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Rugged Computing Solutions - Shock, Vibration and Wide Temperature

  • OF USBc Display 1

    Winmate 7 – 15″ Open Frame USB C Industrial Touch Display Series

    • Product Name: Winmate Open Frame USB C Industrial Touch Display Series
    • Screen Size: 7″ to 15″
    • Resolution: 1024 x 600, 1280 x 800, 1024 x 768
    • Features: USB Type-C connectivity, open frame design for flexibility, VESA mount compatibility, and PCAP touch technology for intuitive interaction
    This product has multiple variants. The options may be chosen on the product page
  • IP65 Resistive Chassis Display 1

    Winmate 8.4 – 55″ IP65 Stainless Steel Resistive Touchscreen Monitor Series

    • Product Name: Winmate IP65 Stainless Resistive Touchscreen Monitors
    • Screen Size and Resolution: 8.4″: 800 x 600, 10.4″: 1024 x 768, 15″: 1024 x 768, 17″: 1280 x 1024, 19″: 1280 x 1024, 21.5″, 23.8″, 32″, 42″, 43″: 1920 x 1080, 55″: 3840 x 2160
    • Features: Support VESA / YOKE mount / Chassis, Stainless housing SUS 316 / AISI 316, Full IP65 waterproof and dustproof, Optical bonding (optional)
    This product has multiple variants. The options may be chosen on the product page
  • IEP 5000G 1

    ASRock Industrial iEP-5000G Elkhart Lake Rugged IoT Controller

    • Product Name: Asrock iEP-5000G
    • System Type: Rugged Industrial IoT Controller
    • CPU: Latest and Powerful Intel Atom x6000E Processor
    • RAM: 2 x DDR4 3200MHz SO-DIMM, up to 32GB (In-Band ECC)
    • Expansion: Most Flexible IOs and Expansion for Industrial Applications
    • Other features: Fan-less and Rugged Design, Wide Temperature Operation (-40 °C to 70 °C), 6-36VDC Wide Range Power Inputs, Intel TCC and TSN Support for Real-Time Computing, DIN Rail or Wall Mount Options
  • IEP 5000G 1

    ASRock Industrial iEP-5002G Elkhart Lake Rugged IoT Controller

    • Product Name: Asrock iEP-5002G
    • System Type: Rugged Industrial IoT Controller
    • CPU: Latest and Powerful Intel Atom x6000E Processor
    • RAM: 2 x DDR4 3200MHz SO-DIMM, up to 32GB (In-Band ECC)
    • Expansion: Most Flexible IOs and Expansion for Industrial Applications
    • Other features: Fan-less and Rugged Design, Wide Temperature Operation (-40 °C to 70 °C), 6-36VDC Wide Range Power Inputs, Intel TCC and TSN Support for Real-Time Computing, DIN Rail or Wall Mount Options
  • ED700 EHL side

    DFI ED700-EHL Elkhart Lake 5G Fanless Embedded System

    • Product Name: DFI ED700-EHL
    • System Type: Elkhart Lake 5G Fanless Embedded System
    • CPU: Intel Atom Processors X Series
    • RAM: One 260 pin DDR4 SODIMM up to 3200MHz
    • Expansion: Support 5G Sub-6 module, Support WiFi 6 module, Support Isolated COM & DIO
    • Other features: 4 LAN: Support 1 x 2.5GbE TSN, 3 x GbE LAN, Wide Operating Temperature: Support up to -40 ~ 70°C, 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on Intel IOTG Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • N11 Front45D

    Jetway N11 Series 11th Gen Tiger Lake NUC PC

    • Product Name: Jetway N11 Series
    • System Type: 11th Gen Tiger Lake NUC PC
    • CPU: Intel 11th Gen Tiger Lake-UP3 SoC Processor
    • RAM: 2 x DDR4 3200MHz SO-DIMM up to 64GB
    • Expansion: 1 x M.2 M-key 2242/2280 PCIe4.0 x4/SATAIII interface for NVMe functionality, 1 x  2.5” SATA drive bay, 3 x internal M.2 expansion slots for various applications
    • Other features: 1 x Intel i219-LM GbE, 1 x Intel i225-V 2.5GbE, 2 x HDMI 2.0b, 2 x DP1.4, Rich and complete connection interface, supports 4 sets of 4K HDR output, Supports Windows 11 and Linux
    This product has multiple variants. The options may be chosen on the product page
  • HBFDF05 Front45D com

    Jetway HBFDF05 Series Tiger Lake Embedded Mini PC

    • Product Name: Jetway HBFDF05
    • System Type: Tiger Lake Embedded Box PC
    • CPU: Intel Tiger Lake-UP3 SoC Processor (TDP 15W)
    • RAM: 2* SO-DIMM DDR4-3200MHz up to 64GB
    • Expansion: 2* USB2.0, 4* USB3.2, 2* HDMI, 2* DP, 2* RJ45, 1Audio
    • Other features: Support 4 4K HDR Displays or 1* 8K SDR Displays, DC-12V_60W Adapter
    This product has multiple variants. The options may be chosen on the product page
  • ITG 100AI 1

    IEI ITG-100AI Fanless Ultra Compact Size AI Embedded System

    • Product Name: IEI ITG-100AI
    • System Type: Fanless Ultra Compact Size AI Embedded System
    • CPU: Intel Atom x5-E3930 1.3GHz (up to 1.8 GHz)
    • RAM: 1x 204-pin DDR3L SO-DIMM slot pre-installed with 8 GB memory
    • Expansion: M.2 A-key slot for WiFi Module
    • Other features: Two GbE LAN ports, Two RS-232/422/485, Pre-installed Mustang-MPCIE-MX2, 2 x Intel Myriad X VPU for AI deep learning workload consolidation
  • IDS 310AI 1

    IEI IDS-310AI Fanless Ultra Compact AI System

    • Product Name: IEI IDS-310AI
    • System Type: Fanless Ultra Compact Size AI System
    • CPU: Intel Celeron J3455 1.5GHz (up to 2.3GHz, quad-core, TDP 10W)
    • RAM: 1 x 204-pin DDR3L SO-DIMM, 8 GB pre-installed
    • Expansion: M.2 A-key slot for expansion
    • Other features: Two GbE LAN ports, Triple USB 3.2 Gen1, Pre-installed a Mustang-MPCIE-MX2 that has two Intel Myriad X VPUs for AI deep learning workload consolidation
  • PALM 3A100DW R 1

    LEX PALM-3A100DW-R AMD Ryzen Embedded Computer

    • Product Name: Lex PALM-3A100DW-R
    • System Type: AMD Ryzen Embedded Computer
    • CPU: AMD Ryzen Embedded R1000 Series SoC
    • RAM: 2 x DDR4 2400 MHz SODIMM, Max. 32GB
    • Expansion: 2 x HDMI, 1 x DP, 3 x GbE, 4 x USB, 8DI / 8DO, 2 x COM, 1 x Mini PCIe, 2 x SIM, 1 x M.2
    • Other features: With Independent Three 4K Display
  • PALM 3A100DW V 1

    LEX PALM-3A100DW-V AMD Ryzen Embedded Computer

    • Product Name: Lex PALM-3A100DW-V
    • System Type: AMD Ryzen Embedded Computer
    • CPU: AMD Ryzen Embedded V1000 Series SoC
    • RAM: 2 x DDR4 2400 MHz SODIMM, Max. 32GB
    • Expansion: 2 x HDMI, 2 x DP, 3 x GbE, 4 x USB, 8DI / 8DO, 2 x COM, 1 x Mini PCIe, 2 x SIM, 2 x M.2
    • Other features: With Independent Four 4K Display
    This product has multiple variants. The options may be chosen on the product page
  • APOLLO RS 3I370DW 1

    LEX APOLLO-RS 3I370DW 8th/9th Gen Fanless Embedded Computer

    • Product Name: Lex APOLLO-RS 3I370DW
    • System Type: Fanless Embedded Computer
    • CPU: Intel 8th/9th Gen Coffee Lake-S i7/i5/i3/Pentium/Celeron
    • RAM: 2 x DDR4 SODIMM socket, Max. 64GB
    • Expansion: DIO (optional), 1 x M.2 B Key, 1 x Mini PCIe, 2 x PCIe slot
    • Other features: Intel Q370 Chipset, Multiple Independent display: HDMI, DP, 5 x Intel GbE LAN, 4 x USB 3.1, 2~4 x COM
  • APOLLO S 3I370DW 1

    LEX APOLLO-S 3I370DW 8th/9th Gen Fanless Embedded Computer

    • Product Name: Lex APOLLO-S 3I370DW
    • System Type: Fanless Embedded Computer
    • CPU: Intel 8th/9th Gen Coffee Lake-S i7/i5/i3/Pentium/Celeron
    • RAM: 2 x DDR4 SODIMM socket, Max. 64GB
    • Expansion: DIO (optional), 1 x M.2 B Key, 1 x Mini PCIe
    • Other features: Intel Q370 Chipset, Multiple Independent display: HDMI, DP, 5 x Intel GbE LAN, 4 x USB 3.1, 2~4 x COM
  • TINOL CI370D 1

    LEX TINO CI370D 8th/9th Gen Fanless Embedded Computer

    • Product Name: Lex TINO CI370D
    • System Type: Fanless Embedded Computer
    • CPU: Intel 8th/9th Gen Coffee Lake-S i7/i5/i3/Pentium/Celeron
    • RAM: 2 x DDR4 SODIMM socket, Max. 64GB
    • Expansion: 1 x M.2 B Key, 2 x SIM, 2 x Mini PCIe
    • Other features: Intel Q370 Chipset, Multiple Independent display: HDMI, DP, 9 x Intel GbE LAN, 2 x SFP Fiber, 4 x USB 3.1, 2 x COM
  • EC500 CSSide200824 w600

    DFI EC500-CS 8th/9th Gen 5G Fanless Embedded System

    • Product Name: DFI EC500-CS
    • System Type: Fanless Embedded System
    • CPU: 8th/9th Gen Intel Core
    • RAM: Supports DDR4 SODIMM up to 64GB
    • Expansion: 3 M.2 slots support NVMe
    • Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Rich I/O connectivity: 2 GbE, 4 COM, 4 USB 3.1, 2 USB 2.0 (Q370 only), Support 5G Communication, Operating Temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)