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Industrial Motherboards and Embedded SBCs

Industrial Motherboards and SBCs are built to perform in diverse environments – from standard operating temperatures of 0°C to 50°C to extreme conditions ranging from -40°C to +85°C. We offer a choice of CPUs, from low-power Atom and ARM for to high-performance iCore and Ryzen. Whether you need efficient computing or powerful performance, our boards are designed to meet the challenges of industrial environments. • BVM Product Finder • Motherboard vs SBC vs COM Module: Which One is Right for You?

  • PICO AM62 1
    AAEON PICO-AM62 ARM Quad 64-bit AM62x Cortex-A53 Pico-ITX SBC
    • Product Name: AAEON PICO-AM62
    • Motherboard Form Factor: Pico-ITX
    • CPU: TI AM62x, up to Quad 64-bit Arm Cortex-A53
    • RAM: Up to 4GB DDR4
    • Expansion: Mini Card x2 (1 half-size, 1 full-size)
    • Other features: eMMC 5.1, HDMI 1.4b, LVDS, GbE x2, USB 2.0 x3, COM x4, CAN x2, TPM 2.0
  • PICO IMX8PL 2
    AAEON PICO-IMX8PL ARM Quad-Core Cortex-A53 Pico-ITX SBC
    • Product Name: AAEON PICO-IMX8PL
    • Motherboard Form Factor: Pico-ITX
    • CPU: NXP i.MX8M Plus Quad-Core Cortex-A53, 1.6GHz
    • RAM: Up to 4GB LPDDR4 (8GB available on request)
    • Expansion: M.2 2230 E Key x1, Full-sized Mini Card x1
    • Other features: HDMI 2.0, LVDS, GbE x2, USB 3.0 x2, USB 2.0 x1, COM x2, CAN x2, TPM 2.0, GPIO x8, support for Hailo-8 AI Accelerator
  • M93053 1
    DFI M93053 i.MX93 2.5″ Pico-ITX SBC
    • Product Name: DFI M93053
    • Motherboard Form Factor: 2.5″ Pico-ITX
    • CPU: NXP i.MX93
    • RAM: 2GB LPDDR4
    • Expansion: M.2 3042, CAN bus
    • Other Features: Dual GbE LAN, 9–36VDC wide voltage support, 15-year CPU lifecycle (until Q2 2038)
  • QCS6490 1
    DFI QCS051 Qualcomm QCS6490 2.5″ Pico-ITX SBC
    • Product Name: DFI QCS051
    • Motherboard Form Factor: 2.5″ Pico-ITX
    • CPU: Qualcomm QCS6490 high-level platform
    • RAM: LPDDR5x, 4GB/8GB
    • Expansion: 2x M.2 slots (1x M.2 E key 2230, 1x M.2 B key 3052)
    • Other Features: Designed for AMR and box PC applications, ruggedized thin client concept
  • M8MP553 1
    DFI M8MP553 NXP i.MX 8M 3.5″ SBC
    • Product Name: DFI M8MP553
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: NXP i.MX8M plus Processors
    • RAM: 2GB/4GB LPDDR4
    • Expansion: M.2 2230/3052: 1 M.2 B key for PCIe
    • Other features: 2 GbE LAN for automation application, CANbus for automation equipment integration, 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on NXP Roadmap)
  • FS053
    DFI FS053 NXP i.MX6 2.5″ Fanless Pico-ITX SBC
    • Product Name: DFI FS053
    • Motherboard Form Factor: 2.5″ Pico-ITX
    • CPU: NXP i.MX6 Processor
    • RAM: DDR3L SDRAM memory down, up to 4GB
    • Expansion: 1 Mini PCIe, 1 SD
    • Other features: Dual independent displays: HDMI + LVDS, Rich I/O: 2 GbE, 2 COM, 4 USB 2.0, 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on NXP Roadmap)
  • FS051
    DFI FS051 NXP i.MX6 2.5″ Fanless Pico-ITX SBC
    • Product Name: DFI FS051
    • Motherboard Form Factor: 2.5″ Pico-ITX
    • CPU: NXP i.MX6 Processor
    • RAM: DDR3L SDRAM memory down, up to 4GB
    • Expansion: 1 Mini PCIe, 1 SD, 1 SIM (Optional)
    • Other features: Dual independent displays: HDMI + LVDS, Rich I/O: 1 GbE, 3 COM, 5 USB 2.0, 1 CANBus, 15-Year CPU Life Cycle Support Until Q4′ 32 (Based on NXP Roadmap)
  • M8M051
    DFI M8M051 NXP i.MX 8M 2.5″ Pico-ITX SBC
    • Product Name: DFI M8M051
    • Motherboard Form Factor: 2.5″ Pico-ITX
    • CPU: NXP i.MX 8M Processors
    • RAM: Single Channel LPDDR4 up to 3200 MHz
    • Expansion: Multiple Expansion: 1 M.2 B Key, 1 M.2 E Key
    • Other features: Single Display: HDMI/LVDS (HDMI: resolution up to 4096×2160 @60Hz / LVDS: resolution up to 1920×1080 @60Hz), Rich I/O: 1 Intel GbE, 3 COM, 2 USB 3.1 Gen1, 3 USB 2.0, 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on NXP Roadmap)