CPU: Intel 13th/12th-Gen Core 35W/ 65W LGA1700 CPU
RAM: Up to 32GB non-ECC DDR4 3200 SDRAM (one SODIMM slot)
Expansion: 1xM.2 2280 Gen4x4 NVMe and 1x hot-swappable HDD tray for storage
Other features: 212 x 165 x 63 mm low-profile design, Rugged, -25°C to 60°C fanless operation, 4x 2.5GbE with optional PoE+ and 4x USB3.2 Gen 1 with screw-lock, 4-CH isolated DI and 4-CH isolated DO, VGA + DP dual display outputs, Optional ignition power control
This product has multiple variants. The options may be chosen on the product page
CPU: Intel Elkhart Lake Atom x6211E dual-core processor
RAM: Up to 32 GB DDR4-3200 SDRAM (one SODIMM slot)
Expansion: M.2 2280 M key SATA storage, One M.2 B key socket supporting 5G/4G 3042/3052 modules, One M.2 E key socket for WiFi 5/WiFi 6 modules
Other features: 52 x 89 x 112 mm extremely compact form factor, Rugged -25°C to 70°C fanless wide-temperature operation, Two GigE ports, two USB 3.1 Gen1 ports, and two USB 2.0 ports, One COM port with RS-232/422/485 modes and three RS-232 COM ports
This product has multiple variants. The options may be chosen on the product page
System Type: Ultra-compact Fanless Embedded Computer
CPU: Intel Elkhart Lake Atom x6425E quad-core 2.0GHz/3.0GHz 12W processor
RAM: Up to 32 GB DDR4-3200 SDRAM by one SODIMM socket
Expansion: M.2 2280 M key SATA interface, MezIO compatible
Other features: Rugged -25 °C to 70 °C fanless operation, 2x 2.5GbE PoE+ ports and 1x 2.5GbE port with screw-lock, 2x USB 3.1 Gen1 and 2x USB 2.0 ports with screw-lock, Dual DP display outputs supporting 4096 x 2160 resolution, Front I/O access DIN-mounting design
This product has multiple variants. The options may be chosen on the product page
CPU: Latest and Powerful Intel Atom x6000E Processor (Elkhart Lake-PU)
RAM: 2 x DDR4 3200MHz SO-DIMM, up to 32GB (In-Band ECC)
Expansion: Most Flexible IOs and Expansion for Industrial Applications
Other features: Fan-less and Rugged Design, Wide Temperature Operation (-40°C to 70°C), 6-36VDC Wide Range Power Inputs, Intel TCC and TSN Support for Real-Time Computing, DIN Rail or Wall Mount Options, 4 x Intel 1G LAN (2 Support IEEE 802.3AF PoE Ports), 1 x Intel 2.5G LAN, Support Intel IN-Band ECC
This product has multiple variants. The options may be chosen on the product page
System Type: 13th Gen Raptor Lake Rugged Industrial IoT Controller
CPU: Intel 13th Gen Core Embedded & Industrial Processors
RAM: Scalable power and performance in BGA for edge controller
Expansion: High performance Intel Iris Xe Graphics architecture
Other features: Fan-less and Rugged Design, Wide Temperature Operating (-40°C to 70°C), 9V ~ 36VDC Wide Range Power Inputs, Intel TCC and TSN Support for Real-Time Computing, 3 x Intel i226-IT LAN (Support vPro), 2 x Intel i210-AT LAN (Support IEEE 802.3AF PoE), Support Intel IN-Band ECC
This product has multiple variants. The options may be chosen on the product page
Other features: High AI computing performance for GPU-accelerated processing, Ideal for edge AI smart city applications, Supports one 15W GbE PoE for camera, Wide operating temperature from -30°C to +60°C, Supports JetPack, Supports Allxon Device Management Solutions (Allxon DMS)
Other features: High AI computing performance for GPU-accelerated processing, Ideal for intelligent edge applications, AGV, AMR, and computer vision, Wide operating temperature from -30°C to +50°C, Supports JetPack
Other features: Wide power input range of 9 to 36 VDC (ignition by option), Supports four PoE for GigE cameras and LiDAR connectivity, -30°C to +60°C operating temperature range, Supports device management and optional out-of-band service powered by Allxon, Optional SerDes FPD-LINK III
Expansion: 1 x M.2 M Key, 1 x M.2 B Key, 1 x M.2 E key
Other features: 4 x USB 3.2, 2 x USB 2.0, 4 x RS232 / RS422 / RS485, 2 x GLAN, 1 x HDMI, 1 x DP, GPIO 16 bits, Wall Mount / DIN Rail installation, IIoT gateway, Wide Temperature (optional)
This product has multiple variants. The options may be chosen on the product page
CPU: Latest and Powerful Intel Atom x6000E Processor
RAM: 2 x DDR4 3200MHz SO-DIMM, up to 32GB (In-Band ECC)
Expansion: Most Flexible IOs and Expansion for Industrial Applications
Other features: Fan-less and Rugged Design, Wide Temperature Operation (-40 °C to 70 °C), 6-36VDC Wide Range Power Inputs, Intel TCC and TSN Support for Real-Time Computing, DIN Rail or Wall Mount Options
CPU: Latest and Powerful Intel Atom x6000E Processor
RAM: 2 x DDR4 3200MHz SO-DIMM, up to 32GB (In-Band ECC)
Expansion: Most Flexible IOs and Expansion for Industrial Applications
Other features: Fan-less and Rugged Design, Wide Temperature Operation (-40 °C to 70 °C), 6-36VDC Wide Range Power Inputs, Intel TCC and TSN Support for Real-Time Computing, DIN Rail or Wall Mount Options
System Type: Elkhart Lake 5G Fanless Embedded System
CPU: Intel Atom Processors X Series
RAM: One 260 pin DDR4 SODIMM up to 3200MHz
Expansion: Support 5G Sub-6 module, Support WiFi 6 module, Support Isolated COM & DIO
Other features: 4 LAN: Support 1 x 2.5GbE TSN, 3 x GbE LAN, Wide Operating Temperature: Support up to -40 ~ 70°C, 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on Intel IOTG Roadmap)
This product has multiple variants. The options may be chosen on the product page
Expansion: Support M.2 B key 3042/3052 5G-NR module
Other features: Triple Displays: 2 HDMI (4K@30Hz) + 1 VGA (2K@60Hz), Up to 4 LAN or 6 USB, 15-Year CPU Life Cycle Support Until Q3′ 35 (Based on Intel IOTG Roadmap)
This product has multiple variants. The options may be chosen on the product page
BVM Design and Manufacturing Services: The manufacturer behind the solutions you know
When a standard embedded design won’t suffice for what you need, you can always turn to BVM for help and use our custom design and manufacturing services.
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