Other features: 2 GbE LAN for automation application, CANbus for automation equipment integration, 15-Year CPU Life Cycle Support Until Q1′ 36 (Based on NXP Roadmap)
CPU: 12th gen Intel® Core™ i7/i5/i3 processor (Alder Lake-P)
RAM: 2 x DDR5-4800 SO-DIMM, up to 64GB
Expansion: Value-added modules available for various I/O requirements (COM/LAN/DIO/PoE/CAN/BNC)
Other features: CE, LVD, FCC, EN 50155, EN 45545-2 certified, 24 to 110 VDC for Railway applications, Intelligent solution of power management (ACC ignition), 2 swappable 2.5″ SATA drives
CPU: LGA1151 9th/8th Gen Intel® Core™ i7/i5/i3, Celeron®, Pentium®, and Xeon® processor (up to 65W) with Intel® C246 (Coffee Lake)
RAM: 2 x 260-pin DDR4-2666 ECC/non-ECC SO-DIMM, up to 64GB
Expansion: Supports M.2 Key B and M.2 Key E for wireless communication module
Other features: CE, FCC, and E-Mark certified, Fanless and wide operating temperatures from -40°C to +70°C, Up to 8 GbE PoE port by RJ-45 connector type, Smart Ignition for power on/off schedule, vehicle battery protection, and different power modes, Convenient 2 hot-swappable HDD/SSD slots and flexible I/O windows
Other features: Multi Video Output (DVI/HDMI/Display Port), Isolation Power Protection 1.5KV, 4 x Digital Input / 4 x Digital Output, 8 x NMEA Port 0183, DNVGL-CG-0339, IEC60945 Certificate
CPU: 12th Generation Intel Core with Intel H610E/Q670E/R680E
RAM: Supports DDR4 SODIMM up to 64GB
Expansion: Three M.2 slots
Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Rich I/O connectivity: 2 GbE, 6 COM, 4 USB 3.1, 2 USB 2.0, Support 5G Communication, Operating Temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q4′ 36 (Based on Intel IOTG Roadmap)
CPU: Intel® 13th Gen Core™ Processors with R680E Chipset
RAM: 4 x 260-pin DDR4 SO-DIMM up to 128GB (32GB per DIMM)
Expansion: 1 x PCIe x16 (PCIe Gen4) or 2 x PCIe x8 (PCIe Gen4), 2 x PCIe x 4 (PCIe Gen4), 1 x M.2 Key M, 1 x M.2 Key B, 1 x M.2 Key E, 2 x Mini PCIe
Other features: 6 x USB 3.2 Gen2x1, 6 x COM, 4 x SATA3, 8 x DI, 8 x DO, 5 x Intel 2.5G LAN (2 support PoE, 1 supports vPro), 1 x Displayport, 1 x HDMI 2.0b, 1 x VGA, Powerful Edge AI acceleration enabled by the most flexible mechanical, thermal, and power design, with support for 275mm x 124 mm x 60mm (L x H x D) max. and up to 255W graphic card
Other features: IP65 Front Panel Protection, Rich I/O: 1 GbE, 2 COM, 1 CAN Bus, 2 USB 3.1 Gen1, 1 HDMI, Application Focus: In-Vehicle Driver HMI, Smart Power Ignition Control: Power delay and protection time setting
CPU: Intel Tiger Lake i5-1135G7 2.4GHz/QC processor (HPC270C-DCP1135G7) or Intel Tiger Lake 6305E 1.8GHz/DC processor (HPC270C-DCP6305E)
RAM: 2* DDR4 SO-DIMM (Max 64GB)
Expansion: Support for easy HDD and DARM installation, Support Cable-less design
Other features: 300 nits TFT LCD with LED backlight, LG in-cell 10-points Multi Capacitive Touch, A true Flat and Slim Design, Clear Image, support Cover-Glass Elimination, 12-36V DC-input Support, with Electrical Over Stress (EOS), OVP design
Product Name: Jetway Tiger Lake iCore Industrial Panel PC
Screen Size: 15″, 17″, 19″, 23.8″, 27″, or 32″ TFT LCD with LED backlight
CPU: Intel® Tiger Lake i5-1135G7 2.4GHz/QC processor
RAM: 2* DDR4 SO-DIMM (Max 64GB)
Expansion: Not specified
Other features: 5 Wire Resistive Touch/Anti-Reflection Protection Glass, Support Open frameless design, Easy HDD and RAM installation, cable-free design, 2-36V DC-in, with Electrical Over Stress (EOS) and OVP design, Front bezel meets IP65-rated protection
Product Name: Jetway Tiger Lake Celeron IP65 Panel PC
Screen Size: 15″, 17″, 19″, 23.8″, 27″, or 32″ TFT LCD with LED backlight
CPU: Intel® Tiger Lake 6305E processor
RAM: 2* DDR4 SO-DIMM (Max 64GB)
Expansion: Not specified
Other features: 5 Wire Resistive Touch/Anti-Reflection Protection Glass, Support Open frameless design, Easy HDD and RAM installation, cable-free design, 2-36V DC-in, with Electrical Over Stress (EOS) and OVP design, Front bezel meets IP65-rated protection
Product Name: Kingdy 11th Gen Rugged Stainless Steel Panel PC Series
Screen Size: 12″ – 24″
CPU: 11th Gen Intel Core Celeron 6305E / i3-1115G4E / i5-1145G7E / i7-1185G7E and Intel Elkhart Lake ATOM X series processors
RAM: DDR4 So-DIMM up to 64GB
Expansion: True Flat PCT or 5 Wires Resistive touch solution
Other features: Fanless and Rugged Stainless Steel Design, Standard and High Brightness Display, Resolution 1024×768 to 1920×1080, IP65 Stainless Steel front bezel, Operating Temperature: Standard (0 ~ 45°C) and Wide Temp (-20 ~ 60°C)
CPU: Intel® 13th Gen Core™ Processors with H610 Chipset
RAM: 2 x 260-pin DDR4 SO-DIMM up to 64GB (32GB per DIMM)
Expansion: 1 x PCIe x16 (PCIe Gen4), 1 x M.2 Key B, 1 x M.2 Key E, 2 x Mini PCIe
Other features: 2 x USB 3.2 Gen2x1, 2 x USB 3.2 Gen1x1, 2 x USB 2.0, 6 x COM, 4 x SATA3, 8 x DI, 8 x DO, 4 x Intel 2.5G LAN (2 support PoE), 1 x Displayport, 1 x HDMI 2.0b, 1 x VGA, Powerful Edge AI acceleration enabled by the most flexible mechanical, thermal, and power design, with support for 275mm x 124 mm x 60 mm (L x H x D) max. and up to 255W graphic card
Other features: High AI computing performance for GPU-accelerated processing, Ideal for edge AI smart city applications, Supports one 15W GbE PoE for camera, Wide operating temperature from -30°C to +60°C, Supports JetPack, Supports Allxon Device Management Solutions (Allxon DMS)
Other features: 1920 x 1080 FHD LED panel with direct optical bonding, Anti-glare technology for sunlight readability, Dual battery with hot-swappable design, Flip design for quick switching between rugged laptop and rugged tablet modes, Magnesium alloy enclosure with double injection for drop protection, Integrated smart card reader
Other features: High AI computing performance for GPU-accelerated processing, Ideal for intelligent edge applications, AGV, AMR, and computer vision, Wide operating temperature from -30°C to +50°C, Supports JetPack
Other features: Wide power input range of 9 to 36 VDC (ignition by option), Supports four PoE for GigE cameras and LiDAR connectivity, -30°C to +60°C operating temperature range, Supports device management and optional out-of-band service powered by Allxon, Optional SerDes FPD-LINK III
Expansion: 3 x USB 3.2 Gen2, 2 x USB 2.0, 1 x M.2 Key M, 1 x M.2 Key E (WiFi-6E), 1 x SATA3
Other features: 1 x Realtek 1 Gigabit LAN (support DASH), 1 x Realtek 2.5 Gigabit LAN, Supports Quad display, 1 x HDMI 2.0a, 3 x DP 1.2a (2 from Type C), TPM 2.0 onboard IC, 19V/90W Power Adapter, 110.0 x 117.5 x 47.85mm, Fanned Box PC
Expansion: Dual GbE for GigE cameras and LiDAR connectivity, Dual COM/Dual CANbus/8-CH DI/DO
Other features: Hailo-8™ AI processor, up to 26 TOPS, Advanced AI performance, ideal for smart city applications, Supports Wi-Fi/Bluetooth/5G/LTE wireless connection, Wide operating temperature from -20°C to +70°C, Supports Linux operating system
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