3.5" Embedded SBCs

In a 5.7”x 4.09” (144.8×103.9mm) format, 3.5” SBC’s are most commonly found directly driving TFT displays via LVDS or eDP interfaces.

With a wide variety of I/O available to connect multiple peripheral devices,  3.5” SBC’s are available in low powered  x86 or ARM CPUs through to high performance Intel or AMD processors and can be fanless or heat-spreader cooled.

ASRock Industrial SBC-262M-WT: Amston Lake 3.5″ SBC
ASRock Industrial 13th Gen Raptor Lake 3.5″ SBC-371
ASRock Industrial SBC-372: High Performance SBC
ASRock Industrial SBC-373-WT: 13th Gen Wide Temp 3.5″ SBC
ASRock Industrial SBC-375: Intel’s 14th Gen Meteor Lake 3.5″ SBC

Showing all 7 results

  • M8MP553 1

    DFI M8MP553 NXP i.MX 8M 3.5″ SBC

    • Product Name: DFI M8MP553
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: NXP i.MX8M plus Processors
    • RAM: 2GB/4GB LPDDR4
    • Expansion: M.2 2230/3052: 1 M.2 B key for PCIe
    • Other features: 2 GbE LAN for automation application, CANbus for automation equipment integration, 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on NXP Roadmap)
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  • EHL556 1

    DFI EHL556 Elkhart Lake Atom X Series 3.5″ SBC

    • Product Name: DFI EHL556
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: Intel Atom X Series Processor
    • RAM: 1 DDR4-3200 SODIMM up to 32GB
    • Expansion: Multiple Expansion: 1 M.2 E Key, 1 Mini- PCIe/M.2 B Key, 1 I2C
    • Other features: 4K High Resolution, Triple Independent Displays (1 VGA, 1 DP++, 1 LVDS/eDP), Rich I/O (2 LAN, 2 USB 3.1 Gen2, 2 USB 2.0, 2 COM, 1 SATA 3.0), 15-Year CPU Life Cycle Support Until Q4′ 35 (Based on Intel IOTG Roadmap)
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  • AL553F190326 RAw600

    DFI AL553 Intel Atom E3900 3.5″ SBC

    • Product Name: DFI AL553
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: Intel® Atom® E3900
    • RAM: 1 DDR3L SODIMM up to 8GB
    • Expansion: Three independent displays: VGA + LVDS + HDMI; Multiple expansion: 1 M.2 B Key, 1 M.2 E Key, Mini PCIe
    • Other features: Rich I/O: 2 Intel GbE, 1 COM, 2 USB 3.1 Gen1, 4 USB 2.0; 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap)
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  • AL551 F 070824RAw600

    DFI AL551 Intel Atom E3900 3.5″ SBC

    • Product Name: DFI AL551
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: Intel Atom® E3900
    • RAM: 1 DDR3L SODIMM up to 8GB
    • Expansion: Three independent displays: VGA + LVDS + DP++; Wireless communication: mini PCIe
    • Other features: Rich I/O: 2 Intel GbE, 2 COM, 2 USB 3.0, 4 USB 2.0; 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap)
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  • GH551F200130R1 W600

    DFI GH551 AMD Ryzen V1000/R1000 Series 3.5″ SBC

    • Product Name: DFI GH551
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: AMD Ryzen™ V1000/R1000 Series
    • RAM: 1 DDR4 2400MHz SODIMM up to 16GB
    • Expansion: Multiple displays: max. 4 DP++/3 DP++ + LVDS; Multiple Expansion: 1 M.2 M Key, 1 Mini PCIe
    • Other features: Rich I/O: 3 GbE, 2 USB 3.1 Gen2, 1 USB 2.0; 10-Year CPU Life Cycle Support Until Q1′ 31 (Based on AMD Roadmap)
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  • CS551B191017R1w600

    DFI CS551 Intel 8th/9th Gen Coffee Lake iCore 3.5″ SBC

    • Product Name: DFI CS551 3.5″ SBC
    • Motherboard Form Factor: 3.5″
    • CPU: 9th/8th Gen Intel® Core™ with Intel® C246
    • RAM: 1 DDR4 SODIMM up to 32GB
    • Expansion: Three independent displays: LVDS + DP++ + DP++; Multiple expansion: 1 M.2 M Key, 1 Mini PCIe
    • Other features: DP++ resolution up to 4096×2304 @ 60Hz; Rich I/O: 2 Intel GbE, 4 USB 3.1, 2 USB 2.0; 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on Intel IOTG Roadmap)
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  • WL551 Front060520 R1 w600

    DFI WL551 Intel 8th Gen Whiskey Lake iCore 3.5″ SBC

    • Product Name: DFI WL551
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: 8th Gen Intel® Core™ Processor
    • RAM: Not specified
    • Expansion: Dual independent displays: DP + HDMI, 1 LVDS or eDP (opt.); Multiple Expansion: 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
    • Other features: 4K High Resolution: Supports 4K/2K resolution; Rich I/O 1: 3 Intel GbE, 1 COM, 4 USB 3.1 Gen2, 2 USB 2.0; 15-Year CPU Life Cycle Support Until Q2′ 35 (Based on Intel IOTG Roadmap)
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