Neousys POC-40 Elkhart Lake x6211E Extreme-compact Computer

Neousys POC-40 Elkhart Lake x6211E Extreme-compact Computer

Product Name: Neousys POC-40
System Type: Extreme-compact Embedded Computer
CPU: Intel Elkhart Lake Atom x6211E dual-core processor
RAM: Up to 32 GB DDR4-3200 SDRAM (one SODIMM slot)
Expansion: M.2 2280 M key SATA storage, One M.2 B key socket supporting 5G/4G 3042/3052 modules, One M.2 E key socket for WiFi 5/WiFi 6 modules
Other features: 52 x 89 x 112 mm extremely compact form factor, Rugged -25°C to 70°C fanless wide-temperature operation, Two GigE ports, two USB 3.1 Gen1 ports, and two USB 2.0 ports, One COM port with RS-232/422/485 modes and three RS-232 COM ports

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Description

The POC-40 from Neousys Technology is an extremely compact fanless computer with an external footprint measuring just 52 x 89 x 112 mm. The PC features and Intel Elkhart Lake Atom® processor and is designed for space-restricted applications such as factory data collection, rugged Edge computing and mobile gateways.

Utilising Intel’s 10nm technology manufacturing processes, the new Elkhart Lake Atom® x6211E dual-core processor can deliver up to 1.8 times the performance boost over the previous generations of Atom processor solutions. In comparison to POC-200, the POC-40 provides up to 1.9 times computing performance – but within half the footprint . The PC features standard I/O functionality in the form of 2 x Gigabit Ethernet ports, 4 x USB 3.1 Gen1/ 2.0 ports, 4 x COM ports and optional isolated digital I/O’s for industrial communication and control.

In addition, and by adopting dedicated M.2 B key and E key slots, the POC-40 can fully harness the bandwidth of 5G and WiFi 6 wireless communications to provide wide-area coverage and real-time data transmission for static and mobile gateway applications.

With a similar footprint as a PICO-ITX motherboard, the Neousys’ POC-40 is perfect for projects that require above par performance in an extremely compact package. Ideal for both Edge computing and gateway applications, the POC-40 is a low power consumption and lightweight fanless device that offers wide-temperature operation for harsh environments.

Key Features

Intel® Elkhart Lake Atom® x6211E dual-core processor
52 x 89 x 112 mm extremely compact form factor
Rugged -25°C to 70°C fanless wide-temperature operation
Two GigE ports, two USB 3.1 Gen1 ports and two USB2.0 ports
M.2 2280 M key SATA storage interface
One M.2 B key socket supporting 5G/ 4G 3042/ 3052 modules
One M.2 E key socket for WiFi 5/ WiFi 6 modules
One COM port with RS-232/ 422/ 485 modes and three RS-232 COM ports

Specification

System Core
Processor	Intel® Elkhart Lake Atom® x6211E dual-core 1.3GHz/ 3.0GHz 6W processor
Graphics	Integrated Intel® UHD Graphics
Memory	Up to 32 GB DDR4-3200 SDRAM (one SODIMM slot)
TPM	Supports fTPM 2.0
Panel I/O Interface
Ethernet	2x Gigabit Ethernet ports by Intel® I210 GbE controllers
USB	2x USB 3.1 Gen1 (5 Gbps) ports 2x USB 2.0 ports
Video Port	1x DisplayPort connector, supporting 4096 x 2160 resolution @ 60Hz
Serial Port	1x software-programmable RS-232/ 422/ 485 port (COM1) 3x 3-wire RS-232 ports (COM2/ COM3/ COM4)
Isolated Digital I/O	Optional 4-ch isolated digital input and 4-ch isolated digital output
Storage Interface
M.2 M key	1x M.2 2280 M key SATA interface

Internal Expansion Bus
M.2 B key	1x M.2 3042/ 3052 B key socket with internal SIM socket for 4G/ 5G module
M.2 E key	1x M.2 2230 E key socket for WiFi 5/ WiFi 6 module
Power Supply
DC Input	1x 4-pin pluggable terminal block for 12-20V DC input with optional ignition power control
Remote Control	1x 4-pin pluggable terminal block for remote control
Mechanical
Dimension	52 mm (W) x 89 mm (D) x 112 mm (H)
Weight	0.6kg
Mounting	DIN-rail mount (standard) or Wall-mount (optional)
Environmental
Operating Temperature	-25°C ~ 70°C
Storage Temperature	-40°C ~85°C
Humidity	10%~90% , non-condensing
Vibration	Operating, MIL-STD-810G, Method 514.6, Category 4
Shock	Operating, MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II
EMC	CE/FCC Class A, according to EN 55032 & EN 55024

Power Backup Modules:

PB-9250J-SA – 9250 w.s Standalone Intelligent SuperCAP Power Backup Module

PB-4600J-SA – 4600 w.s Standalone Intelligent SuperCAP Power Backup Module

PB-2580J-SA – 2580 w.s Standalone Intelligent SuperCAP Power Backup Module

Ordering Information

POC-40

Intel® Elkhart Lake Atom® x6211E Extreme-compact Embedded Computer with 2x GbE and 2x USB 3.1

POC-40-DIO

Intel® Elkhart Lake Atom® x6211E Extreme-compact Embedded Controller with 2x GbE, 2x USB 3.1 and 8x isolated DIO

POC-40-IGN

Intel® Elkhart Lake Atom® x6211E Extreme-compact Embedded Controller with 2x GbE, 2x USB 3.1 and ignition power control

POC-40+

Intel® Elkhart Lake x6413E Extreme-compact IOT Gateway Computer with 2x GbE, 2x USB 3.1, 1x isolated RS422/485 and 8x isolated DIO

POC-40+IGN

Intel® Elkhart Lake x6413E Extreme-compact IOT Gateway Computer with 2x GbE, 2x USB 3.1, 1x isolated RS422/485 and ignition power control

Optional Accessories

PA-60W-OW

60W AC/DC power adapter with 12V, 5A DC output, cord end terminals for terminal block. Operating temperature : -30 to 60 °C

Wmkit-V-POC40

Wall-mount assembly for POC-40 series, vertical type

Cbl-DB9F-3DB9M-15CM

1x DB9 (Female) to 3x DB9 (Male), length: 15CM

Datasheet

Download(181 KB)

BVM Customisation Service

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish.

If you’re unable to find an off-the-shelf product that meets your specific requirements, don’t hesitate to contact our in-house design team. They possess the expertise to customise an existing product to your exact specifications or embark on a fresh design journey to create a customized solution tailored to your requirements. Our design professionals are dedicated to delivering exceptional results, ensuring that the final product not only meets but exceeds your expectations. When you collaborate with our team, you open the door to a world of possibilities, where innovation and creativity converge to bring your vision to life.

Whether it’s modifying an existing product or crafting an entirely new one, our design experts are committed to providing you with a comprehensive, end-to-end solution that perfectly suits your needs. Your satisfaction is our top priority, and we’re here to turn your ideas into reality.

Design | Develop | Test | Manufacture

With over three decades of experience in designing custom industrial and embedded computer and display solutions across a wide array of industries, we’re here to turn your ideas into reality

Here’s a selection of our design, manufacturing & associated services: –

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a brand-new product from scratch or working with an existing prototype.

FREE Pre-design / Pre-sales advise
Prototyping
- Custom PC Design
- Custom Panel PC
- Custom Racks and Towers
- Custom Peli Case PCs
Prototyping pre checks (chargeable one-time fee for existing prototype)
- Hardware compatibility
- Thermal testing
- Software compatibility
Custom PCB / Board Design
- COM Express, Qseven, SMARC
  Jetson, Raspberry Pi
Custom Chassis Design
- Metal
- Plastic
Custom Cables
Custom Back Panels and Faceplates
Custom Cooling
Custom Metal Work (internal brackets, mounting brackets)
Touchscreen Integration and Display Enhancements
- Custom LCD Displays
- Integration of touch technologies
- Optical Bonding
- Anti-reflective and anti-glare coatings
All products are Designed for Manufacture
Software – Custom OS Image

Build to Order: Embedded Computer Design and Customisation Services

Take an existing system and we can:

Custom specification (CPU, RAM, I/O, Industrial Storage, RAID)
Chassis customisation and branding
Custom BIOS
Long Term Availability
Software – Custom OS Image
Custom Packaging and branding
Integrating newly designed or existing hardware into a larger system

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

Embedded Software Services : Configuration, Integration and Deployment

Porting, Integration & Deployment

Windows image capture from customers HDD
Linux image capture from customers HDD
Android image capture from customers HDD
Windows / Linux Deployment from customers image
Custom Windows images, create and deploy
Update management
Custom Linux and Android images
Custom BIOS

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing	Materials Management	Logistics and Tracking	External Manufacturing
• Burn in Test • Temp / Thermal Testing • Environmental Testing • Safety Testing • Software Compatibility Test	• Vendor Selection and Component Procurement • Product Traceability • Obsolescence, End of Life and Last Time Procurement Management • Simple to use on-line RMA System	• Traceability of Shipments • Product Labelling • OEM/Branded Packaging • System Branding • Custom Labels	• Surface Mount: – High Speed Placement • Conventional Through Hole Insertion & Assembly • Automated Optical Inspection • Bespoke PCB Test