CPU: Intel 13th Gen (Raptor Lake-P) Core Processors i5-1340P
RAM: 2 x 260-pin SO-DIMM DDR4 3200 MHz, up to 64GB
Expansion: 1 x USB4, 5 x USB 3.2 Gen2, 1 x M.2 Key M, 1 x M.2 Key E (WiFi-6E Module)
Other features: 1 x Intel 2.5 Gigabit LAN, Supports Quad display, 2 x HDMI 2.0b, 2 x DP 1.4a (from Type-C), TPM 2.0 onboard IC, 12V~19V DC-In, 110.0 x 117.5 x 38mm, Slim Type Fanned Box PC
CPU: Intel 13th Gen (Raptor Lake-P) Core Processors i7-1360P
RAM: 2 x 260-pin SO-DIMM DDR4 3200 MHz, up to 64GB
Expansion: 1 x USB4, 5 x USB 3.2 Gen2, 1 x M.2 Key M, 1 x M.2 Key E (WiFi-6E Module)
Other features: 1 x Intel 2.5 Gigabit LAN, Supports Quad display, 2 x HDMI 2.0b, 2 x DP 1.4a (from Type-C), TPM 2.0 onboard IC, 12V~19V DC-In, 110.0 x 117.5 x 38mm, Slim Type Fanned Box PC
Other features: IP67-rated design, specifically for outdoor environments, High AI computing performance for GPU accelerated processing, -30°C to +50°C operating temperature range, 100 to 240 VAC wide range power input with 10kV surge protection, 4 N-jack antenna openings with water-proof design, 1 IEEE 802.3at GbE PoE (30W)
Expansion: Compact size with multiple COM, CANBus, and DIO for communication
Other features: CE and FCC certified and ISO 7637-2 compliant, Fanless and wide operating temperatures from -40°C to +70°C, Supports 9 to 36 VDC and 12/24 VDC typical in-vehicle power input, Smart Ignition for power on/off schedule, vehicle battery protection, and different power modes, Suitable for transportation gateway applications
CPU: 12th gen Intel Core i7/i5/i3 processor (Alder Lake-P)
RAM: 2 x DDR5-4800 SO-DIMM, up to 64GB
Expansion: Value-added modules available for various I/O requirements (COM/LAN/DIO/PoE/CAN/BNC)
Other features: CE, LVD, FCC, EN 50155, EN 45545-2 certified, 24 to 110 VDC for Railway applications, Intelligent solution of power management (ACC ignition), 2 swappable 2.5″ SATA drives
CPU: LGA1151 9th/8th Gen Intel Core i7/i5/i3, Celeron, Pentium, and Xeon processor (up to 65W) with Intel C246 (Coffee Lake)
RAM: 2 x 260-pin DDR4-2666 ECC/non-ECC SO-DIMM, up to 64GB
Expansion: Supports M.2 Key B and M.2 Key E for wireless communication module
Other features: CE, FCC, and E-Mark certified, Fanless and wide operating temperatures from -40°C to +70°C, Up to 8 GbE PoE port by RJ-45 connector type, Smart Ignition for power on/off schedule, vehicle battery protection, and different power modes, Convenient 2 hot-swappable HDD/SSD slots and flexible I/O windows
Other features: Multi Video Output (DVI/HDMI/Display Port), Isolation Power Protection 1.5KV, 4 x Digital Input / 4 x Digital Output, 8 x NMEA Port 0183, DNVGL-CG-0339, IEC60945 Certificate
CPU: 12th Generation Intel Core with Intel H610E/Q670E/R680E
RAM: Supports DDR4 SODIMM up to 64GB
Expansion: Three M.2 slots
Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Rich I/O connectivity: 2 GbE, 6 COM, 4 USB 3.1, 2 USB 2.0, Support 5G Communication, Operating Temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q4′ 36 (Based on Intel IOTG Roadmap)
Other features: High AI computing performance for GPU-accelerated processing, Ideal for edge AI smart city applications, Supports one 15W GbE PoE for camera, Wide operating temperature from -30°C to +60°C, Supports JetPack, Supports Allxon Device Management Solutions (Allxon DMS)
Other features: High AI computing performance for GPU-accelerated processing, Ideal for intelligent edge applications, AGV, AMR, and computer vision, Wide operating temperature from -30°C to +50°C, Supports JetPack
Other features: Wide power input range of 9 to 36 VDC (ignition by option), Supports four PoE for GigE cameras and LiDAR connectivity, -30°C to +60°C operating temperature range, Supports device management and optional out-of-band service powered by Allxon, Optional SerDes FPD-LINK III
Expansion: 3 x USB 3.2 Gen2, 2 x USB 2.0, 1 x M.2 Key M, 1 x M.2 Key E (WiFi-6E), 1 x SATA3
Other features: 1 x Realtek 1 Gigabit LAN (support DASH), 1 x Realtek 2.5 Gigabit LAN, Supports Quad display, 1 x HDMI 2.0a, 3 x DP 1.2a (2 from Type C), TPM 2.0 onboard IC, 19V/90W Power Adapter, 110.0 x 117.5 x 47.85mm, Fanned Box PC
Expansion: Dual GbE for GigE cameras and LiDAR connectivity, Dual COM/Dual CANbus/8-CH DI/DO
Other features: Hailo-8 AI processor, up to 26 TOPS, Advanced AI performance, ideal for smart city applications, Supports Wi-Fi/Bluetooth/5G/LTE wireless connection, Wide operating temperature from -20°C to +70°C, Supports Linux operating system
System Type: Fanless Stainless Steel Waterproof Box PC
CPU: Intel Elkhart Lake J6412
RAM: Dual channel support 3200MHz DDR4 SODIMM socket x 2, up to 32GB
Expansion: 2x M12 USB for USB1/2+3/4 ; 2x M12 COM ; 1x M12 LAN
Other features: IP66/69K Full Sealed with Anti-Corrosion Enclosure, IP67 M12 Stainless/Metal Connectors, M12 DC 12-28V with IP68 120W power adapter, 1x M12 DC ; 1x IP65 HDMI ; Power on/off bottom, 100% Waterproof Guarantee, CE, FCC, VCCI Class B Certified
System Type: Fanless Stainless Steel Waterproof Box PC
CPU: Intel Alder Lake Processor
RAM: Dual channel support 3200MHz DDR4 SODIMM socket x 2, up to 32GB
Expansion: 2x M12 USB for USB1/2+3/4 ; 2x M12 COM ; 1x M12 LAN
Other features: IP66/69K Full Sealed with Anti-Corrosion Enclosure, IP67 M12 Stainless/Metal Connectors, M12 DC 12-28V with IP68 120W power adapter, 1x M12 DC ; 1x IP65 HDMI ; Power on/off bottom, 100% Waterproof Guarantee, CE, FCC, VCCI Class B Certified
Expansion: 3 x USB 3.2 Gen2, 2 x USB 2.0, 1 x M.2 Key M, 1 x M.2 Key E (WiFi-6E), 1 x SATA3
Other features: 1 x Realtek 1 Gigabit LAN (support DASH), 1 x Realtek 2.5 Gigabit LAN, Supports Quad display, 1 x HDMI 2.0a, 3 x DP 1.2a (2 from Type C), TPM 2.0 onboard IC, 19V/90W Power Adapter, 110.0 x 117.5 x 47.85mm, Fanned Box PC
Other features: Hailo-8 AI processor, up to 26 TOPS, Palm size with high AI computing performance, Supports Wi-Fi/Bluetooth/5G/LTE wireless connection, Wide operating temperature from -10°C to +60°C, Wide voltage input from 12 to 24 VDC, Supports Windows 10 and Linux, Ideal for edge AI smart city applications
BVM Design and Manufacturing Services: The manufacturer behind the solutions you know
When a standard embedded design won’t suffice for what you need, you can always turn to BVM for help and use our custom design and manufacturing services.
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