
PHY |
AR8035 |
Rear I/O |
Ethernet |
2 x GbE (RJ-45) |
Serial |
1 x RS485 (2-wire) |
USB |
2 x USB 3.1 Gen1 |
2 x USB 2.0 |
Display |
1 x HDMI |
Internal I/O |
Serial |
1 x RS232 |
1 x RS232/422/485 (2.0mm pitch) |
USB |
2 x USB 2.0 (2.00mm pitch, the 2nd USB is opt. from M.2 3052) |
1 x Micro USB OTG |
Display |
1 x LVDS LCD Panel connector |
1 x LCD/Intverter Power |
Audio |
1 x Audio (Line-out/Mic-in) |
DIO |
1 x 8-bit DIO |
SD |
1 x uSD card |
CANBus |
2 x CAN bus 2.0b on Industrial CPU sku |
I2C |
1 x I2C |
1 x PWM |
Watchdog Timer |
Output & Interval |
System Reset, Programmable via Software from 1 to 255 Seconds |
Power |
Type |
Wide Range 9~36VDC |
Connector |
2-pole terminal block (default) |
Co-lay 4-pin vertical power connector |
Consumption |
TBD |
Battery |
CR2032 Coin Cell |
OS Support |
Linux |
Linux Yocto 3.0 (default) |
Software |
Android 10 |
Environment |
Temperature |
Operating: -5 to 65°C, -30 to 80 °C |
Storage: -40 to 85°C |
Humidity |
Operating: 5 to 90% RH |
Storage: 5 to 90% RH |
MTBF |
TBD |
Mechanism |
Dimensions |
3.5″ SBC Form Factor |
146mm (5.75″) x 102mm (4.02″) |
Height |
PCB: TBD |
Top Side: TBD |
Bottom Side: TBD |
Standards and Certifications |
Certifications |
CE, FCC, RoHS |
Packing List |
Packing List |
1 M8MP553 board |
1 Terminal block for RS485 (COM3) 342-361021-000G |
1 Heatsink (Height: 21mm) A71-008168-000G |
Country of Origin |
Country of Origin |
Taiwan |
Related
Datasheet
DownloadIf you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can design a new product from start to finish.
Design | Develop | Test | Manufacture
Here’s a selection of our design, manufacturing
& associated services: –
Design to Order: OEM/ODM Embedded Product Design Services
For customers designing a brand-new product from scratch or working with an existing prototype.
- FREE Pre-design / Pre-sales advise
- Prototyping – Custom PC Design, Custom Panel PC, Custom Racks or Custom Peli Case PCs
- Prototyping pre checks (chargeable one-time fee for existing prototype)
- Hardware compatibility
- Thermal testing
- Software compatibility
- Custom PCB / Board Design
- Custom Chassis Design
- Custom Cables
- Custom Back Panels and Faceplates
- Custom Cooling
- Custom Metal Work (internal brackets, mounting brackets)
- Touchscreen Integration and Display Enhancements
- Software – Custom OS Image
Build to Order: Embedded Computer Design and Customisation Services
Take an existing system and we can:
- Custom specification (CPU, Ram, I/O, Storage)
- Chassis customisation and branding
- Custom BIOS
- Software – Custom OS Image
- Custom Packaging and branding
- Integrating newly designed or existing hardware into a larger system
Build to order Racks and Towers, Peli Case PCs and Mini-ITX PCs
Embedded Software Services : Configuration, Integration and Deployment
Porting, Integration & Deployment
- Windows image capture from customers HDD
- Linux image capture from customers HDD
- Windows / Linux Deployment from customers image
- Custom Windows images, create and deploy
- Update management
- Custom Linux and Android images?
- Custom BIOS
Related
Manufacturer : DFI
Motherboard
- Form Factor : 3.5 SBC
CPU
- Powered By : ARM
- CPU Family : ARM
- CPU Generation : ARM Cortex
- CPU Model :
- CPU Speed : 1.6Ghz, 1.8Ghz
- CPU Cores : Dual Core, Quad Core
Memory
- Memory Installed : 2Gb, 4Gb
- Memory Slots :
- Memory Type :
I/O and Expansion
- Expansion Slots : M.2
- LAN Ports : 2
- Serial Ports : 1
- USB 2 Ports : 2
- USB 3 Ports :
- USB 3.1 Ports : 2
- Video Output : HDMI, LVDS
- Multi Display : Dual Display
- Wireless Connectivity :
Operating System
- OS : Android, Linux
Certifications
- Certifications :
Industry
- Industry :
Features
- 24/7 Use :
- 4G-GPS : Yes
- Artificial Intelligence Use : Artificial Intelligence, Edge Computing, Machine Learning, Machine Vision
- ATEX :
- High Performance :
- Industrial :
- In-Vehicle :
- IoT : Yes
- IP Rating :
- Low Powered :
- Mini-ITX :
- Multi Displays : Dual
- NUC :
- Other Features : CANBus, GPIO
- PoE :
- Rugged : Yes
- Ryzen :
- System Type : SBC
- Touchscreen :
- Whiskey Lake :
- Wide Temp : Yes
Categories : 3.5" Embedded SBCs