DFI QCS051 Qualcomm QCS6490 2.5″ Pico-ITX SBC

  • Product Name: DFI QCS051
  • Motherboard Form Factor: 2.5″ Pico-ITX
  • CPU: Qualcomm QCS6490 high-level platform
  • RAM: LPDDR5x, 4GB/8GB
  • Expansion: 2x M.2 slots (1x M.2 E key 2230, 1x M.2 B key 3052)
  • Other Features: Designed for AMR and box PC applications, ruggedized thin client concept

Description

The DFI QCS051 is a reliable and efficient 2.5″ Pico-ITX SBC (PC Here) designed for industrial and AI applications. Powered by the Qualcomm® QCS6490 SoC with an 8-core processor reaching up to 2.7 GHz, it ensures seamless performance even in demanding environments. With a powerful AI Engine delivering 12 TOPS, it excels in AI-driven applications, from edge computing to advanced machine learning. The integrated Qualcomm® Adreno™ 643L GPU enhances graphics performance for visual-intensive tasks. Featuring up to 8GB LPDDR5x RAM and dual M.2 expansion slots, the QCS051 is a robust solution built for longevity, with CPU life cycle support until 2036.

Key Features

  • Qualcomm QCS6490 high-level platform
  • Target on AMR, box PC application
  • Thin client concept and ruggedize
  • 2 M.2 Expansions: 1 M.2 E key 2230, 1 M.2 B key 3052
  • Supports CPU Life Cycle Until 2036

Specification

Category Specification
System  
Processor QCS6490: Qualcomm® Kryo™ 670, 8 cores, up to 2.7 GHz, 12 TOPS (INT8)
QCS5430 (FP1): Qualcomm® Kryo™ 670, 8 cores, up to 2.1 GHz, 3.5 TOPS (INT8)
Memory LPDDR5x, 4GB/8GB
Graphics  
Controller Qualcomm® Adreno™ 643L GPU
Feature OpenGL ES 3.2
Display  
HDMI 1 x HDMI Type A with audio, 1080P support on Linux
Single Display HDMI
Storage  
UFS Supports UFS 3.1, default 128GB
Expansion  
Interface 1 x M.2 B key 3052 (USB 3.1 / Opt. USB 2.0) – Reference RM502Q-AE Quectel
1 x Nano SIM slot
1 x M.2 E key 2230 (PCIe x1) – Reference ENL-Q6856M2 Wi-Fi module
Audio  
Audio Codec WCD9385
Ethernet  
Controller AX88179A USB3 to GbE controller
Rear I/O  
Ethernet 1 x GbE (RJ-45)
USB 2 x USB 3.1 Gen1 Type A
Display 1 x HDMI 1.4
Audio 1 x Line Out / Mic In audio jack
Debug 1 x Micro USB debug UART
Internal I/O  
Serial 1 x RS-232 (COM1, 1x5P/1.00mm)
USB 3 x USB 2.0 (UBJ1/2/4, 1x4P/1.25mm), UBJ4 can be optionally assigned to M.2 B key
1 x USB Type C (Download only)
DIO 1 x 8-bit DIO
SD 1 x uSD3.0 card
CANBus 1 x CAN FD
Other I/O 1 x Ext. IO (1x12P/1.25mm), 1 x Power LED, 1 x System LED, 1 x Front Panel
1 x Fan connector (upon request)
Camera 2 x MIPI-CSI2 for 4-lane camera, reference to IMX577
Power  
Type 5VDC
Connector 2-pin Power Jack
Consumption Typical: QCS6490: 5V @ 0.6A (3.0W)
Max.: QCS6490: 5V @ 1.45A (7.25W)
RTC Battery CR2032 Coin Cell
OS Support Ubuntu 20.04 (Linux Kernel 5.4.233)
Environment  
Temperature Operating: 0°C ~ 60°C, -25°C ~ 75°C
Storage: -40°C ~ 85°C
Humidity Operating: 5% ~ 90% RH
Storage: 5% ~ 90% RH
Mechanism  
Dimensions 2.5″ Pico-ITX Form Factor
100mm (3.94″) x 72mm (2.83″)
Height PCB: 1mm
Top Side: 16.44mm
Bottom Side: 3.45mm
Standards and Certifications CE, FCC, RoHS, UKCA
Packing List 1 x QCS051 board
Heat spreader (Height: 11mm) – A71-808357-000G
Country of Origin Taiwan

Ordering Information

Model Name Part Number Description
QCS051-BCC-4890 770-QCS0511-000G Qualcomm® QCS6490, LPDDR5x 4GB, 128GB UFS 3.1, HDMI, 1 GbE, 2 USB 3.1 Gen1, 3 USB 2.0, 1 RS-232, 5VDC Power, Fanless, 0 to 60°C
QCS051-ECC-8890 770-QCS0511-100G Qualcomm® QCS6490, LPDDR5x 8GB, 128GB UFS 3.1, HDMI, 1 GbE, 2 USB 3.1 Gen1, 3 USB 2.0, 1 RS-232, 5VDC Power, Fanless, -25 to 75°C
QCS051-BCC-4830 770-QCS0511-300G Qualcomm® QCS5430, LPDDR5x 4GB, 128GB UFS 3.1, HDMI, 1 GbE, 2 USB 3.1 Gen1, 3 USB 2.0, 1 RS-232, 5VDC Power, Fanless, 0 to 60°C

BVM Customisation Service

Design | Develop | Test | Manufacture

If you cant find an off the shelf product that meets your specific requirements speak with our in house design team who can customize an existing product or design a new product from start to finish. With extensive industrial and embedded computing experience, we deliver reliable, high-performance solutions tailored to your requirements.

 

Here’s a selection of our design, manufacturing & associated services: –

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Design to Order: OEM/ODM Embedded Product Design Services

For customers designing a new product or working with an existing prototype.

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Build to Order: Computer Design and Customisation Services​

Take an existing system and we can:

Build to Order: Racks and Towers, Peli Case PCs and Mini-ITX PCs

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Embedded Software: Configuration, Integration and Deployment

Porting, Integration & Deployment

 

ALL OUR DESIGN AND MANUFACTURING SERVICES INCLUDE:

Testing

Testing

Lifecycle

Materials Management

Logistics

Logistics and Tracking

Manufacturing

External Manufacturing

• Burn in Test
• Temp / Thermal Testing
• Environmental Testing
• Safety Testing
• Software Compatibility Test
• Vendor Selection and Component Procurement
• Product Traceability
• Obsolescence, End of Life and Last Time Procurement Management
• Simple to use on-line RMA System
• Traceability of Shipments
• Product Labelling
• OEM/Branded Packaging
• System Branding
• Custom Labels
• Surface Mount: – High Speed Placement
• Conventional Through Hole Insertion & Assembly
• Automated Optical Inspection
• Bespoke PCB Test

 

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