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Embedded Systems | Industrial Computing

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  • FS051

    DFI FS051 NXP i.MX6 2.5″ Fanless Pico-ITX SBC

    • Product Name: DFI FS051
    • Motherboard Form Factor: 2.5″ Pico-ITX
    • CPU: NXP i.MX6 Processor
    • RAM: DDR3L SDRAM memory down, up to 4GB
    • Expansion: 1 Mini PCIe, 1 SD, 1 SIM (Optional)
    • Other features: Dual independent displays: HDMI + LVDS, Rich I/O: 1 GbE, 3 COM, 5 USB 2.0, 1 CANBus, 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on NXP Roadmap)
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  • M8M051

    DFI M8M051 NXP i.MX 8M 2.5″ Pico-ITX SBC

    • Product Name: DFI M8M051
    • Motherboard Form Factor: 2.5″ Pico-ITX
    • CPU: NXP i.MX 8M Processors
    • RAM: Single Channel LPDDR4 up to 3200 MHz
    • Expansion: Multiple Expansion: 1 M.2 B Key, 1 M.2 E Key
    • Other features: Single Display: HDMI/LVDS (HDMI: resolution up to 4096×2160 @60Hz / LVDS: resolution up to 1920×1080 @60Hz), Rich I/O: 1 Intel GbE, 3 COM, 2 USB 3.1 Gen1, 3 USB 2.0, 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on NXP Roadmap)
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  • CH961 front

    DFI CH961 8th/9th Gen Intel iCore Xeon Celeron COM Express Basic

    • Product Name: DFI CH961
    • Motherboard Form Factor: COM Express Basic
    • CPU: 8th/9th Gen Intel iCore Xeon Celeron
    • RAM: Dual channel DDR4 2666MHz SODIMM up to 96GB
    • Expansion: Multiple expansion: 1 PCIe x16, 8 PCIe x1
    • Other features: Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI Supports three independent displays; DP++ resolution supports up to 4096×2304 @ 60Hz; Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0
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  • photo front GH9A3 R011 web

    DFI GH9A3 AMD Ryzen R1000 Series COM Express Mini

    • Product Name: DFI GH9A3
    • Motherboard Form Factor: COM Express Mini
    • CPU: AMD® Ryzen™ R1000 Series Processor
    • RAM: Single Channel LPDDR4 2400MHz; Memory Down up to 8GB
    • Expansion: Multiple expansions: 3 PCIe x1
    • Other features: 1 LVDS/eDP, 1 DDI (HDMI/DP); Supports dual displays: DDI + LVDS/eDP; Rich I/O: 1 Intel GbE, 2 USB 3.1, 8 USB 2.0; 10-Year CPU Life Cycle Support Until Q1′ 28 (Based on AMD Roadmap)
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  • CS181 Front062420 R1 w600

    DFI CS181-H310 8th/9th Gen Intel iCore MXM Mini-ITX Motherboard

    • Product Name: DFI CS181-H310
    • Motherboard Form Factor: Mini-ITX
    • CPU: 8th/9th Generation Intel® Core™ Processors
    • RAM: 2 DDR4 2400/2666MHz SODIMM up to 32GB
    • Expansion: Multiple Displays: 1 LVDS/eDP, 1 DP++/HDMI (autodetection), 4 DP; Multiple Expansions: 1 MXM Type-A/B, 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
    • Other features: Storage: 2 SATA 3.0; Rich I/O: 6 Intel GbE, 2 COM, 4 USB 3.1 Gen1, 6 USB 2.0; 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on Intel IOTG Roadmap)
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  • CS181 Front062420 R1 w600

    DFI CS181-Q370 8th/9th Gen Intel iCore MXM Mini-ITX Motherboard

    • Product Name: DFI CS181-Q370
    • Motherboard Form Factor: Mini-ITX
    • CPU: 8th/9th Generation Intel® Core™ Processors
    • RAM: 2 DDR4 2400/2666MHz SODIMM up to 32GB
    • Expansion: Multiple Displays: 1 LVDS/eDP, 1 DP++/HDMI (autodetection), 4 DP; Multiple Expansions: 1 MXM Type-A/B, 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
    • Other features: Storage: 2 SATA 3.0; Rich I/O: 6 Intel GbE, 2 COM, 4 USB 3.1 Gen2, 6 USB 2.0; 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on Intel IOTG Roadmap)
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  • GHF51B190606w600

    DFI GHF51 1.8″ AMD Ryzen SBC – Industrial Pi – Dev Kit

    • Product Name: DFI GHF51-R1102G
    • Motherboard Form Factor: 1.8″ SBC
    • CPU: AMD Ryzen™ Embedded R1000 Series
    • RAM: Single Channel DDR4 Memory Down up to 4GB/8GB
    • Expansion: Expansion and Storage: 1 Mini PCIe, 1 SMBus
    • Other features: Small form factor for space-limited applications, HDMI 1.4 resolution supports up to 4096×2160 @ 24Hz, Rich I/O: 1 Intel GbE, 1 USB 3.1 Gen 2, 2 Micro HDMI, 10-Year CPU Life Cycle Support Until Q1’30 (Based on AMD Roadmap)
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  • EC51X CSSide210310R1 w600

    DFI EC510-CS/EC511-CS 8th/9th Gen 5G Fanless Embedded System

    • Product Name: DFI EC510-CS/EC511-CS
    • System Type: Fanless Embedded System
    • CPU: 8th/9th Gen Intel Core
    • RAM: Supports DDR4 SODIMM up to 64GB
    • Expansion: 1 PCIe and 3 M.2 slots support NVMe
    • Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Support 4 PoE (EC51x-CS6G86E-Q), Support 5G Communication, Operating Temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
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  • EC543 CSSide210324 w600

    DFI EC543-CS 8th/9th Gen 5G Fanless Embedded System

    • Product Name: DFI EC543-CS
    • System Type: Fanless Embedded System
    • CPU: 8th/9th Gen Intel Core
    • RAM: Supports DDR4 SODIMM up to 64GB
    • Expansion: 3 PCIe, 1 PCI, and 3 M.2 slots support NVMe
    • Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Support 4 PoE (EC543-CS6G86E-Q configuration), Support 5G communication, Operating temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
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  • EC500 CSSide200824 w600

    DFI EC500-CS 8th/9th Gen 5G Fanless Embedded System

    • Product Name: DFI EC500-CS
    • System Type: Fanless Embedded System
    • CPU: 8th/9th Gen Intel Core
    • RAM: Supports DDR4 SODIMM up to 64GB
    • Expansion: 3 M.2 slots support NVMe
    • Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Rich I/O connectivity: 2 GbE, 4 COM, 4 USB 3.1, 2 USB 2.0 (Q370 only), Support 5G Communication, Operating Temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
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  • EC90ASide210324 w600

    DFI EC90A-GH AMD Ryzen Ultra Compact Fanless Embedded System

    • Product Name: DFI EC90A-GH
    • System Type: Ultra Small Mini PC Fanless Embedded System
    • CPU: AMD Ryzen™ Embedded R1000 Series
    • RAM: DDR4 2400 MHz SODIMM down up to 4GB/8GB (memory onboard)
    • Expansion: 1 x Mini-PCIe (PCIe signal)
    • Other features: Ultra Small Size: 110 x 80mm x 60mm (W x H x D), User-friendly design for installing SIM card, I/O: 1 Intel GbE, 1 USB 3.1 Gen 2, 2 Micro HDMI, 10-Year CPU Life Cycle Support Until Q1’30 (Based on AMD Roadmap)
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  • ECX700 ALSide201126R2 W600

    DFI ECX700-AL Outdoor Ruggedized IPC67 Grade Box PC

    • Product Name: DFI ECX700-AL
    • System Type: Ruggedized Outdoor IoT IP67 Fanless Embedded System
    • CPU: Intel® Atom® Processor E3900 Series
    • RAM: 4GB DDR3 onboard, 64G eMMC
    • Expansion: 1 x Full-size Mini PCIe for 4G LTE module, 1 x Full-size Mini PCIe for Canbus, 1 x M.2 2230 (USB2.0/PCIe) for WiFi module
    • Other features: Ruggedized IPC67 Grade Box PC, Outdoor IoT Gateway Application, Operating temperature: -40° to 70° C, 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap)
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  • EC100 XNX side w600

    DFI EC100-XNX NVIDIA Jetson Xavier NX PoE Embedded System

    • Product Name: DFI EC100-XNX
    • System Type: Industrial PC
    • CPU: NVIDIA Jetson Xavier NX
    • RAM: 8Gb
    • Expansion: 20 pins with 1 x UART, 2 x I2C, 9 x GPIOs
    • Other features: Fully supports NVIDIA Jetson Xavier NX, 8 x 10/100 MbE with PoE, Fanless chassis technology, 1 x HDMI 2.0a/b Type-A supports 4K@60Hz
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  • AL553F190326 RAw600

    DFI AL553 Intel Atom E3900 3.5″ SBC

    • Product Name: DFI AL553
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: Intel® Atom® E3900
    • RAM: 1 DDR3L SODIMM up to 8GB
    • Expansion: Three independent displays: VGA + LVDS + HDMI; Multiple expansion: 1 M.2 B Key, 1 M.2 E Key, Mini PCIe
    • Other features: Rich I/O: 2 Intel GbE, 1 COM, 2 USB 3.1 Gen1, 4 USB 2.0; 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap)
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  • AL551 F 070824RAw600

    DFI AL551 Intel Atom E3900 3.5″ SBC

    • Product Name: DFI AL551
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: Intel Atom® E3900
    • RAM: 1 DDR3L SODIMM up to 8GB
    • Expansion: Three independent displays: VGA + LVDS + DP++; Wireless communication: mini PCIe
    • Other features: Rich I/O: 2 Intel GbE, 2 COM, 2 USB 3.0, 4 USB 2.0; 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap)
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  • AL700 Back Website

    DFI AL700 Intel Atom E3900 Qseven

    • Product Name: DFI AL700
    • Motherboard Form Factor: Intel Atom E3900 Qseven
    • CPU: Intel Atom E3900 Series
    • RAM: 4GB/8GB DDR3L Dual Channel Memory Down
    • Expansion: Multiple expansions: 4 PCIe x1
    • Other features: Rich I/O: 1 Intel GbE, 1 USB 3.0, 8 USB 2.0; 1 DDI*, 1 LVDS*/(eDP + DDI) Supports triple displays: eDP+2DDI; 15-Year CPU Life Cycle Support Until Q1′ 31 (Based on Intel IOTG Roadmap)
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  • AL701F090426 W600

    DFI AL701 Intel Atom E3900 Qseven

    • Product Name: DFI AL701
    • Motherboard Form Factor: Intel Atom E3900 Qseven
    • CPU: Intel Atom E3900
    • RAM: 4GB/8GB LPDDR4 Dual Channel Memory
    • Expansion: Multiple expansions: 4 PCIe x1
    • Other features: 1 DDI*, 1 LVDS*/(eDP + DDI)；Supports triple displays: eDP+2DDI; DP++ resolution supports up to 4096×2160 @ 60Hz; Rich I/O: 1 Intel GbE, 1 USB 3.0, 8 USB 2.0; 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on Intel IOTG Roadmap)
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  • AL968 Front Website

    DFI AL968 Intel Atom E3900 COM Express Compact

    • Product Name: DFI AL968
    • Motherboard Form Factor: COM Express Compact
    • CPU: Intel Atom® E3900 Series
    • RAM: Dual channel DDR3L 1600MHz SODIMM up to 8GB
    • Expansion: Multiple expansion: 4 PCIe x1, 1 LPC, 1 I2C, 1 SMBus, eMMC
    • Other features: Three independent displays: VGA*/DDI + LVDS*/eDP + DDI; Rich I/O: 1 Intel GbE, 4 USB 3.0, 8 USB 2.0, 2 SATA 3.0; 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on Intel IOTG Roadmap)
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  • photo front AL9A8 RA

    DFI AL9A8 Intel Atom E3900 COM Express Mini

    • Product Name: DFI AL9A8
    • Motherboard Form Factor: COM Express Mini
    • CPU: Intel Atom® E3900 Processor Series
    • RAM: Dual Channel LPDDR4-2400MHz Memory Down up to 8GB
    • Expansion: Multiple expansions: 4 PCIe x1
    • Other features: Rich I/O: 1 Intel GbE, 2 USB 3.0, 8 USB 2.0; 1 LVDS/eDP, 1 DDI (HDMI/DP++) Supports dual displays: DDI + LVDS/eDP; 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on Intel IOTG Roadmap)
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  • AL9A2 Front Website

    DFI AL9A2 Intel Atom E3900 COM Express Mini

    • Product Name: DFI AL9A2
    • Motherboard Form Factor: COM Express Mini
    • CPU: Intel Atom® E3900 Processor Series
    • RAM: Dual Channel DDR3L 1600MHz Memory Down up to 8GB
    • Expansion: Multiple expansions: 4 PCIe x1
    • Other features: Rich I/O: 1 Intel GbE, 2 USB 3.0, 8 USB 2.0; 1 LVDS/eDP, 1 DDI (HDMI/DVI/DP) Supports dual displays: DDI + LVDS/eDP; 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on Intel IOTG Roadmap)
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