Computer-On-Modules and Carrier Boards
Computer-On-Modules (COM/SOM) are ideal for applications where time to market and longevity are critical. Plugged into carrier boards, they can be upgraded to newer, backwards-compatible versions as processor technology progresses. COM modules with custom carrier boards are often used in Industrial, military, medical and transportation applications.
• Custom Carrier Board Design Service • COMe vs Qseven vs SMARC: A Comparison of Modular Computing Standards
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COM Express Compact (18)
Dimensions: 95mm x 95mm
COM Express Compact is ideal for mobile applications, the COM Express Compact module features Intel Core i and Intel Atom processors. It combines powerful performance with a compact design.
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COM Express Mini (12)
Dimensions: 84mm x 55mm
The COM Express Mini modules includes entry-level processors and Intel Atom technology. They support memory and onboard storage for rugged industrial applications.
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COM Express Basic (16)
Dimensions: 125mm x 95mm
COM Express Basic is equipped with the latest CPUs, providing high-speed interfaces such as HDMI / DisplayPort, PCIe, SATA, and USB 3.0. It also supports legacy applications with LVDS, PCI and IDE interfaces.
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Qseven Modules (8)
Dimensions: 70mm x 70mm
Qseven modules are equipped with fast serial interfaces in an ultra-small form factor. Qseven modules are much smaller than other system-on-modules which make them an ideal solution for space-limited and low power applications.
BVM provide Qseven solutions available in low powered Intel Atom, Celeron and ARM (iMX) processor formats on standard and wide temperature (-40°C to +85°C) platforms.
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SMARC Modules (8)
Dimensions: 82mm x 50mm and 82mm x 80mm
Smart Mobility Architecture (SMARC) is a computer hardware standard for computer-on-modules (COMs). SMARC modules are specifically designed for the development of extremely compact low-power systems, such as mobile devices.
• Advantech SMARC Modules: Advanced Computing with ARM and x86 ARChitectures
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COM-HPC (4)
COM-HPC, or Computer-on-Module High-Performance Computing, is a standardized form factor developed by PICMG. COM-HPC it separates the processor module from the carrier board, offering flexibility in system design.
The modular approach accommodates diverse computing needs, with different size options and pinouts defined by the standard. COM-HPC modules integrate powerful processors, memory, storage and I/O, making them suitable for applications like edge computing and industrial automation.
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Carrier Boards (19)
Carrier boards provide a platform that enable COM, SMARC and Qseven modules to function. At BVM, we offer a range of off-the-shelf carrier boards ideal for rapid development and prototyping, as well as full design services for custom carrier boards tailored to your exact requirements.
With experience in industries such as industrial military, audio/visual, and medical healthcare, BVM supports product development at every stage, helping customers bring new products to market faster.
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Smart Display Modules (1)
Intel Smart Display Modules for next generation commercial AIO displays and visual IoT devices. An Intel SDM provides the primary compute building block and requires an interface board on the displays or host system to complete the platform implementation and provide standard end user physical interface.