DFI AL968 Intel Atom E3900 COM Express Compact

COM Express Type 6, Intel Atom E3900, DDR3L, 4 PCIe x1, 2 SATA 3.0, 12 USB, 1 VGA, 1 LVDS, 1 DDI



  • Intel Atom® E3900 Series
  • Dual channel DDR3L 1600MHz SODIMM up to 8GB
  • Three independent displays: VGA*/DDI + LVDS*/eDP + DDI
  • Multiple expansion: 4 PCIe x1, 1 LPC, 1 I2C, 1 SMBus, eMMC
  • Rich I/O: 1 Intel GbE, 4 USB 3.0, 8 USB 2.0, 2 SATA 3.0
  • 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on Intel IOTG Roadmap)

Rugged Design and Energy-Efficiency for Deeply Embedded Applications

DFI launched new products to provide enhanced processing capability, low-power consumption, and brilliant graphic performance under Goldmont architecture with 14nm manufacturing node. Relying on DFI’s innovative abilities in design and manufacture, these products are small-sized, fanless, and support extended temperature range from -40°C up to +85°C, which makes it a perfect suite for many space-constrained and thermally limited embedded applications.

Wide Operating Temperature with Fanless Design

These products are able to survive under a wide -40°C to +85°C operating temperature range. Satisfying the demands of industries in harsh environments with the need of thermal solution designs. Also, this outstanding fanless design makes awesome system integration.

Energy Saving but High Performance

With the latest processor under Goldmont architecture, these boards offer 30% significant improvement for processing and intense graphic performance (Gen9), it also saves an average of 9 watts TDP energy.



Intel Atom® Processor E3900 Series, BGA 1296
Intel Atom® x7-E3950 Processor, Quad Core, 2M Cache, 1.6GHz (2.0GHz), 12W
Intel Atom® x5-E3940 Processor, Quad Core, 2M Cache, 1.6GHz (1.8GHz), 9.5W
Intel Atom® x5-E3930 Processor, Dual Core, 2M Cache, 1.3GHz (1.8GHz), 6.5W
Intel® Pentium® Processor N4200, Quad Core, 2M Cache, 1.1GHz (2.5GHz), 6W
Intel® Celeron® Processor N3350, Dual Core, 2M Cache, 1.1GHz (2.4GHz), 6W
Two 204-pin SODIMM up to 8GB
Dual Channel DDR3L 1600MHz
Insyde SPI 128Mbit (supports UEFI boot only)
Intel® HD Graphics
OpenGL 5.0, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1, WMV9, JPEG/MJPEG, HEVC/H.265, VP8, VP9, MVC
HW Encode: AVC/H.264, JPEG/MJPEG, HEVC/H.265, VP8, VP9, MVC
1 x VGA/DDI (DDI available upon request)
1 x LVDS/eDP (eDP available upon request)
1 x DDI
VGA: resolution up to 1920×1200 @ 60Hz
LVDS: dual channel 24-bit, resolution up to 1920×1200 @ 60Hz
eDP: resolution up to 3840×2160 @ 60Hz
HDMI: resolution up to 3840×2160 @ 30Hz
DP++: resolution up to 4096×2160 @ 60Hz
DDI + eDP + DDI (available upon request)
4 x PCIe x1 (Gen 2)
1 x SDIO (available upon request)
1 x LPC
1 x I2C
1 x SMBus
1 x SPI
2 x UART (TX/RX)
HD Audio
1 x Intel® I211AT (10/100/1000Mbps) (0°C to 60°C) or
1 x Intel® I210IT (10/100/1000Mbps) (-40°C to 85°C)
4 x USB 3.0
8 x USB 2.0
2 x SATA 3.0 (up to 6Gb/s)
1 x 8GB/16GB/32GB eMMC (available upon request)
1 x 8-bit DIO
Watchdog Timer
Output & Interval
System Reset, Programmable via Software from 1 to 255 Seconds
Available Upon Request
12V, 5VSB, VCC_RTC (ATX mode)
12V, VCC_RTC (AT mode)
Typical: E3950: 12V @ 0.3551A (4.2612W)
Max.: E3950: 12V @ 1.9213A (23.0556W)
OS Support
OS Support (UEFI Only)
Windows: Windows 10 IoT Enterprise 64-bit
Operating: 0 to 60°C, -40 to 85°C
Storage: -40 to 85°C
Operating: 10 to 90% RH
Storage: 10 to 90% RH
707,110 hrs @ 25°C; 416,227 hrs @ 45°C; 263,460 hrs @ 60°C
Calculation model: Telcordia Issue 2
Environment: GB, GC – Ground Benign, Controlled
COM Express® Compact 95mm (3.74″) x 95mm (3.74″)
PICMG COM Express® R2.1, Type 6
Standards and Certifications
Packing List
Packing List
1 AL968 board
1 Heat sink (Height: 22.6mm) for 500G~800G: A71-008104-000G; for 900G: A71-008104-010G
Country of Origin
Country of Origin

Ordering Information

Model Name Part Number Description
AL968-BS0-E3950 770-AL9681-500G Fanless, Intel Atom x7-E3950, 1 LVDS, 1 VGA, 1 LAN, 4 USB 3.0, 8 USB 2.0, 2 SODIMM DDR3L, 0 to 60°C
AL968-TS0-E3940 770-AL9681-600G Fanless, Intel Atom x7-E3940, 1 LVDS, 1 VGA, 1 LAN, 4 USB 3.0, 8 USB 2.0, 2 SODIMM DDR3L, -40 to 85°C
AL968-BS0-E3940 770-AL9681-700G Fanless, Intel Atom x7-E3940, 1 LVDS, 1 VGA, 1 LAN, 4 USB 3.0, 8 USB 2.0, 2 SODIMM DDR3L, 0 to 60°C
AL968-BS0-E3930 770-AL9681-800G Fanless, Intel Atom x7-E3930, 1 LVDS, 1 VGA, 1 LAN, 4 USB 3.0, 8 USB 2.0, 2 SODIMM DDR3L, 0 to 60°C
AL968-BS0-N4200 770-AL9681-900G Fanless, Intel Atom Pentium-N4200, 1 LVDS, 1 VGA, 1 LAN, 4 USB 3.0, 8 USB 2.0, 2 SODIMM DDR3L, 0 to 60°C



If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can design a new product from start to finish.


Design | Develop | Test | Manufacture

Here’s a selection of our design, manufacturing

& associated services: –


Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a brand-new product from scratch or working with an existing prototype.DesignToOrder

Build to Order: Embedded Computer Design and Customisation Services​

Take an existing system and we can:BuildToOrder

  • Custom specification (CPU, Ram, I/O, Storage)
  • Chassis customisation and branding
  • Custom BIOS
  • Software – Custom OS Image
  • Custom Packaging and branding
  • Integrating newly designed or existing hardware into a larger system

Build to order Racks and Towers, Peli Case PCs and Mini-ITX PCs

Embedded Software Services : Configuration, Integration and Deployment

Porting, Integration & DeploymentEmbeddedSoftware

  • Windows image capture from customers HDD
  • Linux image capture from customers HDD
  • Windows / Linux Deployment from customers image
  • Custom Windows images, create and deploy
  • Update management
  • Custom Linux and Android images?
  • Custom BIOS