DFI M8MP553 NXP i.MX 8M 3.5″ SBC

DFI M8MP553 – 3.5″ SBC, NXP i.MX 8M Plus Series, 1 DDR4, 1 M.2 B key, 1 M.2 E key, 1 Nano SIM slot, 1 uSD slot, 1 HDMI, 1 LVDS, 2 LAN, 3 COM, 1 I2C, 2 CANBus, 1 Camera CSI, 9~36V, Fanless

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Description

  • NXP i.MX8M plus Processors: 30% performance enhancement
  • Wide Voltage Support 9~36VDC
  • 2 GbE LAN for automation application
  • CANbus for automation equipment integration
  • M.2 2230/3052: 1 M.2 B key for PCIe
  • 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on NXP Roadmap)

Specification

System

Processor
i.MX 8M plus applications processors
MIMX8ML6DVNLZAB (Commercial), Quad 1.8GHz ,VPU/ISP , 0~90°C
MIMX8ML3DVNLZAB (Commercial), Dual 1.8GHz ,VPU/ML/ISP/CAN FD , 0~90°C
MIMX8ML6CVNKZAB (Industrial), Quad 1.6GHz ,VPU/ISP/CAN FD ,-40~105°C (Coming soon)
MIMX8ML3CVNKZAB (Industrial), Dual 1.6GHz ,VPU/ML/ISP/CAN FD ,-40~105°C (Coming soon)
Memory
2GB/4GB LPDDR4 Memory Down

Graphics

Controller
GC7000UL
Feature
HW Decode: 1080p60 H.265,H.264, VP9, VP8
HW Endcode: 1080p60 H.265,H.264
Display
1 x HDMI, resolution up to 1920×1080 @60Hz
1 x LVDS, resolution up to 1920×1200 @60Hz
Dual Displays
LVDS + HDMI
Andriod:support single output

Storage

eMMC
1 x eMMC 5.1 with default 16GB (up to 64GB)

Expansion

Interface
1 x M.2 B key 3052/2242 (USB 3.1 Gen2/USB 2.0/PCIe x1)
1 x M.2 E key 2230 (PCIe x1/USB 2.0)
1 x Nano SIM slot (opt.)

Audio

Audio Codec
Audio codec SGTL5000

Ethernet

PHY
AR8035

Rear I/O

Ethernet
2 x GbE (RJ-45)
Serial
1 x RS485 (2-wire)
USB
2 x USB 3.1 Gen1
2 x USB 2.0
Display
1 x HDMI

Internal I/O

Serial
1 x RS232
1 x RS232/422/485 (2.0mm pitch)
USB
2 x USB 2.0 (2.00mm pitch, the 2nd USB is opt. from M.2 3052)
1 x Micro USB OTG
Display
1 x LVDS LCD Panel connector
1 x LCD/Intverter Power
Audio
1 x Audio (Line-out/Mic-in)
DIO
1 x 8-bit DIO
SD
1 x uSD card
CANBus
2 x CAN bus 2.0b on Industrial CPU sku
I2C
1 x I2C
1 x PWM

Watchdog Timer

Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds

Power

Type
Wide Range 9~36VDC
Connector
2-pole terminal block (default)
Co-lay 4-pin vertical power connector
Consumption
TBD
Battery
CR2032 Coin Cell

OS Support

Linux
Linux Yocto 3.0 (default)
Software
Android 10

Environment

Temperature
Operating: -5 to 65°C, -30 to 80 °C
Storage: -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
TBD

Mechanism

Dimensions
3.5″ SBC Form Factor
146mm (5.75″) x 102mm (4.02″)
Height
PCB: TBD
Top Side: TBD
Bottom Side: TBD

Standards and Certifications

Certifications
CE, FCC, RoHS

Packing List

Packing List
1 M8MP553 board
1 Terminal block for RS485 (COM3) 342-361021-000G
1 Heatsink (Height: 21mm) A71-008168-000G

Country of Origin

Country of Origin
Taiwan

Datasheet

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If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can design a new product from start to finish.

 

Design | Develop | Test | Manufacture

Here’s a selection of our design, manufacturing

& associated services: –

 

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a brand-new product from scratch or working with an existing prototype.DesignToOrder

Build to Order: Embedded Computer Design and Customisation Services​

Take an existing system and we can:BuildToOrder

  • Custom specification (CPU, Ram, I/O, Storage)
  • Chassis customisation and branding
  • Custom BIOS
  • Software – Custom OS Image
  • Custom Packaging and branding
  • Integrating newly designed or existing hardware into a larger system

Build to order Racks and Towers, Peli Case PCs and Mini-ITX PCs

Embedded Software Services : Configuration, Integration and Deployment

Porting, Integration & DeploymentEmbeddedSoftware

  • Windows image capture from customers HDD
  • Linux image capture from customers HDD
  • Windows / Linux Deployment from customers image
  • Custom Windows images, create and deploy
  • Update management
  • Custom Linux and Android images?
  • Custom BIOS

Manufacturer : DFI

Motherboard

  • Form Factor : 3.5 SBC

CPU

  • Powered By : ARM
  • CPU Family : ARM
  • CPU Generation : ARM Cortex
  • CPU Model :
  • CPU Speed : 1.6Ghz, 1.8Ghz
  • CPU Cores : Dual Core, Quad Core

Memory

  • Memory Installed : 2Gb, 4Gb
  • Memory Slots :
  • Memory Type :

I/O and Expansion

  • Expansion Slots : M.2
  • LAN Ports : 2
  • Serial Ports : 1
  • USB 2 Ports : 2
  • USB 3 Ports :
  • USB 3.1 Ports : 2
  • Video Output : HDMI, LVDS
  • Multi Display : Dual Display
  • Wireless Connectivity :

Operating System

  • OS : Android, Linux

Certifications

  • Certifications :

Industry

  • Industry :

Features

  • 24/7 Use :
  • 4G-GPS : Yes
  • Artificial Intelligence Use : Artificial Intelligence, Edge Computing, Machine Learning, Machine Vision
  • ATEX :
  • High Performance :
  • Industrial :
  • In-Vehicle :
  • IoT : Yes
  • IP Rating :
  • Low Powered :
  • Mini-ITX :
  • Multi Displays : Dual
  • NUC :
  • Other Features : CANBus, GPIO
  • PoE :
  • Rugged : Yes
  • Ryzen :
  • System Type : SBC
  • Touchscreen :
  • Whiskey Lake :
  • Wide Temp : Yes

Categories :