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Embedded Systems | Industrial Computing

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  • AL9A3 Front Website

    DFI AL9A3 Intel Atom E3900 COM Express Mini

    • Product Name: DFI AL9A3
    • Motherboard Form Factor: COM Express Mini
    • CPU: Intel Atom® E3900 Processor Series
    • RAM: Dual Channel DDR3L 1600MHz Memory Down up to 8GB
    • Expansion: Multiple expansions: 4 PCIe x1
    • Other features: Rich I/O: 1 Intel GbE, 2 USB 3.0, 8 USB 2.0; 1 LVDS/eDP, 1 DDI (HDMI/DVI/DP) Supports dual displays: DDI + LVDS/eDP; 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on Intel IOTG Roadmap)
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  • GH551F200130R1 W600

    DFI GH551 AMD Ryzen V1000/R1000 Series 3.5″ SBC

    • Product Name: DFI GH551
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: AMD Ryzen™ V1000/R1000 Series
    • RAM: 1 DDR4 2400MHz SODIMM up to 16GB
    • Expansion: Multiple displays: max. 4 DP++/3 DP++ + LVDS; Multiple Expansion: 1 M.2 M Key, 1 Mini PCIe
    • Other features: Rich I/O: 3 GbE, 2 USB 3.1 Gen2, 1 USB 2.0; 10-Year CPU Life Cycle Support Until Q1′ 31 (Based on AMD Roadmap)
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  • ALF51F080111RAw600

    DFI ALF51 1.8″ Board with Intel Atom X5 or Celeron CPU

    • Product Name: DFI ALF51
    • Motherboard Form Factor: 1.8″ SBC
    • CPU: Intel Atom® Processor E3900 Series or Celeron CPU
    • RAM: 2GB/4GB LPDDR4 Memory Down
    • Expansion: 1 Mini DP++
    • Other features: Rich I/O: 2 Intel GbE, 1 COM, 2 USB 3.1 Gen 1, 1 USB 2.0, 15-Year CPU Life Cycle Support Until Q4’31 (Based on Intel IOTG Roadmap), Operating: 0 to 60°C
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  • RC300 CS SideIO200729R2 w600

    DFI VC300-CS AI-Enabled 5G MXM In-Vehicle PC

    • Product Name: DFI VC300-CS
    • System Type: AI-Enabled 5G MXM In-Vehicle PC
    • CPU: 8th/9th Generation Intel® Core™ Processors
    • RAM: Dual Channel DDR4 2666/2400 MHz by SODIMMs up to 64GB
    • Expansion: 4 x 802.3af POE Ports, Multiple Expansion Slots for 3G/LTE/5G Cellular Support
    • Other features: AI Accelerated: Up to 110W GPU MXM Module Supported, Extended Operating Temperature: -25°C to 70°C, Support 5G Communication, 15-Year CPU Life Cycle Support Until Q1′ 34 (Based on Intel IOTG Roadmap)
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  • ALF51F080111RAw600

    DFI ALF51-ET Intel Atom X5 / Celeron 1.8″ SBC – Extended Temp

    • Product Name: DFI ALF51-ET
    • Motherboard Form Factor: 1.8″ SBC
    • CPU: Intel Atom® Processor E3900 Series or Celeron
    • RAM: 2GB/4GB LPDDR4 Memory Down
    • Expansion: 1 Mini DP++
    • Other features: Rich I/O: 2 Intel GbE, 1 COM, 2 USB 3.1 Gen 1, 1 USB 2.0, 15-Year CPU Life Cycle Support Until Q4’31 (Based on Intel IOTG Roadmap), Operating: -40 to 85°C
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  • ALF51F080111RAw600

    DFI ALF51-WT Intel Atom X5 / Celeron 1.8″ SBC – Wide Temp

    • Product Name: DFI ALF51-WT
    • Motherboard Form Factor: 1.8″ SBC
    • CPU: Intel Atom® Processor E3900 Series or Celeron
    • RAM: 2GB/4GB LPDDR4 Memory Down
    • Expansion: 1 Mini DP++
    • Other features: Rich I/O: 2 Intel GbE, 1 COM, 2 USB 3.1 Gen 1, 1 USB 2.0, 15-Year CPU Life Cycle Support Until Q4’31 (Based on Intel IOTG Roadmap), Operating: -20 to 70°C
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  • KU968 Front Website

    DFI KU968 Kaby Lake 7th Gen Intel iCore COM Express Compact

    • Product Name: DFI KU968
    • Motherboard Form Factor: COM Express Compact
    • CPU: 7th Gen Intel® Core™
    • RAM: Dual channel DDR4 2133MHz memory down up to 16GB
    • Expansion: Multiple expansion: 8 PCIe x1, 1 LPC, 1 I2C, 1 SMBus
    • Other features: Rich I/O: 1 Intel GbE, 4 USB 3.0, 8 USB 2.0; Three independent displays: VGA*/DDI + LVDS*/eDP + DDI; 15-Year CPU Life Cycle Support Until Q1′ 32 (Based on Intel IOTG Roadmap)
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  • COM101 BAT Front Website

    DFI COM101-BAT Mini-ITX – COMe Basic/Compact Carrier Board

    • Product Name: DFI COM101-BAT
    • Motherboard Form Factor: Mini-ITX
    • CPU: Supports COMe Basic/Compact modules
    • RAM: Supports Compact/Basic modules
    • Expansion: Multiple displays (1 DP, 1 LVDS, 1 VGA)
    • Other features: Rich I/O (1 GbE, 6 USB)
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  • COM332 B Front Website

    DFI COM332-B(R.A) Micro-ATX – COMe Basic/Compact Carrier Board

    • Product Name: DFI COM332-B
    • Motherboard Form Factor: Micro-ATX
    • CPU: Supports COMe Basic/Compact modules
    • RAM: Supports Compact and Basic modules
    • Expansion: Multiple displays (VGA, LVDS, DP, eDP)
    • Other features: Rich I/O (1 GbE, 4 USB 3.0, 4 USB 2.0)
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  • COM332 BF070801w600

    DFI COM332-B(R.B1) Micro-ATX – COMe Basic/Compact Carrier Board

    • Product Name: DFI COM332-B
    • Motherboard Form Factor: Micro-ATX
    • CPU: Supports COMe Basic/Compact modules
    • RAM: Supports Compact and Basic modules
    • Expansion: Multiple displays (VGA, LVDS, DP, eDP)
    • Other features: Rich I/O (1 GbE, 4 USB 3.1, 4 USB 2.0)
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  • COM333 Front Website

    DFI COM333-I Micro-ATX – COMe Basic/Compact Carrier Board

    • Product Name: DFI COM333-I
    • Motherboard Form Factor: Micro-ATX
    • CPU: Supports COMe Basic/Compact modules
    • RAM: Supports Compact and Basic modules
    • Expansion: Multiple expansion (8 PCIe x4 or 4 PCIe x8, 2 SATA 3.0)
    • Other features: Rich I/O (2 GbE, 4 10Gbase-KR, 4 USB 3.0/2.0, 1 COM)
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  • RC300 CS Front200721 w600

    DFI RC-300-CS AI-Enabled 5G MXM Railway System

    • Product Name: DFI RC-300-CS
    • System Type: Railway System
    • CPU: 8th/9th Generation Intel Core Processors
    • RAM: Dual Channel DDR4 2666/2400 MHz by SODIMMs up to 64GB
    • Expansion: Multiple Expansion Slots for 3G/LTE/5G Cellular Support
    • Other features: AI-Enabled, 4 x M12 X-coded PoE Ports at 15W, AI Accelerated: Up to 110W GPU MXM Module Supported, Extended Operating Temperature: -25°C to 70°C Operation without Active Fan, Support 5G Communication, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
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  • CS551B191017R1w600

    DFI CS551 Intel 8th/9th Gen Coffee Lake iCore 3.5″ SBC

    • Product Name: DFI CS551 3.5″ SBC
    • Motherboard Form Factor: 3.5″
    • CPU: 9th/8th Gen Intel® Core™ with Intel® C246
    • RAM: 1 DDR4 SODIMM up to 32GB
    • Expansion: Three independent displays: LVDS + DP++ + DP++; Multiple expansion: 1 M.2 M Key, 1 Mini PCIe
    • Other features: DP++ resolution up to 4096×2304 @ 60Hz; Rich I/O: 2 Intel GbE, 4 USB 3.1, 2 USB 2.0; 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on Intel IOTG Roadmap)
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  • VC230 ALSide190313 w600

    DFI VC230-AL Intel Atom E3900 Series In-Vehicle PC

    • Product Name: DFI VC230-AL
    • System Type: Anti-vibration In-Vehicle PC
    • CPU: Intel Atom E3900 Series
    • RAM: 1 SODIMM Memory Support up to 8GB Single Channel DDR3L 1600/1866MHz
    • Expansion: 1 mSATA, eMMC (optional), 1 x Full-size Mini PCIe (PCIe/USB/Daul micro SIM), 1 x Full-size Mini PCIe (PCIe/USB/micro SIM), 1 x Half-size mSATA
    • Other features: Supports ignition delay on/off function, GPS Onboard, 3 SIM Slots Onboard, Supports Wi-Fi, 3G, and GPRS application, 15-Year CPU Life Cycle Support Until Q1′ 31 (Based on Intel IOTG Roadmap)
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  • F8700F191031 W600

    DFI F8700 NXP i.MX8X Qseven

    • Product Name: DFI F8700
    • Motherboard Form Factor: NXP i.MX8X Qseven
    • CPU: NXP i.MX8X
    • RAM: 4GB LPDDR4 Memory Down
    • Expansion: Multiple expansions: 1 PCIe x1, 1 SDIO x4 bit
    • Other features: Supports dual displays: 1 HDMI, 1 LVDS; Rich I/O: 1 GbE, 3 USB 3.0, 1 USB 2.0 OTG; 15-Year CPU Life Cycle Support Until Q1′ 29 (Based on NXP Roadmap)
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  • RC300 CS SideIO200729R2 w600

    DFI EC300-CS AI-Enabled 5G MXM PoE High Performance System

    • Product Name: DFI EC300-CS
    • System Type: AI-Enabled 5G MXM PoE High Performance System
    • CPU: 8th/9th Generation Intel® Core™ Processors
    • RAM: Dual Channel DDR4 2666/2400 MHz by SODIMMs up to 64GB
    • Expansion: Multiple Expansion Slots for 3G/LTE/5G Cellular Support
    • Other features: 4 x RJ45 type PoE ports at 15W, AI Accelerated: Up to 110W GPU MXM Module Supported, Extended Operating Temperature: -25°C to 70°C, Support 5G Communication, 15-Year CPU Life Cycle Support Until Q1′ 34 (Based on Intel IOTG Roadmap)
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  • Q7A 551 Front Website

    DFI Q7A-551 Qseven Carrier Board

    • Product Name: DFI Q7A-551
    • Motherboard Form Factor: Qseven Carrier Board
    • CPU: Supports Qseven modules
    • RAM: Supports Qseven modules
    • Expansion: Multiple displays (1 LVDS, 1 HDMI)
    • Other features: Rich I/O (1 GbE, 2 USB 2.0, 3 COM)
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  • Q7X 151 Front Website

    DFI Q7X-151(R.A) Mini-ITX – Qseven Carrier Board

    • Product Name: DFI Q7X-151
    • Motherboard Form Factor: Mini-ITX
    • CPU: Supports Qseven modules
    • RAM: Supports Qseven modules
    • Expansion: Multiple displays (1 DP, 1 LVDS)
    • Other features: Rich I/O (1 GbE, 1 USB 3.0, 6 USB 2.0, 2 COM)
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  • Q7X 151F190621 W600

    DFI Q7X-151(R.D1) Mini-ITX – Qseven Carrier Board

    • Product Name: DFI Q7X-151
    • Motherboard Form Factor: Mini-ITX
    • CPU: Supports Qseven modules
    • RAM: Supports Qseven modules
    • Expansion: Multiple displays (2 DP, 1 LVDS, 1 eDP)
    • Other features: Rich I/O (1 GbE, 3 USB 3.0, 8 USB 2.0, 2 COM)
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  • SDML WLF191025R1 w600

    DFI SDML-WL 8th Gen Intel iCore Smart Display Module

    • Product Name: DFI SDML-WL
    • Motherboard Form Factor: Smart Display Module
    • CPU: 8th Gen Intel iCore
    • RAM: 2 DDR4 2400MHz SODIMM up to 32GB
    • Expansion: 1 M.2 E Key, 1 M.2 M Key, 1 M.2 B Key
    • Other features: HDMI resolution up to 4096 x 2160 @ 60Hz, DisplayPort resolution up to 4096 x 2304 @ 60Hz, Rich I/O: 1 Intel GbE, 4 USB3.1, 1 USB3.1 Type C, 15-Year CPU Life Cycle Support Until Q3′ 34 (Based on Intel IOTG Roadmap)
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