Military and Defence Computing Solutions - MIL-STD-810 and MIL-STD-461

  • c1d1 panel pc 1

    Winmate R19ITWS-MHA3-EX 19″ M Series i5 C1D2 HMI Panel PC

    • Product Name: Winmate R19ITWS-MHA3-EX
    • Screen Size: 19″
    • CPU: Intel 11th Generation Tiger Lake UP3 Core i5 CPU
    • RAM: 2 x SODIMM, DDR4 3200 MHz, 4GB 8GB (Optional) 16GB (Optional) 32GB (Optional)
    • Expansion: Support PCIe x4 Card
    • Other features: Signature true flat display screen with edge-to-edge design, Aluminium, anti-corrosion treated housing, Superior sealing with front IP65 protection against dust and water, Projected Capacitive Multi-Touch Screen (PCAP), Fanless Design, Support wide range 9-29 V DC input, Quick & Easy Removable 2.5” SSD Bay Slot, C1D2 & IECEx certificated, Compliance with ATEX Grade Zone 2
  • c1d1 panel pc w1

    Winmate W24ITWS-MHA2-EX 23.8″ M Series i5 C1D2 HMI Panel PC

    • Product Name: Winmate W24ITWS-MHA2-EX
    • Screen Size: 23.8″
    • CPU: Intel 11th Generation Tiger Lake UP3 Core i5 CPU
    • RAM: 2 x SODIMM, DDR4 3200 MHz, 4GB 8GB (Optional) 16GB (Optional) 32GB (Optional)
    • Expansion: Support PCIe x4 Card
    • Other features: Signature true flat display screen with edge-to-edge design, Aluminium, anti-corrosion treated housing, Superior sealing with front IP65 protection against dust and water, Projected Capacitive Multi-Touch Screen (PCAP), Fanless Design, Support wide range 9-29 V DC input, Quick & Easy Removable 2.5” SSD Bay Slot, C1D2 & IECEx certificated, Compliance with ATEX Grade Zone 2
  • c1d1 panel pc w1

    Winmate W22ITWS-MHB1-EX 21.5″ M Series i5 C1D2 HMI Panel PC

    • Product Name: Winmate W22ITWS-MHB1-EX
    • Screen Size: 21.5″
    • CPU: Intel 11th Generation Tiger Lake UP3 Core i5 CPU
    • RAM: 2 x SODIMM, DDR4 3200 MHz, 4GB 8GB (Optional) 16GB (Optional) 32GB (Optional)
    • Expansion: Support PCIe x4 Card
    • Other features: Signature true flat display screen with edge-to-edge design, Aluminium, anti-corrosion treated housing, Superior sealing with front IP65 protection against dust and water, Projected Capacitive Multi-Touch Screen (PCAP), Fanless Design, Support wide range 9-29 V DC input, Quick & Easy Removable 2.5” SSD Bay Slot, C1D2 & IECEx certificated, Compliance with ATEX Grade Zone 2
  • ITG 100AI 1

    IEI ITG-100AI Fanless Ultra Compact Size AI Embedded System

    • Product Name: IEI ITG-100AI
    • System Type: Fanless Ultra Compact Size AI Embedded System
    • CPU: Intel Atom x5-E3930 1.3GHz (up to 1.8 GHz)
    • RAM: 1x 204-pin DDR3L SO-DIMM slot pre-installed with 8 GB memory
    • Expansion: M.2 A-key slot for WiFi Module
    • Other features: Two GbE LAN ports, Two RS-232/422/485, Pre-installed Mustang-MPCIE-MX2, 2 x Intel Myriad X VPU for AI deep learning workload consolidation
  • IDS 310AI 1

    IEI IDS-310AI Fanless Ultra Compact AI System

    • Product Name: IEI IDS-310AI
    • System Type: Fanless Ultra Compact Size AI System
    • CPU: Intel Celeron J3455 1.5GHz (up to 2.3GHz, quad-core, TDP 10W)
    • RAM: 1 x 204-pin DDR3L SO-DIMM, 8 GB pre-installed
    • Expansion: M.2 A-key slot for expansion
    • Other features: Two GbE LAN ports, Triple USB 3.2 Gen1, Pre-installed a Mustang-MPCIE-MX2 that has two Intel Myriad X VPUs for AI deep learning workload consolidation
  • ECX700 ADP 1

    DFI ECX700-ADP 12th Gen Outdoor Ruggedized IPC67 Mini PC

    • Product Name: DFI ECX700-ADP
    • System Type: Outdoor Ruggedized IPC67 Box PC
    • CPU: Intel Alder Lake-P Processor i5-1245UE / i7-1265UE
    • RAM: Supports DDR4 memory
    • Expansion: Multiple I/O interfaces for versatile connectivity
    • Other Features: IP67-rated waterproof and dustproof design, extreme ruggedization to IEC 60068-2-64, wide operating temperature range (-20 to 70°C)
    This product has multiple variants. The options may be chosen on the product page
  • ECX700 ALSide201126R2 W600

    DFI ECX700-AL Outdoor Ruggedized IPC67 Grade Box PC

    • Product Name: DFI ECX700-AL
    • System Type: Ruggedized Outdoor IoT IP67 Fanless Embedded System
    • CPU: Intel Atom Processor E3900 Series
    • RAM: 4GB DDR3 onboard, 64G eMMC
    • Expansion: 1 x Full-size Mini PCIe for 4G LTE module, 1 x Full-size Mini PCIe for Canbus, 1 x M.2 2230 (USB2.0/PCIe) for WiFi module
    • Other features: Ruggedized IPC67 Grade Box PC, Outdoor IoT Gateway Application, Operating temperature: -40° to 70° C, 15-Year CPU Life Cycle Support Until Q4′ 31 (Based on Intel IOTG Roadmap)
    This product has multiple variants. The options may be chosen on the product page