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Industrial Computers | Embedded Systems | Boards & Modules

  • APC 3072 1

    APLEX APC-3072 7″ Fanless IP66 E3845 Vehicle Management Panel PC

    • Product Name: Aplex APC-3072
    • Screen Size: 7″
    • CPU: Intel Atom Processor E3845
    • RAM: 4GB DDR3L Memory onboard
    • Expansion: 1 x Mini-PCIe full size for option 3G/LTE/GPS, 1 x Mini-PCIe half size slot for option WIFI/BT, 1 x SIM slot onboard, 1 x SMA connector for option GPS antenna
    • Other features: High Brightness LED Backlight LCD, Rugged Engineering Plastics Enclosure and Fanless Design, 6~36V DC Wide-ranging Power Input, HDD/SSD: 1 x Micro SD onboard, 1 x mSATA MO-300 slot
  • APC 3082 1

    APLEX APC-3082 8″ Fanless IP66 E3845 Vehicle Management Panel PC

    • Product Name: Aplex APC-3082
    • Screen Size: 8″
    • CPU: Intel Atom Processor E3845
    • RAM: 4GB DDR3L Memory onboard
    • Expansion: 1 x Mini-PCIe full size for option 3G/LTE/GPS, 1 x Mini-PCIe half size slot for option WIFI/BT, 1 x SIM slot onboard, 1 x SMA connector for option GPS antenna
    • Other features: High Brightness LED Backlight LCD, Rugged Engineering Plastics Enclosure and Fanless Design, 6~36V DC Wide-ranging Power Input, HDD/SSD: 1 x Micro SD onboard, 1 x mSATA MO-300 slot
  • NUC 1185G7EL1

    ASRock Industrial NUC-1185G7E 11th Gen Tiger Lake Edge AI NUC SBC

    • Product Name: ASRock Industrial NUC-1185G7E Edge AI NUC SBC
    • Motherboard Form Factor: NUC
    • CPU: Intel 11th Gen (Tiger Lake-UP3) Core Processors
    • RAM: 2 x 260-pin SO-DIMM DDR4 3200 MHz, up to 64GB
    • Expansion: 6 x USB 3.2 Gen2, 2 x USB 2.0, 1 x M.2 Key M, 1 x M.2 Key E, 1 x COM, 1 x SATA3
    • Other features: 1 x Intel 1 Gigabit LAN, 1 x Intel 2.5 Gigabit LAN, Supports Quad display, 1 x HDMI 2.0a, 3 x DP 1.4 (2 from Type-C), TPM onboard, 12V~19V DC-In
    This product has multiple variants. The options may be chosen on the product page
  • LE 37O 2D8 1

    Commell LE-37O Tiger Lake Celeron 3.5″ SBC

    • Product Name: Commell LE-37O
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: Intel Tiger Lake UP3 Processor in the FCBGA1449 sockets
    • RAM: One DDR4 3200 MHz SO-DIMM up to 32 GB, support Non-ECC, unbuffered memory
    • Expansion: LVDS interface: Onboard 18/24-bit single/dual channel LVDS connector with +3.3V/+5V/+12V supply; Display port interface: Onboard Display port connector; HDMI interface: Onboard HDMI connector; VGA interface: Onboard VGA connector
    • Other features: LAN Interface: 1 x Intel i219-LM Gigabit PHY LAN (Support iAMT 15.0), 1 x Intel i225-LM Gigabit LAN (up to 2.5GbE)
  • LE 37O 2D8 1

    Commell LE-37O 3.5″ Tiger Lake i7 SBC

    • Product Name: Commell LE-37O
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: Intel Tiger Lake UP3 Processor in the FCBGA1449 sockets
    • RAM: One DDR4 3200 MHz SO-DIMM up to 32 GB, support Non-ECC, unbuffered memory
    • Expansion: LVDS interface: Onboard 18/24-bit single/dual channel LVDS connector with +3.3V/+5V/+12V supply; Display port interface: Onboard Display port connector; HDMI interface: Onboard HDMI connector; VGA interface: Onboard VGA connector
    • Other features: LAN Interface: 1 x Intel i219-LM Gigabit PHY LAN(Support iAMT 15.0), 1 x Intel i225-LM Gigabit LAN (up to 2.5GbE)
  • LP 179 2D8 NEW 1

    Commell LP-179 Pico-ITX Celeron Tiger Lake SBC

    • Product Name: Commell LP-179
    • System Type: Pico-ITX SBC
    • CPU: Onboard Intel Tiger Lake UP3 Processor (Celeron)
    • RAM: 1 x DDR4 SO-DIMM 3200 MHz up to 32GB
    • Expansion: 1 x M.2 2230 Key E, 1 x M.2 2280 Key M support PCIe Gen4, 1 x SATA3
    • Other features: Integrated DisplayPort, HDMI, 1 x Intel Gigabit PHY LAN, 1 x Intel 2.5 Gigabit LAN, 2 x USB2.0, 2 x USB3.2 Gen2, 2 x RS232, Support Watchdog Timer, Support 4K resolution, DC input 12V ±5%
  • GH551F200130R1 W600

    DFI GH551 AMD Ryzen V1000/R1000 Series 3.5″ SBC

    • Product Name: DFI GH551
    • Motherboard Form Factor: 3.5″ SBC
    • CPU: AMD Ryzen V1000/R1000 Series
    • RAM: 1 DDR4 2400MHz SODIMM up to 16GB
    • Expansion: Multiple displays: max. 4 DP++/3 DP++ + LVDS; Multiple Expansion: 1 M.2 M Key, 1 Mini PCIe
    • Other features: Rich I/O: 3 GbE, 2 USB 3.1 Gen2, 1 USB 2.0; 10-Year CPU Life Cycle Support Until Q1′ 31 (Based on AMD Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • TWLF51 1

    DFI TWLF51 1.8″ Intel N Series Industrial Pi SBC

    • DFI TWLF51: Compact 1.8″ SBC
    • Form Factor: Ultra-small 1.8″ SBC ideal for embedded and edge deployments
    • CPU:Intel Atom X Series and Intel N Series processors (Amston Lake / Twin Lake)
    • RAM: Onboard single-channel LPDDR5 memory with up to 8GB capacity
    • Expansion: 1 x M.2 E Key slot with optional I2C/SMBus support
    • Other Features: HDMI 2.0 supporting up to 4K @ 60Hz, 1 x Intel GbE LAN, 1 x COM, 2 x USB 3.2 Gen 2, 2 x USB 2.0, Micro HDMI, and DIO support
    This product has multiple variants. The options may be chosen on the product page
  • RC300 CS SideIO200729R2 w600

    DFI VC300-CS AI-Enabled 5G MXM In-Vehicle PC

    • Product Name: DFI VC300-CS
    • System Type: AI-Enabled 5G MXM In-Vehicle PC
    • CPU: 8th/9th Generation Intel Core Processors
    • RAM: Dual Channel DDR4 2666/2400 MHz by SODIMMs up to 64GB
    • Expansion: 4 x 802.3af POE Ports, Multiple Expansion Slots for 3G/LTE/5G Cellular Support
    • Other features: AI Accelerated: Up to 110W GPU MXM Module Supported, Extended Operating Temperature: -25°C to 70°C, Support 5G Communication, 15-Year CPU Life Cycle Support Until Q1′ 34 (Based on Intel IOTG Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • COM101 BAT Front Website

    DFI COM101-BAT Mini-ITX – COMe Basic/Compact Carrier Board

    • Product Name: DFI COM101-BAT
    • Motherboard Form Factor: Mini-ITX
    • CPU: Supports COMe Basic/Compact modules
    • RAM: Supports Compact/Basic modules
    • Expansion: Multiple displays (1 DP, 1 LVDS, 1 VGA)
    • Other features: Rich I/O (1 GbE, 6 USB)
  • COM332 B Front Website

    DFI COM332-B(R.A) Micro-ATX – COMe Basic/Compact Carrier Board

    • Product Name: DFI COM332-B
    • Motherboard Form Factor: Micro-ATX
    • CPU: Supports COMe Basic/Compact modules
    • RAM: Supports Compact and Basic modules
    • Expansion: Multiple displays (VGA, LVDS, DP, eDP)
    • Other features: Rich I/O (1 GbE, 4 USB 3.0, 4 USB 2.0)
  • COM332 BF070801w600

    DFI COM332-B(R.B1) Micro-ATX – COMe Basic/Compact Carrier Board

    • Product Name: DFI COM332-B
    • Motherboard Form Factor: Micro-ATX
    • CPU: Supports COMe Basic/Compact modules
    • RAM: Supports Compact and Basic modules
    • Expansion: Multiple displays (VGA, LVDS, DP, eDP)
    • Other features: Rich I/O (1 GbE, 4 USB 3.1, 4 USB 2.0)
  • COM333 Front Website

    DFI COM333-I Micro-ATX – COMe Basic/Compact Carrier Board

    • Product Name: DFI COM333-I
    • Motherboard Form Factor: Micro-ATX
    • CPU: Supports COMe Basic/Compact modules
    • RAM: Supports Compact and Basic modules
    • Expansion: Multiple expansion (8 PCIe x4 or 4 PCIe x8, 2 SATA 3.0)
    • Other features: Rich I/O (2 GbE, 4 10Gbase-KR, 4 USB 3.0/2.0, 1 COM)
  • RC300 CS Front200721 w600

    DFI RC-300-CS AI-Enabled 5G MXM Railway System

    • Product Name: DFI RC-300-CS
    • System Type: Railway System
    • CPU: 8th/9th Generation Intel Core Processors
    • RAM: Dual Channel DDR4 2666/2400 MHz by SODIMMs up to 64GB
    • Expansion: Multiple Expansion Slots for 3G/LTE/5G Cellular Support
    • Other features: AI-Enabled, 4 x M12 X-coded PoE Ports at 15W, AI Accelerated: Up to 110W GPU MXM Module Supported, Extended Operating Temperature: -25°C to 70°C Operation without Active Fan, Support 5G Communication, 15-Year CPU Life Cycle Support Until Q2′ 34 (Based on Intel IOTG Roadmap)
    This product has multiple variants. The options may be chosen on the product page
  • CS551B191017R1w600

    DFI CS551 Intel 8th/9th Gen Coffee Lake iCore 3.5″ SBC

    • Product Name: DFI CS551 3.5″ SBC
    • Motherboard Form Factor: 3.5″
    • CPU: 9th/8th Gen Intel Core with Intel C246
    • RAM: 1 DDR4 SODIMM up to 32GB
    • Expansion: Three independent displays: LVDS + DP++ + DP++; Multiple expansion: 1 M.2 M Key, 1 Mini PCIe
    • Other features: DP++ resolution up to 4096×2304 @ 60Hz; Rich I/O: 2 Intel GbE, 4 USB 3.1, 2 USB 2.0; 15-Year CPU Life Cycle Support Until Q1′ 35 (Based on Intel IOTG Roadmap)