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Industrial Computers | Embedded Systems | Boards & Modules

  • TWISTER CI370D 1

    LEX TWISTER CI370D 8th/9th Gen PCIe Fanless Industrial Computer

    • Product Name: Lex TWISTER CI370D
    • System Type: PCIe Fanless Embedded Computer
    • CPU: Intel 8th/9th Gen Coffee Lake-S i7/i5/i3/Pentium/Celeron CPU
    • RAM: 2 x DDR4 SODIMM socket, Max. 64GB
    • Expansion: 9 x Intel GbE LAN, 2 x SFP Fiber, 4 x USB 3.1, 2 x COM, 1 x M.2 B Key, 2 x SIM, 2 x Mini PCIe, 1 x PCIe x 16 (PCIe x 16 + PCIe x 4 Signal)
    • Other features: Intel Q370 Chipset, Multiple Independent display: HDMI, DP
  • TINOL CI370D 1

    LEX TINO CI370D 8th/9th Gen Fanless Embedded Computer

    • Product Name: Lex TINO CI370D
    • System Type: Fanless Embedded Computer
    • CPU: Intel 8th/9th Gen Coffee Lake-S i7/i5/i3/Pentium/Celeron
    • RAM: 2 x DDR4 SODIMM socket, Max. 64GB
    • Expansion: 1 x M.2 B Key, 2 x SIM, 2 x Mini PCIe
    • Other features: Intel Q370 Chipset, Multiple Independent display: HDMI, DP, 9 x Intel GbE LAN, 2 x SFP Fiber, 4 x USB 3.1, 2 x COM
  • CS181 Front062420 R1 w600

    DFI CS181-H310 8th/9th Gen Intel iCore MXM Mini-ITX Motherboard

    • Product Name: DFI CS181-H310
    • Motherboard Form Factor: Mini-ITX
    • CPU: 8th/9th Generation Intel Core Processors
    • RAM: 2 DDR4 2400/2666MHz SODIMM up to 32GB
    • Expansion: Multiple Displays: 1 LVDS/eDP, 1 DP++/HDMI (autodetection), 4 DP; Multiple Expansions: 1 MXM Type-A/B, 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
    • Other features: Storage: 2 SATA 3.0; Rich I/O: 6 Intel GbE, 2 COM, 4 USB 3.1 Gen1, 6 USB 2.0; 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on Intel IOTG Roadmap)
  • CS181 Front062420 R1 w600

    DFI CS181-Q370 8th/9th Gen Intel iCore MXM Mini-ITX Motherboard

    • Product Name: DFI CS181-Q370
    • Motherboard Form Factor: Mini-ITX
    • CPU: 8th/9th Generation Intel Core Processors
    • RAM: 2 DDR4 2400/2666MHz SODIMM up to 32GB
    • Expansion: Multiple Displays: 1 LVDS/eDP, 1 DP++/HDMI (autodetection), 4 DP; Multiple Expansions: 1 MXM Type-A/B, 1 M.2 M Key, 1 M.2 B Key, 1 M.2 E Key
    • Other features: Storage: 2 SATA 3.0; Rich I/O: 6 Intel GbE, 2 COM, 4 USB 3.1 Gen2, 6 USB 2.0; 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on Intel IOTG Roadmap)
  • WLPM 924 S

    Wincomm WLPM-V24 24″ AMD Ryzen Modular Industrial Panel PC

    • Product Name: Wincomm WLPM-V24
    • Screen Size: 24″
    • CPU: AMD Ryzen CPU, V1605B, QC, 2GHz, 12-25W
    • RAM: Dual Channel DDR4 2400 MHz (V1605B/ V1202B), 32 GB
    • Expansion: Optional Expansion Slot PCIex8
    • Other features: Modular Design with Panel Size 23.8”, Front IP66 Waterproof and Dustproof, Panel Mount, Fanless with Smart Thermal Control, Full Flat Design with Resistive or P-cap Touch, CE, FCC, VCCI Class B Passed
  • WLPM 915 S

    Wincomm WLPM-V15 15″ AMD Ryzen Modular Industrial Panel PC

    • Product Name: Wincomm WLPM-V15
    • Screen Size: 15″
    • CPU: AMD Ryzen CPU, V1605B, QC, 2GHz, 12-25W
    • RAM: Dual Channel DDR4 2400 MHz (V1605B/ V1202B), 32 GB
    • Expansion: Optional Expansion Slot PCIex8
    • Other features: Modular Design with Panel Size 15”, Front IP66 Waterproof and Dustproof, Panel Mount, Fanless with Smart Thermal Control, Full Flat Design with Resistive or P-cap Touch, CE, FCC, VCCI Class B Passed
  • WLPM 924 S

    Wincomm WLPM-V22 22″ AMD Ryzen Modular Industrial Panel PC

    • Product Name: Wincomm WLPM-V22
    • Screen Size: 22″
    • CPU: AMD Ryzen CPU, V1605B, QC, 2GHz, 12-25W
    • RAM: Dual Channel DDR4 2400 MHz (V1605B/ V1202B), 32 GB
    • Expansion: Optional Expansion Slot PCIex8
    • Other features: Modular Design with Panel Size 21.5”, Front IP66 Waterproof and Dustproof, Panel Mount, Fanless with Smart Thermal Control, Full Flat Design with Resistive or P-cap Touch, CE, FCC, VCCI Class B Passed
  • WLPM 915 Intel

    Wincomm WLPM Series 15″ – 24″ Modular Industrial Panel PC Series

    • Product Name: Wincomm WLPM Coffee Lake-S Modular Panel PC Series
    • Screen Size: 15″ – 24″
    • CPU: Intel Coffee Lake-S Core Processors
    • RAM: Dual Channel Support 2666MHz DDR4 SODIMM X2, up to 32GB
    • Expansion: Optional Expansion Slot PCIe x16
    • Other features: Modular Design with Panel Size 15” – 24″, Front IP66 Waterproof and Dustproof, Panel Mount, Fanless with Smart Thermal Control, Full Flat Design with Resistive or P-cap Touch, CE, FCC, VCCI Class B Passed, Optional AI Vision Accelerator Card Ready
    This product has multiple variants. The options may be chosen on the product page
  • WMP 19K main

    Wincomm WMP-19K GTX 1060 19″ Medical AI Panel PC

    • Product Name: Wincomm WMP-19K GTX 1060
    • Screen Size: 19″
    • CPU: Intel 8th/9th Generation Core i5/i7
    • RAM: Supports Dual Channel DDR4 up to 64GB
    • Expansion: Support PCIe Expansion for Intel Movidius Vision AI Card
    • Other features: Anti-Bacteria (MRSA) Plastic Housing & Touch, 19″ 1280×1024 LCD Diagnostic Panel, EN/UL 60601-1 Safety & EMC Latest Version & MDR Certification Ready, Independent GeForce GTX 1060 Graphic Card with 6GB dedicated video memory
  • WMP 24K main

    Wincomm WMP-24K RTX 2060 23.8″ Medical AI Panel PC

    • Product Name: Wincomm WMP-24K RTX 2060
    • Screen Size: 23.8″
    • CPU: Intel 8th/9th Generation Core i7/i5
    • RAM: Two 2666 MHz DDR4 SODIMM socket support dual Channel, non-ECC, up to 64GB
    • Expansion: Optional PCIe Expansion for Intel Movidius AI Kits
    • Other features: 23.8″ 16:9 1920 x 1080 FHD & Optional 3840 X 2160 UHD Diagnostic Panel, Medical Latest MDR/EN/UL 60601-1 & 60601-1-2 Certifications, Anti-bacteria Hospital White Plastic Housing, Front IP65 Ingress Protection & IPX1 Whole System, Optional Independent GeForce RTX 2060 Graphic Card
  • GHF51B190606w600

    DFI GHF51 1.8″ AMD Ryzen SBC – Industrial Pi – Dev Kit

    • Product Name: DFI GHF51-R1102G
    • Motherboard Form Factor: 1.8″ SBC
    • CPU: AMD Ryzen Embedded R1000 Series
    • RAM: Single Channel DDR4 Memory Down up to 4GB/8GB
    • Expansion: Expansion and Storage: 1 Mini PCIe, 1 SMBus
    • Other features: Small form factor for space-limited applications, HDMI 1.4 resolution supports up to 4096×2160 @ 24Hz, Rich I/O: 1 Intel GbE, 1 USB 3.1 Gen 2, 2 Micro HDMI, 10-Year CPU Life Cycle Support Until Q1’30 (Based on AMD Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • EC51X CSSide210310R1 w600

    DFI EC510-CS/EC511-CS 8th/9th Gen 5G Fanless Industrial Computer

    • Product Name: DFI EC510-CS/EC511-CS
    • System Type: Fanless Embedded System
    • CPU: 8th/9th Gen Intel Core
    • RAM: Supports DDR4 SODIMM up to 64GB
    • Expansion: 1 PCIe and 3 M.2 slots support NVMe
    • Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Support 4 PoE (EC51x-CS6G86E-Q), Support 5G Communication, Operating Temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
  • EC543 CSSide210324 w600

    DFI EC543-CS 8th/9th Gen 5G Fanless Industrial Computer

    • Product Name: DFI EC543-CS
    • System Type: Fanless Embedded System
    • CPU: 8th/9th Gen Intel Core
    • RAM: Supports DDR4 SODIMM up to 64GB
    • Expansion: 3 PCIe, 1 PCI, and 3 M.2 slots support NVMe
    • Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Support 4 PoE (EC543-CS6G86E-Q configuration), Support 5G communication, Operating temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
  • EC500 CSSide200824 w600

    DFI EC500-CS 8th/9th Gen 5G Fanless Embedded System

    • Product Name: DFI EC500-CS
    • System Type: Fanless Embedded System
    • CPU: 8th/9th Gen Intel Core
    • RAM: Supports DDR4 SODIMM up to 64GB
    • Expansion: 3 M.2 slots support NVMe
    • Other features: Three independent displays: 1 VGA + 2 HDMI/DP++ (auto detection), Rich I/O connectivity: 2 GbE, 4 COM, 4 USB 3.1, 2 USB 2.0 (Q370 only), Support 5G Communication, Operating Temperature: -20 to 70°C, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
  • EC90ASide210324 w600

    DFI EC90A-GH AMD Ryzen Ultra Compact Fanless Embedded System

    • Product Name: DFI EC90A-GH
    • System Type: Ultra Small Mini PC Fanless Embedded System
    • CPU: AMD Ryzen Embedded R1000 Series
    • RAM: DDR4 2400 MHz SODIMM down up to 4GB/8GB (memory onboard)
    • Expansion: 1 x Mini-PCIe (PCIe signal)
    • Other features: Ultra Small Size: 110 x 80mm x 60mm (W x H x D), User-friendly design for installing SIM card, I/O: 1 Intel GbE, 1 USB 3.1 Gen 2, 2 Micro HDMI, 10-Year CPU Life Cycle Support Until Q1’30 (Based on AMD Roadmap)
    This product has multiple variants. The options may be chosen on the product page