DFI M8MP553 NXP i.MX 8M 3.5″ SBC

  • Product Name: DFI M8MP553
  • Motherboard Form Factor: 3.5″ SBC
  • CPU: NXP i.MX8M plus Processors
  • RAM: 2GB/4GB LPDDR4
  • Expansion: M.2 2230/3052: 1 M.2 B key for PCIe
  • Other features: 2 GbE LAN for automation application, CANbus for automation equipment integration, 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on NXP Roadmap)
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Description

  • NXP i.MX8M plus Processors: 30% performance enhancement
  • Wide Voltage Support 9~36VDC
  • 2 GbE LAN for automation application
  • CANbus for automation equipment integration
  • M.2 2230/3052: 1 M.2 B key for PCIe
  • 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on NXP Roadmap)

Specification

System

Processor
i.MX 8M plus applications processors
MIMX8ML6DVNLZAB (Commercial), Quad 1.8GHz ,VPU/ISP , 0~90°C
MIMX8ML3DVNLZAB (Commercial), Dual 1.8GHz ,VPU/ML/ISP/CAN FD , 0~90°C
MIMX8ML6CVNKZAB (Industrial), Quad 1.6GHz ,VPU/ISP/CAN FD ,-40~105°C (Coming soon)
MIMX8ML3CVNKZAB (Industrial), Dual 1.6GHz ,VPU/ML/ISP/CAN FD ,-40~105°C (Coming soon)
Memory
2GB/4GB LPDDR4 Memory Down

Graphics

Controller
GC7000UL
Feature
HW Decode: 1080p60 H.265,H.264, VP9, VP8
HW Endcode: 1080p60 H.265,H.264
Display
1 x HDMI, resolution up to 1920×1080 @60Hz
1 x LVDS, resolution up to 1920×1200 @60Hz
Dual Displays
LVDS + HDMI
Andriod:support single output

Storage

eMMC
1 x eMMC 5.1 with default 16GB (up to 64GB)

Expansion

Interface
1 x M.2 B key 3052/2242 (USB 3.1 Gen2/USB 2.0/PCIe x1)
1 x M.2 E key 2230 (PCIe x1/USB 2.0)
1 x Nano SIM slot (opt.)

Audio

Audio Codec
Audio codec SGTL5000

Ethernet

PHY
AR8035

Rear I/O

Ethernet
2 x GbE (RJ-45)
Serial
1 x RS485 (2-wire)
USB
2 x USB 3.1 Gen1
2 x USB 2.0
Display
1 x HDMI

Internal I/O

Serial
1 x RS232
1 x RS232/422/485 (2.0mm pitch)
USB
2 x USB 2.0 (2.00mm pitch, the 2nd USB is opt. from M.2 3052)
1 x Micro USB OTG
Display
1 x LVDS LCD Panel connector
1 x LCD/Intverter Power
Audio
1 x Audio (Line-out/Mic-in)
DIO
1 x 8-bit DIO
SD
1 x uSD card
CANBus
2 x CAN bus 2.0b on Industrial CPU sku
I2C
1 x I2C
1 x PWM

Watchdog Timer

Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds

Power

Type
Wide Range 9~36VDC
Connector
2-pole terminal block (default)
Co-lay 4-pin vertical power connector
Consumption
TBD
Battery
CR2032 Coin Cell

OS Support

Linux
Linux Yocto 3.0 (default)
Software
Android 10

Environment

Temperature
Operating: -5 to 65°C, -30 to 80 °C
Storage: -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
TBD

Mechanism

Dimensions
3.5″ SBC Form Factor
146mm (5.75″) x 102mm (4.02″)
Height
PCB: TBD
Top Side: TBD
Bottom Side: TBD

Standards and Certifications

Certifications
CE, FCC, RoHS

Packing List

Packing List
1 M8MP553 board
1 Terminal block for RS485 (COM3) 342-361021-000G
1 Heatsink (Height: 21mm) A71-008168-000G

Country of Origin

Country of Origin
Taiwan

Datasheet

Download

BVM Customisation Service

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish.

 

If you’re unable to find an off-the-shelf product that meets your specific requirements, don’t hesitate to contact our in-house design team. They possess the expertise to customise an existing product to your exact specifications or embark on a fresh design journey to create a customized solution tailored to your requirements.

Our design professionals are dedicated to delivering exceptional results, ensuring that the final product not only meets but exceeds your expectations. When you collaborate with our team, you open the door to a world of possibilities, where innovation and creativity converge to bring your vision to life.

Whether it’s modifying an existing product or crafting an entirely new one, our design experts are committed to providing you with a comprehensive, end-to-end solution that perfectly suits your needs. Your satisfaction is our top priority, and we’re here to turn your ideas into reality.

 

Design | Develop | Test | Manufacture

With over three decades of experience in designing custom industrial and embedded computer and display solutions across a wide array of industries, we’re here to turn your ideas into reality

 

Here’s a selection of our design, manufacturing & associated services: –

Design to Order Banner

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a brand-new product from scratch or working with an existing prototype.

Build to Order Banner

Build to Order: Embedded Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

Embedded Software Banner

Embedded Software Services : Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

Manufacturer : DFI

Motherboard

  • Form Factor : 3.5 SBC

CPU

  • Powered By : ARM
  • CPU Family : ARM
  • CPU Generation : ARM Cortex, i.MX8
  • CPU Model : i.MX 8M Plus

Memory

  • Memory Installed : 2Gb, 4Gb
  • Memory Slots :
  • Memory Type :

I/O and Expansion

  • Expansion Slots : M.2
  • LAN Ports : 2
  • Serial Ports : 1
  • USB 2 Ports : 2
  • USB 3 Ports :
  • USB 3.X / USB C / USB 4.0 Ports :
  • Video Output : HDMI, LVDS
  • Multi Display : Dual Display

Operating System

  • OS : Android, Linux

Certifications

  • Certifications :

Features

  • 5G-4G-GPS : Yes
  • Artificial Intelligence Use : Artificial Intelligence, Edge Computing, Machine Learning, Machine Vision
  • IP Rating :
  • Rugged : Yes
  • System Type : SBC
  • Wide Temp : Yes

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