RAM: Dual Channel DDR4 2666/2400 MHz by SODIMMs up to 64GB
Expansion: 4 x 802.3af POE Ports, Multiple Expansion Slots for 3G/LTE/5G Cellular Support
Other features: AI Accelerated: Up to 110W GPU MXM Module Supported, Extended Operating Temperature: -25°C to 70°C, Support 5G Communication, 15-Year CPU Life Cycle Support Until Q1′ 34 (Based on Intel IOTG Roadmap)
This product has multiple variants. The options may be chosen on the product page
RAM: Dual Channel DDR4 2666/2400 MHz by SODIMMs up to 64GB
Expansion: Multiple Expansion Slots for 3G/LTE/5G Cellular Support
Other features: AI-Enabled, 4 x M12 X-coded PoE Ports at 15W, AI Accelerated: Up to 110W GPU MXM Module Supported, Extended Operating Temperature: -25°C to 70°C Operation without Active Fan, Support 5G Communication, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
This product has multiple variants. The options may be chosen on the product page
System Type: AI-Enabled 5G MXM PoE High Performance System
CPU: 8th/9th Generation Intel Core Processors
RAM: Dual Channel DDR4 2666/2400 MHz by SODIMMs up to 64GB
Expansion: Multiple Expansion Slots for 3G/LTE/5G Cellular Support
Other features: 4 x RJ45 type PoE ports at 15W, AI Accelerated: Up to 110W GPU MXM Module Supported, Extended Operating Temperature: -25°C to 70°C, Support 5G Communication, 15-Year CPU Life Cycle Support Until Q1′ 34 (Based on Intel IOTG Roadmap)
This product has multiple variants. The options may be chosen on the product page
CPU: Intel 11th Gen (Tiger Lake-UP3) Core Processor – i3-1115G4
RAM: 2 x 260-pin SO-DIMM up to 64GB DDR4 3200 MHz
Expansion: 5 x USB 3.2 Gen2, 1 x M.2 Key M, 1 x M.2 Key E (WiFi-6 AX200), 1 x SATA3
Other features: 1 x Intel 1 Gigabit LAN, 1 x Intel 2.5 Gigabit LAN, Supports Quad display, 1 x HDMI 2.0a, 3 x DP 1.4 (2 from Type C), TPM onboard, 12V~19V DC-In, 110.0 x 117.5 x 47.85mm dimensions
CPU: Intel 12th Gen (Alder Lake-P) Core Processors
RAM: 2 x 260-pin SO-DIMM up to 64GB DDR4 3200 MHz
Expansion: 6 x USB 3.2 Gen2, 2 x USB 2.0, 1 x M.2 Key M, 1 x M.2 Key E, 1 x COM, 1 x SATA3
Other features: 2 x Intel 2.5 Gigabit LAN, Supports Quad display, 1 x HDMI 2.0b, 3 x DP 1.4a (2 from Type C), TPM 2.0 onboard IC, 19V/90W Power Adapter, 171.8 x 50.05 x 109.45 mm, Fanless Embedded BOX PC
CPU: Intel 11th Gen (Tiger Lake-UP3) Core Processor – i7-1165G7
RAM: 2 x 260-pin SO-DIMM up to 64GB DDR4 3200 MHz
Expansion: 5 x USB 3.2 Gen2, 1 x M.2 Key M, 1 x M.2 Key E (WiFi-6 AX200), 1 x SATA3
Other features: 1 x Intel 1 Gigabit LAN, 1 x Intel 2.5 Gigabit LAN, Supports Quad display, 1 x HDMI 2.0a, 3 x DP 1.4 (2 from Type C), TPM onboard, 12V~19V DC-In, 110.0 x 117.5 x 47.85mm dimensions, Fanned Barebone
CPU: Intel 12th Gen (Alder Lake-P) Core Processors
RAM: 2 x 260-pin SO-DIMM up to 64GB DDR4 3200 MHz
Expansion: 6 x USB 3.2 Gen2, 2 x USB 2.0, 1 x M.2 Key M, 1 x M.2 Key E, 1 x COM, 1 x SATA3
Other features: 2 x Intel 2.5 Gigabit LAN, Supports Quad display, 1 x HDMI 2.0b, 3 x DP 1.4a (2 from Type C), TPM 2.0 onboard IC, 19V/90W Power Adapter, 171.8 x 50.05 x 109.45 mm, Fanless Embedded BOX PC
CPU: Intel 12th Gen (Alder Lake-P) Core Processors
RAM: 2 x 260-pin SO-DIMM up to 64GB DDR4 3200 MHz
Expansion: 6 x USB 3.2 Gen2, 2 x USB 2.0, 1 x M.2 Key M, 1 x M.2 Key E, 1 x COM, 1 x SATA3
Other features: 2 x Intel 2.5 Gigabit LAN, Supports Quad display, 1 x HDMI 2.0b, 3 x DP 1.4a (2 from Type C), TPM 2.0 onboard IC, 19V/90W Power Adapter, 171.8 x 50.05 x 109.45 mm, Fanless Embedded BOX PC
RAM: 2 x 260-pin non-ECC/ECC SO-DIMM up to 64GB DDR4 3200 MHz
Expansion: 4 x USB 3.2 Gen2, 4 x USB 2.0, 1 x M.2 Key M, 1 x M.2 Key E, 1 x COM, 1 x SATA3
Other features: Supports Quad display, 1 x HDMI 2.0a, 3 x DP 1.2a (2 from Type C), TPM onboard, 12V~19V DC-In, 171.8 x 109.45 x 50.05mm, Fanless Barebone
RAM: 2 x 260-pin non-ECC/ECC SO-DIMM up to 64GB DDR4 3200 MHz
Expansion: 4 x USB 3.2 Gen2, 4 x USB 2.0, 1 x M.2 Key M, 1 x M.2 Key E, 1 x COM, 1 x SATA3
Other features: 1 x Realtek 1 Gigabit LAN, 1 x Realtek 2.5 Gigabit LAN, Supports Quad display, 1 x HDMI 2.0a, 3 x DP 1.2a (2 from Type C), TPM onboard, 12V~19V DC-In, 171.8 x 109.45 x 50.05mm, Fanless Barebone
CPU: Intel 11th Gen (Tiger Lake-UP3) Core i3-1115G4E Processor
RAM: 2 x 260-pin SO-DIMM up to 64GB DDR4 3200 MHz
Expansion: 6 x USB 3.2 Gen2, 2 x USB 2.0, 1 x M.2 Key M, 1 x M.2 Key E, 1 x COM, 1 x SATA3
Other features: 1 x Intel 1 Gigabit LAN, 1 x Intel 2.5 Gigabit LAN, Supports Quad display, 1 x HDMI 2.0a, 3 x DP 1.4a (2 from Type C), TPM onboard, 12V~19V DC-In, 171.8 x 50.05 x 109.45 mm, Fanless Embedded BOX PC
Other features: High performance Radeon VEGA series graphics, 4 DP++ 4K monitor support (V1000), Comprehensive gaming features, 12V DC single input, 10-Year CPU Life Cycle Support
This product has multiple variants. The options may be chosen on the product page
CPU: Intel 11th Gen (Tiger Lake-UP3) Core i5-1145G7E Processor
RAM: 2 x 260-pin SO-DIMM up to 64GB DDR4 3200 MHz
Expansion: 6 x USB 3.2 Gen2, 2 x USB 2.0, 1 x M.2 Key M, 1 x M.2 Key E, 1 x COM, 1 x SATA3
Other features: 1 x Intel 1 Gigabit LAN, 1 x Intel 2.5 Gigabit LAN, Supports Quad display, 1 x HDMI 2.0a, 3 x DP 1.4a (2 from Type C), TPM onboard, 12V~19V DC-In, 171.8 x 50.05 x 109.45 mm, Fanless Embedded BOX
CPU: Intel 11th Gen (Tiger Lake-UP3) Core i7-1185G7E Processor
RAM: 2 x 260-pin SO-DIMM up to 64GB DDR4 3200 MHz
Expansion: 6 x USB 3.2 Gen2, 2 x USB 2.0, 1 x M.2 Key M, 1 x M.2 Key E, 1 x COM, 1 x SATA3
Other features: 1 x Intel 1 Gigabit LAN, 1 x Intel 2.5 Gigabit LAN, Supports Quad display, 1 x HDMI 2.0a, 3 x DP 1.4a (2 from Type C), TPM onboard, 12V~19V DC-In, 171.8 x 50.05 x 109.45 mm, Fanless Embedded BOX PC
BVM Design and Manufacturing Services: The manufacturer behind the solutions you know
When a standard embedded design won’t suffice for what you need, you can always turn to BVM for help and use our custom design and manufacturing services.
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