Neousys POC-451VTC x6425E Ultra-compact In-vehicle Computer

  • Product Name: Neousys POC-451VTC
  • System Type: Ultra-compact In-vehicle Fanless Computer
  • CPU: Intel Atom x6425E quad-core processor
  • RAM: Up to 32 GB DDR4-3200 SDRAM by one SODIMM socket
  • Expansion: 2x 2.5GbE PoE+ ports and 1x 2.5GbE port, 1x M.2 2242/3052 B key for 4G/5G module, 2x M.2 2230 E key for WIFI and edge TPU module, Dual M.2 2280 M key for SATA SSD
  • Other features: Rugged -25°C to 70°C fanless operation, Conduction-cooled heatsink for M.2/mPCIe modules, 8~35V DC input with built-in ignition power control

Description

The POC-451VTC from Neousys Technology is an ultra-compact in-vehicle computer with E-Mark certification for in-transportation applications, making it a viable solution for deployments involved with mobile gateways, mobile surveillance and passenger information systems. Leveraging the Intel® Elkhart Lake Atom® x6425E CPU, the POC-451VTC delivers performance uplifts of 1.8x concerning the previous Atom CPU deployed on the POC-351VTC – and 2x the previous GPU performance

The POC-451VTC provides multiple M.2 and mPCIe slots to enable integration of 4G/5G, WiFi5/6, CAN bus and Edge TPU modules for modern day in-vehicle applications – and can, therefore, enhance WiFi and broadband wireless connectivity, as well as provide AI inference functionality all within a compact footprint. In supporting the  high-performance modules, the POC-451VTC has a dedicated conduction-cooled heat spreader to dissipate the heat generated by M.2/mPCIe modules for the maintaining of optimal system performance even in high temperature environments.

Connectivity-wise, the POC-451VTC offers 3 x  2.5GBASE-T Ethernet ports with PoE+ capability for powering PoE PD devices, such as IP and GigE cameras. The ports are backward-compatible with 1000/100 Mbps Ethernet to work with most existing Ethernet devices. The system also provides isolated DIO for sensor/ actuator control and 8V-35V wide range DC input with ignition power control for in-vehicle deployment.

With a significant performance boost over that of the previous generation of POC-45VTC, 2.5G PoE+ ports – and thermal reliability for communication and inference, the POC-451VTC is an AI-capable, mobile gateway solution that opens the door to a wide variety of possibilities for in-vehicle applications.

Key Features

  • Intel® Atom® x6425E quad-core processor
  • Rugged -25°C to 70°C fanless operation
  • 2x 2.5GbE PoE+ ports and 1x 2.5GbE port
  • 1x M.2 2242/ 3052 B key for 4G/5G module
  • 2x M.2 2230 E key for WIFI and edge TPU module
  • Conduction-cooled heatsink for M.2/ mPCIe modules
  • Dual M.2 2280 M key for SATA SSD
  • 8~35V DC input with built-in ignition power control

Specification

System Core
Processor Intel® Elkhart Lake Atom® x6425E quad-core 2.0GHz/3.0GHz 12W processor
Graphics Integrated Intel® UHD Graphics
Memory Up to 32 GB DDR4-3200 SDRAM by one SODIMM socket
Panel I/O Interface
Ethernet 3x 2.5GBASE-T Ethernet ports by Intel® I225 GbE controllers
POE IEEE 802.3at PoE+ on port #2 and #3
Video Port 2x DisplayPort connector, supporting 4096 x 2160 resolution @ 60Hz
USB 2x USB 3.2 Gen1 (5 Gbps) ports
2x USB 2.0 ports
Serial Port 1x software-programmable RS-232/422/485 ports (COM1)
3x 3-wire RS-232 ports (COM2/3/4) or 1x RS-422/485 port (COM2)
Audio Optional 1x 3.5 mm jack for mic-in and speaker-out
Isolated DIO 4x isolated DI and 4x isolated DO
Internal Expansion Bus
M.2 E key 2x M.2 2230 E key socket for WiFi or Google edge TPU
M.2 B key 1x M.2 2242/ 3052 B key socket for 4G/5G module with dual SIM support
Mini-PCIe 1x full-size mini-PCIe socket (USB2 signal only)
Storage Interface
M.2 2x M.2 2280 M key sockets for SATA SSD
Power Supply
DC Input 1x 3-pin pluggable terminal block for 8V to 35V DC input with built-in ignition power control (IGN/GND/V+)
Mechanical
Dimension 153 mm (W) x 108 mm (D) x 72 mm (H)
Weight 1.4 kg
Mounting Vertical-type wall-mount (standard)
DIN-rail mount (optional)
Environmental
Operating Temperature -25°C ~ 70°C*/**
Storage Temperature -40°C ~85°C
Humidity 10%~90% , non-condensing
Vibration Operating, MIL-STD-810G, Method 514.6, Category 4
Shock Operating, MIL-STD-810G, Method 516.6, Procedure I, Table 516.6-II
EMC E-Mark
CE/FCC Class A, according to EN 55032 & EN 55035

* For wide temperature use condition, a wide temperature/industrial M.2 M key SATA SSD module is required.
** For full function use condition (mini-PCIe and M.2 are all adopted), the operating temperature may be constrained by mini-PCIe and M.2 modules.

Power Backup Modules:

Power Backup Modules

PB-9250J-SA – 9250 w.s Standalone Intelligent SuperCAP Power Backup Module

Power Backup Modules

PB-4600J-SA – 4600 w.s Standalone Intelligent SuperCAP Power Backup Module

Power Backup Modules2 2

PB-2580J-SA – 2580 w.s Standalone Intelligent SuperCAP Power Backup Module

Ordering Information

POC-451VTC

Intel® Elkhart Lake Atom® x6425E ultra-compact in-vehicle computer with 3x 2.5G, PoE+ and M.2/mPCIe for WIFI/4G/5G modules

Optional Accessories

PA-120W-OW

120W AC/DC power adapter 20V/6A; 18AWG/120cm; cord end terminals for terminal block, operating temperature : -30 to 70 °C

PA-60W-OW

60W AC/DC power adapter with 12V, 5A DC output, cord end terminals for terminal block. Operating temperature : -30 to 60 °C

Optional Cellular Module

Cbl-DB9F-3DB9M-15CM

1x DB9 (Female) to 3x DB9 (Male), length: 15CM

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

Design to Order Banner

Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

Build to Order Banner

Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

Embedded Software Banner

Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

Click here to find out more.