DFI AL701 Intel Atom E3900 Qseven

• DFI AL701 Intel Atom E3900 Qseven
• 4GB/8GB LPDDR4 Dual Channel Memory Down
• 1 DDI*, 1 LVDS*/(eDP + DDI);Supports triple displays: eDP+2DDI
• DP++ resolution supports up to 4096×2160 @ 60Hz
• Multiple expansions: 4 PCIe x1
• Rich I/O: 1 Intel GbE, 1 USB 3.0, 8 USB 2.0
• 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on Intel IOTG Roadmap)

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Description

  • 4GB/8GB LPDDR4 Dual Channel Memory Down
  • 1 DDI*, 1 LVDS*/(eDP + DDI);Supports triple displays: eDP+2DDI
  • DP++ resolution supports up to 4096×2160 @ 60Hz
  • Multiple expansions: 4 PCIe x1
  • Rich I/O: 1 Intel GbE, 1 USB 3.0, 8 USB 2.0
  • 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on Intel IOTG Roadmap)

Specification

System
Processor
Intel Atom® Processor E3900 Series, BGA 1296
Intel Atom® x7-E3950 Processor, Quad Core, 2M Cache, 1.6GHz (2.0GHz), 12W
Intel Atom® x5-E3940 Processor, Quad Core, 2M Cache, 1.6GHz (1.8GHz), 9.5W
Intel Atom® x5-E3930 Processor, Dual Core, 2M Cache, 1.3GHz (1.8GHz), 6.5W
Intel® Pentium® Processor N4200, Quad Core, 2M Cache, 1.1GHz (2.5GHz), 6W
Intel® Celeron® Processor N3350, Dual Core, 2M Cache, 1.1GHz (2.4GHz), 6W
Memory
4GB/8GB LPDDR4 Memory Down
Dual Channel LPDDR4 3200MHz
BIOS
AMI SPI 128Mbit (supports UEFI boot only)
Graphics
Controller
Intel® HD Graphics Gen9LP Series
Feature
OpenGL 5.0, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H.265, VP8, VP9, MVC
HW Encode: AVC/H.264, JPEG/MJPEG, HEVC/H.265, VP8, VP9, MVC
Display
1 x DDI (HDMI/DVI/DP++)
1 x LVDS/(eDP+DDI) (DDI available upon request)
LVDS: NXP PTN3460, 24-bit, dual channel, resolution up to 1920×1200 @ 60Hz
HDMI: resolution up to 3840×2160 @ 30 Hz
DP++: resolution up to 4096×2160@60Hz
eDP: resolution up to 3840×2160 @ 60Hz
Dual Displays/ Triple Displays
LVDS + DDI (Dual)
eDP + DDI (Dual)
eDP+2DDI (Triple) (available upon request)
Expansion
Interface
4 x PCIe x1 (Gen 2)
1 x SDIO (with LED)
1 x LPC
1 x I2C
1 x SMBus
1 x SPI
1 x UART (TX/RX)
Audio
Interface
HD Audio
Ethernet
Controller
1 x Intel® I211AT (10/100/1000Mbps) (0~60°C)
1 x Intel® I210IT (10/100/1000Mbps) (-40 to 85°C)
I/O
USB
1 x USB 3.0 + 8 x USB 2.0
3 x USB 3.0 + 4 x USB 2.0 (option)
SATA
2 x SATA 3.0 (up to 6Gb/s)
eMMC
Supports up to 32GB eMMC
eMMC 5.0, BGA-153 Ball 8~32G(MLC mode)
GPIO
1 x 4-bit GPIO
CANBus
CAN Bus Function (available upon request)
Watchdog Timer
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
Security
FTPM
Enables or Disables the BIOS support for the security device
Power
Type
5V, 5VSB, VCC_RTC
Consumption
TBD
OS Support
OS Support (UEFI Only)
Windows 10 IoT Enterprise 64-bit
Linux (Intel graphic driver available)
Environment
Temperature
Operating: 0 to 60°C, -40 to 85°C
Storage: -40 to 85°C
Humidity
Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF
TBD
Mechanism
Dimensions
Qseven form factor
70mm (2.76″) x 70mm (2.76″)
Compliance
Qseven specification revision 2.1
Standards and Certifications
Certifications
CE, FCC Class B, RoHS
Packing List
Packing List
1 AL701 board
1 Heat sink: A71-008123-000G
Country of Origin
Country of Origin
Taiwan

Ordering Information

Model Name Part Number Description
AL701-B40-E30 770-AL7011-100G Fanless, Intel Atom x5-E3930, 1 LVDS, 1 LAN, 1 USB 3.0, 8 USB 2.0, 4GB LPDDR4 Memory Down, 0 to 60°C
AL701-B40-E40 770-AL7011-200G Fanless, Intel Atom x5-E3940, 1 LVDS, 1 LAN, 1 USB 3.0, 8 USB 2.0, 4GB LPDDR4 Memory Down, 0 to 60°C
AL701-T80-E50 770-AL7011-300G Fanless, Intel Atom x5-E3950, 1 LVDS, 1 LAN, 3 USB 3.0, 4 USB 2.0, 8GB LPDDR4 Memory Down, -40 to 85°C

Datasheet

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BVM Customisation Service

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish.

 

If you’re unable to find an off-the-shelf product that meets your specific requirements, don’t hesitate to contact our in-house design team. They possess the expertise to customise an existing product to your exact specifications or embark on a fresh design journey to create a customized solution tailored to your requirements.

Our design professionals are dedicated to delivering exceptional results, ensuring that the final product not only meets but exceeds your expectations. When you collaborate with our team, you open the door to a world of possibilities, where innovation and creativity converge to bring your vision to life.

Whether it’s modifying an existing product or crafting an entirely new one, our design experts are committed to providing you with a comprehensive, end-to-end solution that perfectly suits your needs. Your satisfaction is our top priority, and we’re here to turn your ideas into reality.

 

Design | Develop | Test | Manufacture

With over three decades of experience in designing custom industrial and embedded computer and display solutions across a wide array of industries, we’re here to turn your ideas into reality

 

Here’s a selection of our design, manufacturing & associated services: –

Design to Order Banner

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a brand-new product from scratch or working with an existing prototype.

Build to Order Banner

Build to Order: Embedded Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

Embedded Software Banner

Embedded Software Services : Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

Manufacturer : DFI

Motherboard

  • Form Factor :

CPU

  • Powered By : Intel
  • CPU Family : Atom
  • CPU Generation : Apollo Lake
  • CPU Model : N3350, N4200, x5-E3930, x5-E3940, x7-E3950
  • CPU Speed : 1.1Ghz, 1.3Ghz, 1.6Ghz
  • CPU Cores :

Memory

  • Memory Installed : 4Gb, 8Gb
  • Memory Slots : 2
  • Memory Type : 3200Mhz DDR4

I/O and Expansion

  • Expansion Slots : PCIe, SATA
  • LAN Ports : 1
  • Serial Ports :
  • USB 2 Ports : 8
  • USB 3 Ports : 1
  • USB 3.1 Ports :
  • Video Output : DP++
  • Multi Display : Triple Display
  • Wireless Connectivity :

Operating System

  • OS : Linux, Windows

Certifications

  • Certifications :

Industry

  • Industry :

Features

  • 24/7 Use :
  • 4G-GPS :
  • Artificial Intelligence Use :
  • ATEX :
  • High Performance :
  • Industrial :
  • In-Vehicle :
  • IoT :
  • IP Rating :
  • Low Powered :
  • Mini-ITX :
  • Multi Displays : Triple
  • NUC :
  • Other Features : CANBus, GPIO
  • PoE :
  • Rugged : Yes
  • Ryzen :
  • System Type : Computer-On-Module
  • Touchscreen :
  • Whiskey Lake :
  • Wide Temp : Yes

Categories :